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Packaging Challenges for the Next Generation of Mobile Devices

International Symposium on Microelectronics (2017) 2017 (S1): 000001–000023.
This article has been cited by the following articles in journals that are participating in CrossRef Cited-by Linking.
  • Zongying Liu
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Applied Soft Computing (2019) 75: 494.
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  • Basil Milton
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International Symposium on Microelectronics (2018) 2018 (1): 000583.
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