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Full Integration and Electrical Characterization of 3D Silicon Interposer Demonstrator Incorporating High Density TSVs and Interconnects
Ken Miyairi; Masahiro Sunohara; Jean Charbonnier; Myriam Assous; Jean-Philippe Bally; Robert Cuchet; Helene Feldis; Kei Murayama; Mitsuhiro Aizawa; Gilles Simon; Mitsutoshi Higashi
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Verification of Compartmental Electromagnetic Interference Shielding Effect with imprint-Through Mold Via (i-TMV) for RF modules
Motohiro Negishi, Tomoaki Shibata, Xinrong Li, Naoya Suzuki
Emergence of Glass Solutions for 5G and Heterogeneous Integration
Aric B. Shorey, Shelby F. Nelson, David Levy, Paul Ballentine
Fine-pitch Copper Pillar Flip Chips in High Reliability Applications
Catherine Farnum, Kaysar Rahim, Ph.D.
Highly accelerated lifetime testing in power electronics
Bernhard Czerny, Golta Khatibi
Implementation of Trusted Manufacturing & AI-based process optimization into microelectronic manufacturing research environments
K.-F. Becker, S. Voges, P. Fruehauf, M. Heimann, S. Nerreter, R. Blank, M. Erdmann, S. Gottwald, A. Hofmeister, M. Hesse, M. Thies, S. Mehrafsun, R. Fust, E. Beck, J. Pawlikowski, B. Schröder, C. Voight, T. Braun, M. Schneider-Ramelow