Volume 2011 Issue 1 | International Symposium on Microelectronics

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Oxide Liner, Barrier and Seed Layers, and Cu-Plating of Blind Through Silicon Vias (TSVs) on 300mm Wafers for 3D IC Integration

Chien-Ying Wu; Shang-Chun Chen; Pei-Jer Tzeng; John H. Lau; Yi-Feng Hsu; Jui-Chin Chen; Yu-Chen Hsin; Chien-Chou Chen; Shang-Hung Shen; Cha-Hsin Lin; Tzu-Kun Ku; Ming-Jer Kao

View Articletitled, Oxide Liner, Barrier and Seed Layers, and Cu-Plating of Blind Through Silicon Vias (TSVs) on 300mm Wafers for 3D IC Integration

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Use of Wafer Applied Underfill for 3D Stacking

Antonio La Manna; K. J. Rebibis; C. Gerets; E. Beyne

View Articletitled, Use of Wafer Applied Underfill for 3D Stacking

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A Path Toward Non-Destructive 3D Metrology for Through-Silicon Vias

Jeff Gelb; LayWai Kong; Luke Hunter; Allen Gu; Tiffany Fong; Alain C. Diebold; S. H. Lau; Wenbing Yun

View Articletitled, A Path Toward Non-Destructive 3D Metrology for Through-Silicon Vias

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Thermal Performance of 3D IC Integration with Through-Silicon Via (TSV)

Heng-Chieh Chien; John H. Lau; Yu-Lin Chao; Ra-Min Tain; Ming-Ji Dai; Sheng-Tsai Wu; Wei-Chung Lo; Ming-Jer Kao

View Articletitled, Thermal Performance of 3D IC Integration with Through-Silicon Via (TSV)

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Design and Fabrication of WLP Compatible Miniaturized Pressure Sensor System with Through Silicon Via (TSV) Interconnects

Tao WANG; Jian CAI; Qian WANG; Hao ZHANG; Zheyao WANG

View Articletitled, Design and Fabrication of WLP Compatible Miniaturized Pressure Sensor System with Through Silicon Via (TSV) Interconnects

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SerDes Design and Modeling over 25+ Gb/s Serial Link

Pervez M. Aziz; Adam Healey; Cathy Liu; Freeman Zhong; Alex Zabroda

View Articletitled, SerDes Design and Modeling over 25+ Gb/s Serial Link

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Studying the Impact of Return Current Path on the EM Simulation of High-speed Package Designs

Darryl Kostka; Antonio Ciccomancini Scogna

View Articletitled, Studying the Impact of Return Current Path on the EM Simulation of High-speed Package Designs

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An Innovative Printed Circuit Board Power Delivery Scheme

Zhenggang Cheng; Peter Gunadisastra; Amit Agrawal

View Articletitled, An Innovative Printed Circuit Board Power Delivery Scheme

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4-PAM System Simulation for 25 Gbps Designs

Sanjeev Gupta; Dingqing Lu; Konstantinos Kladopoulos

View Articletitled, 4-PAM System Simulation for 25 Gbps Designs

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Influence of film thicknesses on the electrical properties of RuO₂-thick film resistors on aluminum nitride ceramics (AlN)

Richard Schmidt; Christel Kretzschmar; Markus Eberstein

View Articletitled, Influence of film thicknesses on the electrical properties of RuO<sub>2</sub>-thick film resistors on aluminum nitride ceramics (AlN)

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Transfer molding technology for smart power electronics modules - materials and processes

K.-F. Becker; D. Joklitschke; T. Braun; M. Koch; T. Thomas; T. Schreier-Alt; V. Bader; J. Bauer; T. Nowak; O. Bochow-Ness; R. Aschenbrenner; M. Schneider-Ramelow; K.-D. Lang

View Articletitled, Transfer molding technology for smart power electronics modules - materials and processes

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Modifiable Silicones for Harsh Environments

Michelle Velderrain; Matthew Lindberg

View Articletitled, Modifiable Silicones for Harsh Environments

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How Silver Powder Metallurgy Affects the Physical Properties of Low Temperature Firing Silver Conductor

Samson Shahbazi; Mark Challingsworth

View Articletitled, How Silver Powder Metallurgy Affects the Physical Properties of Low Temperature Firing Silver Conductor

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DNA Marking and Authentication: A unique, secure anti-counterfeiting program for the electronics industry

James A. Hayward, Sc.D, Ph.D; Janice Meraglia

View Articletitled, DNA Marking and Authentication: A unique, secure anti-counterfeiting program for the electronics industry

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Superhydrophobic Coatings on Electronic Components

Andrew Jones; Vinod Sikka

View Articletitled, Superhydrophobic Coatings on Electronic Components

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Automated Precision Assembly for High-Volume HB LEDs

Donald J. Beck; Jessica Sylvester

View Articletitled, Automated Precision Assembly for High-Volume HB LEDs

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Enhancing Reliability of LEDs and other Display Devices

Rakesh Kumar

View Articletitled, Enhancing Reliability of LEDs and other Display Devices

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Substrate Transfer for GaN based LEDs grown on Silicon

Nga P. Pham; Maarten Rosmeulen; Cindy Demeulemeester; Vasyl Motsnyi; Deniz S. Tezcan; Haris Osman

View Articletitled, Substrate Transfer for GaN based LEDs grown on Silicon

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Evaluation of Test Protocol for Eutectic Die Attach Using High Power LEDs

Amanda Hartnett; Seth Homer; Donald Beck; Daniel Evans, Jr.

View Articletitled, Evaluation of Test Protocol for Eutectic Die Attach Using High Power LEDs

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Heterogeneous integration – packaging on and in organic substrates

Karl-F. Becker; T. Braun; J. Bauer; L. Böttcher; A. Ostmann; B. Pahl; J. Haberland; C. Kallmayer; R. Aschenbrenner; M. Schneider-Ramelow; K.-D. Lang

View Articletitled, Heterogeneous integration – packaging on and in organic substrates

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Design and characterization of a biocompatible packaging concept for implantable electronic devices

Maaike Op de Beeck; Karen Qian; Paolo Fiorini; Karl Malachowski; Chris Van Hoof

View Articletitled, Design and characterization of a biocompatible packaging concept for implantable electronic devices

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Screen printed RFID antennas on low cost flexible substrates

Kamil Janeczek; Małgorzata Jakubowska; Grażyna Kozioł; Anna Młożniak; Janusz Sitek

View Articletitled, Screen printed RFID antennas on low cost flexible substrates

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LÉTI’S TWO STEP APPROACH IN THE DOMAIN OF 3D INTEGRATION

André Rouzaud; Nicolas Sillon; Mark Scannell; David Henry; T. Mourier

View Articletitled, LÉTI’S TWO STEP APPROACH IN THE DOMAIN OF 3D INTEGRATION

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The Road towards Fully Hybrid CMOS Imager Sensors.

Joeri De Vos; Anne Jourdain; Wenqi Zhang; Koen De Munck; Piet De Moor; Antonio La Manna

View Articletitled, The Road towards Fully Hybrid CMOS Imager Sensors.

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Packaging and Integration Concept for High-Performance and Cost-effective IQM-based Transmitter Module for 160 Gb/s Applications

G. Delrosso; B. Curran; M. Rothermund; U. Maaß; H. Oppermann; I. Ndip

View Articletitled, Packaging and Integration Concept for High-Performance and Cost-effective IQM-based Transmitter Module for 160 Gb/s Applications

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Quality and Reliability of 3D TSV Interposer and Fine Pitch Solder Micro-bumps for 28nm Technology

Bahareh Banijamali; Raghunandan Chaware; Suresh Ramalingam; Myongseob Kim

View Articletitled, Quality and Reliability of 3D TSV Interposer and Fine Pitch Solder Micro-bumps for 28nm Technology

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Embedded Capacitors on Silicon Interposers Enable Higher Frequency Applications

Sergey Savastiouk; James Hewlett; Phil Marcoux

View Articletitled, Embedded Capacitors on Silicon Interposers Enable Higher Frequency Applications

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Cost effective Precision 3D Glass Microfabrication for Electronic Packaging

Jeb H. Flemming; Kevin Dunn; James Gouker; Carrie Schmidt; Colin Buckley

View Articletitled, Cost effective Precision 3D Glass Microfabrication for Electronic Packaging

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Thin Wafer Handling of 300mm Wafer for 3D IC Integration

H. H. Chang; J. H. Lau; W. L. Tsai; C. H. Chien; P. J. Tzeng; C. J. Zhan; C. K. Lee; M. J. Dai; H. C. Fu; C. W. Chiang; T. Y. Kuo; Y. H. Chen; T. H. Chen; T. K. Ku; W. C. Lo; M. J. Kao

View Articletitled, Thin Wafer Handling of 300mm Wafer for 3D IC Integration

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An Electrical Testing Method for Blind Through Silicon Vias (TSVs) for 3D IC Integration

Shyh-Shyuan Sheu; Zue-Hua Lin; Jui-Feng Hung; John H. Lau; Peng-Shu Chen; Shih-Hsien Wu; Keng-Li Su; Chih-Sheng Lin; Shinn-Juh Lai; Tzu-Kun Ku; Wei-Chung Lo; Ming-Jer Kao

View Articletitled, An Electrical Testing Method for Blind Through Silicon Vias (TSVs) for 3D IC Integration

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Extreme Temporary Coatings and Adhesives for High-Thermal, Low-Pressure, and Low-Stress 3D-Processing

Jared Pettit; John Moore

View Articletitled, Extreme Temporary Coatings and Adhesives for High-Thermal, Low-Pressure, and Low-Stress 3D-Processing

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Applicability of Existing Reliability Models: Focus on Finite Element Modeling of Various BGA Package Designs and Materials

Ali Fallah-Adl; Amaneh Tasooji; Ravi Mahajan; Nachiket Raravikar; Richard Harries; Sandeep Sane

View Articletitled, Applicability of Existing Reliability Models: Focus on Finite Element Modeling of Various BGA Package Designs and Materials

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Case Study: Radial Cracks in a Rigid-Flex Assembly

Christopher Matsuoka

View Articletitled, Case Study: Radial Cracks in a Rigid-Flex Assembly

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High resolution analyzes of resistance behavior in eWLB metal contacts

S. Klengel (Bennemann); M. Krause; L. Berthold; M. Petzold; J. Förster; K. Pressel; T. Meyer

View Articletitled, High resolution analyzes of resistance behavior in eWLB metal contacts

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Bond Over Active Circuitry Design for Reliability

Stevan Hunter; Jose Martinez; Cesar Salas; Marco Salas; Jason Schofield; Steven Sheffield; Kyle Wilkins; Bryce Rasmussen; Troy Ruud; Jim Workman

View Articletitled, Bond Over Active Circuitry Design for Reliability

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APPLICATIONS OF SOLDER PREFORMS TO IMPROVE RELIABILITY

Carol Gowans; Seth Homer; Ronald Lasky, PhD, PE

View Articletitled, APPLICATIONS OF SOLDER PREFORMS TO IMPROVE RELIABILITY

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Analysis and Control of Interface Reactions in Microelectronic Systems

J.H. Perepezko; S.D. Imhoff; R. Sakidja

View Articletitled, Analysis and Control of Interface Reactions in Microelectronic Systems

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Simulation of Huge Data Processing via Large Matrix Manipulation Using Hilbert Engine

An Dang; Joan Delalic; Son Nguyen; Bjorn Gruenwald; Yuk Lai; Hoi Man Chang

View Articletitled, Simulation of Huge Data Processing via Large Matrix Manipulation Using Hilbert Engine

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Design and Process Implementation for Embedding Components

Vern Solberg

View Articletitled, Design and Process Implementation for Embedding Components

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ToF-SIMS Analysis of Fiberglass Cloths for PCB Manufacturing

Dylan Boday; Michael Haag; Joe Kuczynski; Markus Schmidt; Michael Wahl; Johannes Windeln

View Articletitled, ToF-SIMS Analysis of Fiberglass Cloths for PCB Manufacturing

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Making Sense of Laminate Dielectric Properties

Rich Pangier; Michael J. Gay

View Articletitled, Making Sense of Laminate Dielectric Properties

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Very High Lead Count SMT Backplane Connector Rework Process: Recognizing the Challenges

Jim Bielick; Mitchell G. Ferrill; Eddie Kobeda; Theron Lewis

View Articletitled, Very High Lead Count SMT Backplane Connector Rework Process: Recognizing the Challenges

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Single Probe for Bare Board Continuity and Isolation Testing

Abdelghani Renbi; Jerker Delsing

View Articletitled, Single Probe for Bare Board Continuity and Isolation Testing

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Improvement of Rated Power and VSWR Characteristics for Termination Resistor with Integrated Matching Network and Efficient Thermal Management

Akhlaq Rahman; Fred Olinger

View Articletitled, Improvement of Rated Power and VSWR Characteristics for Termination Resistor with Integrated Matching Network and Efficient Thermal Management

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High Melting Temperature Lead Free Solder for Die Attach Application

Jianxing Li; Daniel Lau; Pingliang Tu; Andrew Delano; Brian Knight

View Articletitled, High Melting Temperature Lead Free Solder for Die Attach Application

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Mechanical Robustness of Solder Connections to Thick Film Gold

Thomas F. Marinis; Joseph W. Soucy

View Articletitled, Mechanical Robustness of Solder Connections to Thick Film Gold

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Suppression of Kirkendall voiding in Sn-3.5Ag/Cu solder joints by pre-annealing process

S. H. Kim; Jin Yu

View Articletitled, Suppression of Kirkendall voiding in Sn-3.5Ag/Cu solder joints by pre-annealing process

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Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes

Cheryl Tulkoff; Greg Caswell

View Articletitled, Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes

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Interference of Sb(III) in the Determination of Hexavalent Chromium in Thermoplastic Matrices

Sophia S. Lau; Joe P. Kuczynski

View Articletitled, Interference of Sb(III) in the Determination of Hexavalent Chromium in Thermoplastic Matrices

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Fabrication of an electrostatically actuated impingement cooling device

B. Majeed; B. Jones; H. Oprins; B. Vandevelde; D. S. Tezcan; P. Fiorini

View Articletitled, Fabrication of an electrostatically actuated impingement cooling device

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Thermal and Mechanical Characterization of High Power GaN Packages

Don Willis; Gary Gu; Daniel Jin; Rob Dry

View Articletitled, Thermal and Mechanical Characterization of High Power GaN Packages

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Piezoelectric Nanogenerators for Mechanical Energy Harvesting

Xudong Wang

View Articletitled, Piezoelectric Nanogenerators for Mechanical Energy Harvesting

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Development of Laser Direct Ablation Process on Solder Resist in Printed Circuit Boards

Changbo Lee; Daejo Hong; Suil Kim; Cheolho Choi; ChangSup Ryu

View Articletitled, Development of Laser Direct Ablation Process on Solder Resist in Printed Circuit Boards

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Embedded Actives and Its Industry Effects

Ray Fillion

View Articletitled, Embedded Actives and Its Industry Effects

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ASSESSMENT AND CHARACTERIZATION OF STRESS INDUCED BY VIA-FIRST TSV TECHNOLOGY

G. Parès; F. De Crecy; S. Moreau; C. Maurice; A Borbely; J. Mazuir; L.L. Chapelon; N. Sillon

View Articletitled, ASSESSMENT AND CHARACTERIZATION OF STRESS INDUCED BY VIA-FIRST TSV TECHNOLOGY

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Topography and Deformation Measurement as a new Tool for Thermal Stress Assessment on Electronics Components

Michael Hertl

View Articletitled, Topography and Deformation Measurement as a new Tool for Thermal Stress Assessment on Electronics Components

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Location of the Critical Solder Joint of a PBGA under Temperature Cycling Load for SAC and SnPb Solder. Results of Experiments vs. FE-Simulations on System and Board Level.

Natalja Schafet; Bruno Schrempp; Manfred Spraul; Ulrich Becker; Herbert Güttler

View Articletitled, Location of the Critical Solder Joint of a PBGA under Temperature Cycling Load for SAC and SnPb Solder. Results of Experiments vs. FE-Simulations on System and Board Level.

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Overview on Thermal and Mechanical Challenges of High Power RF Electronic Packaging

Cadmus Yuan; René Kregting; Willem van Driel; Sander Gielen; An Xiao; G. Q. (Kouchi) Zhang

View Articletitled, Overview on Thermal and Mechanical Challenges of High Power RF Electronic Packaging

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Technologies and Trends to Improve Power Electronic Packaging

M. Schneider-Ramelow; M. Hutter; H. Oppermann; J.-M. Göhre; S. Schmitz; E. Hoene; K.-D. Lang

View Articletitled, Technologies and Trends to Improve Power Electronic Packaging

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High temperature Au-based solder reliability in electronic packages for harsh environments

M.F. Sousa; S. Riches; C. Johnston; P.S. Grant

View Articletitled, High temperature Au-based solder reliability in electronic packages for harsh environments

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Feasibility Study of a 3D IC Integration System-in-Packaging (SiP) from a 300mm Multi-Project Wafer (MPW)

J. H. Lau; C-J Zhan; P-J Tzeng; C-K Lee; M-J Dai; H-C Chien; Y-L Chao; W. Li; S-T Wu; J-F Hung; R-M Tain; C-H Lin; Y-C Hsin; C-C Chen; S-C Chen; C-Y Wu; J-C Chen; C-H Chien; C-W Chiang; H-H Chang; W-L Tsai; R-S Cheng; S-Y Huang; Y-M Lin; T-C Chang; C-D Ko; T-H Chen; S-S Sheu; S-H Wu; Y-H Chen ...

View Articletitled, Feasibility Study of a 3D IC Integration System-in-Packaging (SiP) from a 300mm Multi-Project Wafer (MPW)

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Epoxy Flux – A Low Cost High Reliability Approach for PoP Assembly

Ning-Cheng Lee

View Articletitled, Epoxy Flux – A Low Cost High Reliability Approach for PoP Assembly

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3D-stacking of UTCPs as a module miniaturization technology

S. Priyabadini; A. Gielen; K. Dhaenens; W. Christiaens; S. Van Put; G. Kunkel; A.E. Petersen; J. Vanfleteren

View Articletitled, 3D-stacking of UTCPs as a module miniaturization technology

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Z-axis Interconnections for Next Generation Packaging

Rabindra N. Das; Frank D. Egitto; John M. Lauffer; Tim Antesberger; Voya R. Markovich

View Articletitled, Z-axis Interconnections for Next Generation Packaging

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Fully Additive Chip Packaging: Science or Fiction?

Gerrit Oosterhuis; Ben van der Zon; Hessel Maalderink; Par Dunias

View Articletitled, Fully Additive Chip Packaging: Science or Fiction?

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MEMS Packaging with 3D-MID Technology

Nouhad Bachnak

View Articletitled, MEMS Packaging with 3D-MID Technology

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IC Bond Pad Structural Study by “Ripple Effect”

Jose Martinez; Cesar Salas; Marco Salas; Jason Schofield; Steven Sheffield; Kyle Wilkins; Stevan Hunter

View Articletitled, IC Bond Pad Structural Study by “Ripple Effect”

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Developments in Stencil Printing Technology for 0.3mm Pitch CSP Assembly

Mark Whitmore; Clive Ashmore

View Articletitled, Developments in Stencil Printing Technology for 0.3mm Pitch CSP Assembly

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A First Room Temperature Stable and Jetable Solder Joint Encapsulant Adhesive

Mary Liu; Wusheng Yin

View Articletitled, A First Room Temperature Stable and Jetable Solder Joint Encapsulant Adhesive

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A STUDY OF SURFACE FINISHES FOR IC SUBSTRATES AND WIRE BOND APPLICATIONS

John Ganjei, PhD; Ernest Long, Ph.D.; Lenora Toscano

View Articletitled, A STUDY OF SURFACE FINISHES FOR IC SUBSTRATES AND WIRE BOND APPLICATIONS

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NanoBond® Assembly – A Rapid, Room Temperature Soldering Process

Jacques Matteau

View Articletitled, NanoBond® Assembly – A Rapid, Room Temperature Soldering Process

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Three-Dimensional Surface in LTCC for a MM-Wave Antenna

Peter Uhlig; Sybille Holzwarth; Bahram Sanadgol; Alexandra Serwa

View Articletitled, Three-Dimensional Surface in LTCC for a MM-Wave Antenna

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Materials Interaction in Cofired Platinum /Alumina High Density Feedthrough for Implantable Neurostimulator Applications

Ali Karbasi; W. Kinzy Jones

View Articletitled, Materials Interaction in Cofired Platinum /Alumina High Density Feedthrough for Implantable Neurostimulator Applications

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Localized Temperature Stability in A Multilayer LTCC Package

Steve Dai

View Articletitled, Localized Temperature Stability in A Multilayer LTCC Package

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Introducing DuPont^™ GreenTape^™ 9K5 Low Dielectric Constant, Low Temperature Co-Fired Ceramic (LTCC) Tape System

Deepukumar M. Nair; James Parisi; K.M. Nair; Mark McCombs; Michael Smith; Elizabeth Hughes; Ken Souders; Anthony Orzel; Bradley Thrasher; Stephen C. Beers; J.C. Malerbi; Scott Gordon

View Articletitled, Introducing DuPont<sup>™</sup> GreenTape<sup>™</sup> 9K5 Low Dielectric Constant, Low Temperature Co-Fired Ceramic (LTCC) Tape System

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Towards highly conductive silver pastes for LTCC power electronics

Markus Eberstein; Christel Kretzschmar; Thomas Seuthe; Manja Marcinkowski; Martin Ihle; Steffen Ziesche; Uwe Partsch; Frieder Gora

View Articletitled, Towards highly conductive silver pastes for LTCC power electronics

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Robustness and Versatility of Thin Films on Low Temperature Cofired Ceramic (LTCC)

J. A. Wolf; K. A. Peterson; P. T. Vianco; M. H. Johnson; S. Goldammer

View Articletitled, Robustness and Versatility of Thin Films on Low Temperature Cofired Ceramic (LTCC)

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Ageing characteristics of Cu Wire Bonds on Palladium Surface Finishes

Mustafa Oezkoek; Horst Clauberg; Hugh Roberts

View Articletitled, Ageing characteristics of Cu Wire Bonds on Palladium Surface Finishes

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Which Frequency is Best for Wirebonding?

Josef Sedlmair; Farhad Farassat; Franz Schlicht

View Articletitled, Which Frequency is Best for Wirebonding?

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Why Wedge Bond?

Joe Bubel; Lee Levine

View Articletitled, Why Wedge Bond?

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Comparison of Gold and Copper Wire Bonding on Aluminum and Nickel-Palladium-Gold Bond Pads for Automotive Application

Tu Anh Tran; Varughese Mathew; Harold Downey

View Articletitled, Comparison of Gold and Copper Wire Bonding on Aluminum and Nickel-Palladium-Gold Bond Pads for Automotive Application

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Packaging Technology of Multi Deflection Arrays for Multi-Shaped Beam Lithography

T. Burkhardt; M. Mohaupt; M. Hornaff; B. Zaage; E. Beckert; H.-J. Döring; M. Slodowski; K. Reimer; M. Witt; R. Eberhardt; A. Tünnermann

View Articletitled, Packaging Technology of Multi Deflection Arrays for Multi-Shaped Beam Lithography

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High Thermal-Transient Packaging for a SiC-Based Solid State Circuit Breaker

Theodore Baltis; Douglas C Hopkins; James M Pitaressi; Donald R Hazelmyer

View Articletitled, High Thermal-Transient Packaging for a SiC-Based Solid State Circuit Breaker

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Mechanical Stress Impact of Assembly Processes onto a Stress-sensitive Testchip

H. Theuss; K. Elian; M. Fink; M. Fries; F.-P. Kalz; B. Schwabe; M. Vaupel; C. Jaroschek; A. Schubert; H. Hummel; O. Steffens

View Articletitled, Mechanical Stress Impact of Assembly Processes onto a Stress-sensitive Testchip

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Vacuum Packaging for High-Performance Low Cost MEMS Gyro Used in 6 Degree of Freedom Inertial Navigation System (DOF INS)

D. DeRoo; K. Shcheglov; M. Inbar; D. Smukowski; P. Zappella; P. Barnes

View Articletitled, Vacuum Packaging for High-Performance Low Cost MEMS Gyro Used in 6 Degree of Freedom Inertial Navigation System (DOF INS)

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MEMS Integrated Packaging for RF Circuit Testing and Self Calibration

Sukeshwar Kannan; Bruce Kim; Naga Sai Evana; Anurag Gupta; Seok-Ho Noh

View Articletitled, MEMS Integrated Packaging for RF Circuit Testing and Self Calibration

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Design, Development and Qualification of 64 Channel Hybrid Analog Multiplexer for Space applications

Krishnaprasad; Gayathrikumari; Santosh Joteppa; Satyanarayana Prasad; Vinod Chippalkatti; Amul Patel; J C Karelia; KG Domadia; RM Parmar

View Articletitled, Design, Development and Qualification of 64 Channel Hybrid Analog Multiplexer for Space applications

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Through Silicon Vias and Holes Metallization using CoWP and Cu Nanoparticles as Barrier and Seed Layers

Wei-Ping Dow; Shao-Ping Shen; Chun-Wei Lu; Yiu-Hsiang Chang; Motonobu Kubo; Tohru Kamitamari; Eric Cheng; Jing-Yuan Lin; Fu-Chiang Hsu

View Articletitled, Through Silicon Vias and Holes Metallization using CoWP and Cu Nanoparticles as Barrier and Seed Layers

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Wafer Bumping and Characterizations of Fine-Pitch Lead-Free Solder Microbumps on 12” (300mm) wafer for 3D IC Integration

J. H. Lau; P-J Tzeng; C-K Lee; C-J Zhan; M-J Dai; Li Li; C-T Ko; S-W Chen; H. Fu; Y. Lee; Z. Hsiao; J. Huang; W. Tsai; P. Chang; S. Chung; Y. Hsu; S-C Chen; Y-H Chen; T-H Chen; W-C Lo; T-K Ku; M-J Kao; J. Xue; M. Brillhart

View Articletitled, Wafer Bumping and Characterizations of Fine-Pitch Lead-Free Solder Microbumps on 12” (300mm) wafer for 3D IC Integration

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Studies of Mesoscale Models Parameterized by Molecular Models for Interface Failure in Epoxy Molding Compounds

Nancy Iwamoto

View Articletitled, Studies of Mesoscale Models Parameterized by Molecular Models for Interface Failure in Epoxy Molding Compounds

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Advanced Thermal Study of Very High Power TSV Interposer and Interconnects for 28nm Technology FPGA

Bahareh Banijamali; Suresh Ramalingam; Raghunandan Chaware

View Articletitled, Advanced Thermal Study of Very High Power TSV Interposer and Interconnects for 28nm Technology FPGA

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Mix of analog and digital circuitry analysis in a noisy environment

Hugues Tournier; Kaisheng Hu; Shuhui Deng

View Articletitled, Mix of analog and digital circuitry analysis in a noisy environment

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Molding Flow Modeling and Experimental Study on Void Control for Flip Chip Package Panel Molding with Molded Underfill Technology

Jonathan Tamil; Siew Hoon Ore; Kian Yeow Gan; Yang Yong Bo; Geraldine Ng; Park Teck Wah; Nathapong Suthiwongsunthorn; Surasit Chungpaiboonpatana

View Articletitled, Molding Flow Modeling and Experimental Study on Void Control for Flip Chip Package Panel Molding with Molded Underfill Technology

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Thermal Performance of an Adhesive Bonded Superconducting Multichip Module (MCM) on a Gifford-McMahon Cryocooler

Ranjith John; Vladimir Dotsenko; Deepnarayan Gupta; Ajay Malshe

View Articletitled, Thermal Performance of an Adhesive Bonded Superconducting Multichip Module (MCM) on a Gifford-McMahon Cryocooler

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Solder Strength Characterization Using Hot Bump Pull Testing

Kevin O’Connell; Arv Sinha

View Articletitled, Solder Strength Characterization Using Hot Bump Pull Testing

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A Study of Solder Joint Failure Criteria

Jianbiao Pan, Ph.D.; Julie Silk

View Articletitled, A Study of Solder Joint Failure Criteria

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The Reliability Impact of Reballing COTS Pb-Free BGAs to Sn/Pb for Military Applications

Greg Caswell; Joelle Arnold

View Articletitled, The Reliability Impact of Reballing COTS Pb-Free BGAs to Sn/Pb for Military Applications

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The Mechanism of The Die Crack in exposed Pad Quad Flat Package(ePad QFP) with Large Die due to Die-attach Adhesive with high modulus

Jin-Ho Kim; Dong-Nam Kim; Young-Chul Jo; Nam-Yong Kim; Seung-Geun Kang; Byung-Ju Lee; Dal-Soo Kim; Tea-Seob Yun; Sung-Jun Kim

View Articletitled, The Mechanism of The Die Crack in exposed Pad Quad Flat Package(ePad QFP) with Large Die due to Die-attach Adhesive with high modulus

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Investigating Stress in Hybrid Electronic Packages Using White Light Surface Profilometry

Kelsey A. Folgner; Ching-Yao Tang; Michael J. O’Brien; Peter D. Fuqua

View Articletitled, Investigating Stress in Hybrid Electronic Packages Using White Light Surface Profilometry

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Mold Compound Adhesion Reliability with SiN and SiON Passivation

Varughese Mathew; Sheila Chopin; Trent Uehling; Ruzaini Ibrahim

View Articletitled, Mold Compound Adhesion Reliability with SiN and SiON Passivation

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Surface Properties of Laser-etched LTCC Ceramic

Krzysztof Zaraska; Janina Gaudyn; Adam Bieńkowski; Andrzej Czerwiński; Mariusz Płuska

View Articletitled, Surface Properties of Laser-etched LTCC Ceramic

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Bulk and In-Circuit Dielectric Characterization of LTCC Tape Systems Through Millimeter Wave Frequency Range

Bradley Thrasher; Deepukumar Nair; James Parisi; Glenn Oliver; Michael A. Smith

View Articletitled, Bulk and In-Circuit Dielectric Characterization of LTCC Tape Systems Through Millimeter Wave Frequency Range

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Sputter deposition of thin film MIM capacitors on LTCC substrates for RF bypass and filtering applications

Jack Murray; Wayne Huebner; Matthew J. O’Keefe; Kristina Wilder; Ryan Eatinger; William Kuhn; Daniel S. Krueger; J. Ambrose Wolf

View Articletitled, Sputter deposition of thin film MIM capacitors on LTCC substrates for RF bypass and filtering applications

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Strength and Reliability Estimation of a Low Temperature Co-Fired Ceramic (LTCC) With and Without Metallic Features

Rajan Tandon; Clay S. Newton

View Articletitled, Strength and Reliability Estimation of a Low Temperature Co-Fired Ceramic (LTCC) With and Without Metallic Features

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Electromagnetic Isolation Solutions in Low Temperature Cofired Ceramic (LTCC)

Daniel Krueger; Ken Peterson; Laurie Euler

View Articletitled, Electromagnetic Isolation Solutions in Low Temperature Cofired Ceramic (LTCC)

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A Novel Design of a Planar SOFC with the Anode Supported on the Base Ceramic Structure

Barbara Dziurdzia; Zbigniew Magonski

View Articletitled, A Novel Design of a Planar SOFC with the Anode Supported on the Base Ceramic Structure

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Properties and Reliability of Silicon Nitride Substrates with AMB Copper Conductor

Böhm Gaby; Brunner Dieter; Sichert Ina; Pönicke Andreas; Schilm Jochen

View Articletitled, Properties and Reliability of Silicon Nitride Substrates with AMB Copper Conductor

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Use of Polyalkylene Carbonate Binders for Improved Performance in Multilayer Ceramic Capacitors

Peter Ferraro; Sugianto Hanggodo; Ian Burn; Amanda Baker; Weiguo Qu

View Articletitled, Use of Polyalkylene Carbonate Binders for Improved Performance in Multilayer Ceramic Capacitors

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Materials Selection and Processing Techniques for Small Spacecraft Solar Cell Arrays

N. Meetra Torabi; Janet K. Lumpp; James E. Lumpp, Jr.

View Articletitled, Materials Selection and Processing Techniques for Small Spacecraft Solar Cell Arrays

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ELECTRICAL BEHAVIOR OF A DOUBLE SIDED PV SOLAR PANEL

V. Ganescu, PhD; R. Shoaff; A. Pascu, PhD

View Articletitled, ELECTRICAL BEHAVIOR OF A DOUBLE SIDED PV SOLAR PANEL

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Electrical Performance of Advanced Surface Laminar Circuit in High-end FCBGA Applications

Makoto Shiroshita; Satoshi Nakamura; Kenji Terada; Kimihiro Yamanaka

View Articletitled, Electrical Performance of Advanced Surface Laminar Circuit in High-end FCBGA Applications

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Build-up Electrical Insulation Material with Low-Dielectric Loss Tangent, Low-CTE and Low-Surface Roughness

Eita HORIKI; Isao SUZUKI; Toshiaki TANAKA; Akihiro UENISHI; Hiroshi KOUYANAGI

View Articletitled, Build-up Electrical Insulation Material with Low-Dielectric Loss Tangent, Low-CTE and Low-Surface Roughness

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High-quality multiple global layers on chip-redistributed wafer for wafer-level system integration using pseudo-SOC

Atsuko IIDA; Yutaka ONOZUKA; Hiroshi YAMADA; Toshihiko NAGANO; Kazuhiko ITAYA

View Articletitled, High-quality multiple global layers on chip-redistributed wafer for wafer-level system integration using pseudo-SOC

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Microstructure Observation of Electromigration Behavior in Peripheral C2 Flip Chip Interconnection with Solder Capped Cu Pillar Bump

Yasumitsu Orii; Kazushige Toriyama; Sayuri Kohara; Hirokazu Noma; Keishi Okamoto; Daisuke Toyoshima; Keisuke Uenishi

View Articletitled, Microstructure Observation of Electromigration Behavior in Peripheral C2 Flip Chip Interconnection with Solder Capped Cu Pillar Bump

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Optoelectronic Substrate With High-Aspect-Ratio Optical Through-Hole for Chip-to-Chip Interconnects

Atsushi Suzuki; Yutaka Takagi; Toshikazu Horio; Toshifumi Kojima; Toshikatsu Takada; Satoshi Iio; Masahiko Okuyama

View Articletitled, Optoelectronic Substrate With High-Aspect-Ratio Optical Through-Hole for Chip-to-Chip Interconnects

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Resistance Brazing of Alumina Ceramic to Titanium Using Pure Gold

Mohammad Siddiqui; W. Kinzy Jones

View Articletitled, Resistance Brazing of Alumina Ceramic to Titanium Using Pure Gold

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An Innovative High Thermal Conductive Solderable Adhesive

Mary Liu; Wusheng Yin

View Articletitled, An Innovative High Thermal Conductive Solderable Adhesive

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Low temperature reliability of carbon nanotube/silicone superhydrophobic coatings

Yoonchul Sohn; Sangeui Lee; Dongouk Kim; Kunmo Chu; Dongun Kim; Hajin Kim; Intaek Han

View Articletitled, Low temperature reliability of carbon nanotube/silicone superhydrophobic coatings

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Hardware Design for Multiple Gas Detection System Using Zeolite Coated with Nile Red

Son Nguyen; Z. Joan Delalic; David M. Kargbo; Joel B. Sheffield; Zameer Hasan

View Articletitled, Hardware Design for Multiple Gas Detection System Using Zeolite Coated with Nile Red

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Finding “The Buffy” Talent Acquisition and Retention in Today’s Market

Patrick J. G. Troy

View Articletitled, Finding <em>“The Buffy”</em> Talent Acquisition and Retention in Today’s Market

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Mobile Device Passive Integration from Wafer Process

Kai Liu; YongTaek Lee; HyunTai Kim; MaPhooPwint Hlaing

View Articletitled, Mobile Device Passive Integration from Wafer Process

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RF Sensitivity of Multi Chip Package Development by Using Embedded Resistor in Package Substrate

Woong-Sun Lee; Sang-Joon Lim; Heung-Jae Shin; Jong-Tae Lee; Jung-Kwon Park; Qwan-Ho Chung; Kwang-Yoo Byun

View Articletitled, RF Sensitivity of Multi Chip Package Development by Using Embedded Resistor in Package Substrate

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Impact of PCB Manufacturing Process Variations on Trace Impedance

Abdelghani Renbi; Johan Carlson; Jerker Delsing

View Articletitled, Impact of PCB Manufacturing Process Variations on Trace Impedance

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GaN based RF Modules - Demands & Needs for Packaging

M. Oppermann; K. Widmer; R. Reber; H. Sledzik; P. Schuh; U. Schmid; B. Bunz; S. Chartier; K. Drüeke; M. Bedenbecker

View Articletitled, GaN based RF Modules - Demands & Needs for Packaging

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Zero-Power MEMS Sensor Actuated RFID System

Yang Zhang; Kerchia Chen; Sean Burke; Scott McLaughlin; G. P. Li; Mark Bachman; Dennis Rieger; Winston Ho

View Articletitled, Zero-Power MEMS Sensor Actuated RFID System

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Comparison Between Multilayer Ceramic and Organic Package Substrates Based Upon Signal and Power Integrity

Jerry Aguirre; Paul Garland; Marcos Vargas; Heather Tallo; Joseph Tallo

View Articletitled, Comparison Between Multilayer Ceramic and Organic Package Substrates Based Upon Signal and Power Integrity

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Impact of Process Tolerances on the Performance of Bond Wire Antennas at RF/Microwave Frequencies

Ivan Ndip; Abdurrahman Öz; Christian Tschoban; Stefan Schmitz; Martin Schneider-Ramelow; Stephan Guttowski; Herbert Reichl; Klaus-Dieter Lang

View Articletitled, Impact of Process Tolerances on the Performance of Bond Wire Antennas at RF/Microwave Frequencies

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Rated Power Enhancement of Termination Resistor by Employing Innovative Thermal Management Techniques

Akhlaq Rahman; Fred Olinger; Michael Howieson

View Articletitled, Rated Power Enhancement of Termination Resistor by Employing Innovative Thermal Management Techniques

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Power Efficiency Improvement for Low Ohm Current Sense Resistor by Optimum Thermal Management

Akhlaq Rahman; Fred Olinger

View Articletitled, Power Efficiency Improvement for Low Ohm Current Sense Resistor by Optimum Thermal Management

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Optimization of a Flux-Less Metal Thermal Interface Material by Reflow in a Vacuum Furnace

Pierino I Zappella; Paul W Barnes; David Muhs; Bruce Wilson

View Articletitled, Optimization of a Flux-Less Metal Thermal Interface Material by Reflow in a Vacuum Furnace

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Meter for the measurement heat of combustion

Zbigniew Magonski

View Articletitled, Meter for the measurement heat of combustion

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Simultaneous Characterization of Theta-JC and Theta-JB Using Through-Package 1-D Heat Flow

Jichul Kim; Jae Choon Kim; Mina Choi; Eunseok Cho; Hyunggil Baek; HoGeon Song; Sayoon Kang

View Articletitled, Simultaneous Characterization of Theta-JC and Theta-JB Using Through-Package 1-D Heat Flow

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Wafer Level Solder Bumping and Flip Chip Assembly with Solder Balls Down to 30μm

Thomas Oppert; Rainer Dohle; Jörg Franke; Stefan Härter

View Articletitled, Wafer Level Solder Bumping and Flip Chip Assembly with Solder Balls Down to 30μm

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Surface Energy and Wettability Study of Flip Chip Packaging Materials

Jinlin Wang

View Articletitled, Surface Energy and Wettability Study of Flip Chip Packaging Materials

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“IC Packaging Trends Causing Concerns in Complete Flux Removal”

Rich Brooks

View Articletitled, “IC Packaging Trends Causing Concerns in Complete Flux Removal”

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Evaluation of electromigration in flip-chip solder joints

Hyun-Kyu Lee; Yong-Chul Chu; Myung-Ho Chun; Sang-Ho Jeon; Jung-Ug Kwak; Seung-Jin Lee; Sung-Mun Bae

View Articletitled, Evaluation of electromigration in flip-chip solder joints

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Accelerated Life Tests of Flip-Chips With Solder Bumps Down to 30 μm Diameter

Rainer Dohle; Stefan Härter; Jörg Goßler; Jörg Franke

View Articletitled, Accelerated Life Tests of Flip-Chips With Solder Bumps Down to 30 μm Diameter

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Electro-migration Behavior in Micro-joints of Sn-57Bi solder and Cu Post Bumps

Kei Murayama; Taiji Sakai; Nobuaki Imaizumi; Mitsutoshi Higashi

View Articletitled, Electro-migration Behavior in Micro-joints of Sn-57Bi solder and Cu Post Bumps

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Direct Printing for Next Generation High Density Packaging

Xudong Chen; Kenneth Church

View Articletitled, Direct Printing for Next Generation High Density Packaging

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Printable Materials and Devices for Next Generation Packaging

Rabindra N. Das; How T. Lin; Jianzhuang Huang; John M. Lauffer; Mark D. Poliks; Voya R. Markovich

View Articletitled, Printable Materials and Devices for Next Generation Packaging

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CubeSat Fabrication through Additive Manufacturing and Micro-Dispensing

Cassie Gutierrez; Rudy Salas; Gustavo Hernandez; Dan Muse; Richard Olivas; Eric MacDonald; Michael D. Irwin; Ryan Wicker; Mike Newton; Ken Church; Brian Zufelt

View Articletitled, CubeSat Fabrication through Additive Manufacturing and Micro-Dispensing

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Aerosol Jet^® Printer as an Alternative to Wire Bond and TSV Technology for 3D Interconnect Applications

Michael J. O’Reilly; Jeff Leal; Suzette K. Pangrle; Kenneth Vartanian

View Articletitled, Aerosol Jet<sup>®</sup> Printer as an Alternative to Wire Bond and TSV Technology for 3D Interconnect Applications

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Pure Copper Solder Paste with Sub-200 °C Processing Temperature

Alfred A. Zinn; Frances Y. Chiu

View Articletitled, Pure Copper Solder Paste with Sub-200 °C Processing Temperature

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Photonic Curing Explanation and Application to Printing Copper Traces on Low Temperature Substrates

K. A. Schroder, Ph.D.; Ian M. Rawson; Dave S. Pope, Ph.D.; S. Farnsworth

View Articletitled, Photonic Curing Explanation and Application to Printing Copper Traces on Low Temperature Substrates

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High-Fidelity Optical Microphone Manufactured in Laminates

Jonas Tsai; Yang Zhang; G.P. Li; Mark Bachman

View Articletitled, High-Fidelity Optical Microphone Manufactured in Laminates

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TEMPORARY PROTECTIVE PACKAGING FOR OPTICAL MEMS

L. Bogaerts; A. Phommahaxay; C. Gerets; P. Jaenen; R. Van Hoof; S. Severi; M. Van De Peer; J. De Coster; R. Beernaert; S. Rudra; A. La Manna; P. Soussan; A. Witvrouw

View Articletitled, TEMPORARY PROTECTIVE PACKAGING FOR OPTICAL MEMS

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Near-Zero Shift Attachment for Optoelectronic Components

Roy J. Bourcier

View Articletitled, Near-Zero Shift Attachment for Optoelectronic Components

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Wafer Level Integration of MMIC and Microwave IPD with Metal/BCB Multilayer Interconnection Based on Low Resistance Silicon

Jiajie Tang; Le Luo

View Articletitled, Wafer Level Integration of MMIC and Microwave IPD with Metal/BCB Multilayer Interconnection Based on Low Resistance Silicon

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3D Packages and Assembly Methodologies

Bernd K Appelt

View Articletitled, 3D Packages and Assembly Methodologies

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Applications of 3D X-Ray Microscopy for Advanced Package Development

K. Fahey; R. Estrada; L. Mirkarimi; R. Katkar; D. Buckminster; M. Huynh

View Articletitled, Applications of 3D X-Ray Microscopy for Advanced Package Development

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