Invited Session on HETEROGENEOUS INTEGRATION ROADMAP - WLP TWG. Outline: WLP Technical Working Group; Our Focus Area; WLP Market Drivers; Industry Trends & Challenges; and Future work & Acknowledgments.

Wafer Level Packaging, WLP, WLCSP, Fan Out, Heterogeneous Integration, FOSiP
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© 2019 International Microelectronics Assembly and Packaging Society
2019