Volume 2015 Issue 1 | International Symposium on Microelectronics

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Temporary Bonding and Debonding Technologies to Enable Innovative Fan-Out Embedded Interposer for High-Density Applications

Alvin Lee; Jay Su; Xiao Liu; Yin-Po Hung; Yu-Min Lin; Shin-Yi Huang; Ren-Shin Cheng; Tao-Chih Chang

View Articletitled, Temporary Bonding and Debonding Technologies to Enable Innovative Fan-Out Embedded Interposer for High-Density Applications

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Advanced Chemical Processes for Semi-additive PWB fabrication for Fine Line Formation Targeting Line and Space=5μm/5μm

Satoshi Kawashima; Kazutaka Tajima

View Articletitled, Advanced Chemical Processes for Semi-additive PWB fabrication for Fine Line Formation Targeting Line and Space=5μm/5μm

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Substrate Temporary Bonding Supporting Post-Processing Applications

Jared Pettit; Alman Law; Alex Brewer; John Moore

View Articletitled, Substrate Temporary Bonding Supporting Post-Processing Applications

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The Growth of Advanced Packaging: An Overview of the Latest Technology Developments, Applications and Market Trends

R. Beica; A. Ivankovic; T. Buisson; S. Kumar; J. Azemar

View Articletitled, The Growth of Advanced Packaging: An Overview of the Latest Technology Developments, Applications and Market Trends

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A TXV-less Packaging Platform for the Era of IoTs

Dyi-Chung Hu; Yu-Min Lin; Hsiang Hung Chang; Tao-Chih Chang; Wei-Chung Lo; Chih-Kung Yang; Henry Yang; Yin-Po Hung; Yu-Hua Chen; Ra-Min Tain

View Articletitled, A TXV-less Packaging Platform for the Era of IoTs

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Embedded Flexible Hybrid Electronics for the Internet of Things

Val R. Marinov

View Articletitled, Embedded Flexible Hybrid Electronics for the Internet of Things

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Interposers: A Central Generic Technology for IoT

A. Rouzaud; G. Pares

View Articletitled, Interposers: A Central Generic Technology for IoT

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Smart PCBs for Smart Appliances - Embedding as IoT Enabler

Nick Renaud-Bezot; Christian Galler; Christian Vockenberger

View Articletitled, Smart PCBs for Smart Appliances - Embedding as IoT Enabler

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System on film type substrates: processes, structure and real modules

Chih Kuang Yang

View Articletitled, System on film type substrates: processes, structure and real modules

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Quantitative Projections of the Cost Benefits of 3D Integration

View Articletitled, Quantitative Projections of the Cost Benefits of 3D Integration

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2.5D Interposers and Advanced Organic Substrates Landscape: Technology and Market Trends

A. Ivankovic; T. Buisson; S. Kumar; A. Pizzagalli; J. Azemar; R. Beica

View Articletitled, 2.5D Interposers and Advanced Organic Substrates Landscape: Technology and Market Trends

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High Density Interposer – Challenges and Opportunities

Mathias Boettcher; Frank Windrich; M-J. Wolf

View Articletitled, High Density Interposer – Challenges and Opportunities

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Design challenges in Interposer based 3-D Memory Logic Interface

Andy Heinig; Muhammad Waqas Chaudhary; Robert Fischbach; Michael Dittrich

View Articletitled, Design challenges in Interposer based 3-D Memory Logic Interface

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Towards 200mm 3D RF interposer technology

Philippe Soussan; Kristof Vaesen; Bart Vereecke; Jian Zhu

View Articletitled, Towards 200mm 3D RF interposer technology

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Tunable High-Q TSV Inductor Packaging with MEMS

Bruce Kim; Saikat Mondal; Sang-Bock Cho

View Articletitled, Tunable High-Q TSV Inductor Packaging with MEMS

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Fan-in WLP: Technology and Market Trends

A. Ivankovic; T. Buisson; S. Kumar; A. Pizzagalli; J. Azemar; R. Beica

View Articletitled, Fan-in WLP: Technology and Market Trends

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Hermetic Seal Bonding at Low-temperature with Sub-micron Gold Particles for Wafer Level Packaging

Toshinori Ogashiwa; Kentaro Totsu; Mitsutomo Nishizawa; Hiroyuki Ishida; Yuya Sasaki; Masayuki Miyairi; Hiroshi Murai; Yukio Kanehira; Shuji Tanaka; Masayoshi Esashi

View Articletitled, Hermetic Seal Bonding at Low-temperature with Sub-micron Gold Particles for Wafer Level Packaging

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BCB-Based Dry Film low k Permanent Polymer with sub 4-μm Vias for Advanced WLP and FO-WLP Applications

Michael Toepper; Tanja Braun; Robert Gernhardt; Martin Wilke; Piotr Mackowiak; Klaus-Dieter Lang; Corey O'Connor; Robert Barr; Tina Aoude; Jeffrey Calvert; Michael Gallagher; Jong-Uk Kim; Andrew Politis; Ellisei Iagodkine

View Articletitled, BCB-Based Dry Film low k Permanent Polymer with sub 4-μm Vias for Advanced WLP and FO-WLP Applications

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Development of thin package using the glass carrier substrate

Jun Onohara; Takashi Fujita; Yoshito Akutagawa

View Articletitled, Development of thin package using the glass carrier substrate

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Wafer Level 3D System Integration using a Novel 3D-RDL Technology

Ayad Ghannam; Alessandro Magnani; David Bourrier; Thierry Parra

View Articletitled, Wafer Level 3D System Integration using a Novel 3D-RDL Technology

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Main Impact Factors on Internal Stress of Electroless Deposited Copper Films

Tobias Bernhard; Sebastian Zarwell; Frank Brüning; Ralf Brüning; Tanu Sharma

View Articletitled, Main Impact Factors on Internal Stress of Electroless Deposited Copper Films

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Improved properties and reduced metal content conductive powders for high temperature sensor applications

Richard Stephenson; Howard Imhof

View Articletitled, Improved properties and reduced metal content conductive powders for high temperature sensor applications

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Current Developments in Precious Metal Plating for the Semi - Conductor/Micro - Electronics Markets

Steven Burling; Gary Nicholls; Stewart Hemsley; Sadayuki Nagatomo; Kazuhiko Shiokawa

View Articletitled, Current Developments in Precious Metal Plating for the Semi - Conductor/Micro - Electronics Markets

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Formulation Development for Bosch Etch Residue Removal: Effect of Solvent on Removal Efficiency

Richard Peters; Yuanmei Cao; Kim Pollard; Don Pfettscher; Mike Phenis

View Articletitled, Formulation Development for Bosch Etch Residue Removal: Effect of Solvent on Removal Efficiency

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Optimal SMT Electronics Assembly Guidelines for Stencil Printing

Ed Briggs

View Articletitled, Optimal SMT Electronics Assembly Guidelines for Stencil Printing

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Sn-Ag-Cu Solder Joints Interconnection Reliability of BGA Package during Thermal Aging and Cycling

Chaobo Shen; Cong Zhao; Zhou Hai; Jiawei Zhang; M. J. Bozack; J. C. Suhling; John L. Evans

View Articletitled, Sn-Ag-Cu Solder Joints Interconnection Reliability of BGA Package during Thermal Aging and Cycling

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Solder electromigration behavior in Cu/electroless Ni–P plating/Sn–Cu based joint system at low current densities

Takuya Kadoguchi; Kimihiro Yamanaka; Shijo Nagao; Katsuaki Suganuma

View Articletitled, Solder electromigration behavior in Cu/electroless Ni–P plating/Sn–Cu based joint system at low current densities

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Evaluation about Solder-IMC Crack of Fine Pitch BGA Package

Taeho Kang; Ara Lee; Jaewoo Jeong; Dongok Kwak

View Articletitled, Evaluation about Solder-IMC Crack of Fine Pitch BGA Package

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Finite element analysis of lidded flip-chip packages: A study on the impact of thermal interface material compressibility and stress-free conditions on modeling predictions

Tuhin Sinha

View Articletitled, Finite element analysis of lidded flip-chip packages: A study on the impact of thermal interface material compressibility and stress-free conditions on modeling predictions

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Finite Element Analysis and Measurement of Low-Profile BVA^TMPackage On Package (PoP) Warpage Characteristics

Akash Agrawal; Ashok Prabhu

View Articletitled, Finite Element Analysis and Measurement of Low-Profile BVA<sup>TM</sup>Package On Package (PoP) Warpage Characteristics

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Mechanical testing and fracture analyses of miniaturized ZnO-based multilayer components

K. Macurova; M. Gruber; M. Pletz; P. Supancic; R. Danzer; F. Aldrian; R. Bermejo

View Articletitled, Mechanical testing and fracture analyses of miniaturized ZnO-based multilayer components

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I/O Printed Circuit Board Assemblies; Recent Learning in Mechanical Stress Analysis, Verification Testing, and Post-test Analysis Techniques and Results

John Torok; Shawn Canfield; Suraush Khambati; Robert Mullady; Budy Notohardjono; Jing Zhang

View Articletitled, I/O Printed Circuit Board Assemblies; Recent Learning in Mechanical Stress Analysis, Verification Testing, and Post-test Analysis Techniques and Results

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Moldflow simulation of an exposed pad leaded package

Vibhash Jha; Torsten Hauck

View Articletitled, Moldflow simulation of an exposed pad leaded package

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High Tolerance, Micron Scale, Inline Embedded Resistors using Thin Film Additive Manufacturing

S. Lauer, P.E.; V.D. Heydemann; J. Slater; J. Mazurowski

View Articletitled, High Tolerance, Micron Scale, Inline Embedded Resistors using Thin Film Additive Manufacturing

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Engineered Nanocomposites for Additive Manufacturing of Microwave Electronics

Juan Castro; Eduardo Rojas; Thomas Weller; Jing Wang

View Articletitled, Engineered Nanocomposites for Additive Manufacturing of Microwave Electronics

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Additive Manufacturing Design and Fabrication of Ceramic Cylindrical Ion Trap Mass Analyzer Chips for Miniaturized Mass Spectrometer Smart-Devices

Patrick Roman; Xudong Chen; W. Kinzy Jones; Ali Karbasi; C. Mike Newton; Travis Bates; Jacob Denkins; Shekhar Bhansali

View Articletitled, Additive Manufacturing Design and Fabrication of Ceramic Cylindrical Ion Trap Mass Analyzer Chips for Miniaturized Mass Spectrometer Smart-Devices

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Aerosol Jet^® Enabled 3D Antenna and Sensors for IoT Applications

Michael O'Reilly; Michael J. Renn, Ph.D.; David Sessoms, Ph.D.

View Articletitled, Aerosol Jet<sup>®</sup> Enabled 3D Antenna and Sensors for IoT Applications

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Digital Manufacturing for Electrically Functional Satlet Structures

Paul I. Deffenbaugh; Mike Newton; Kenneth H. Church

View Articletitled, Digital Manufacturing for Electrically Functional Satlet Structures

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Viewing Context Adaptive On-Chip Video Memory

Dongliang Chen; Jinhui Wang; Na Gong

View Articletitled, Viewing Context Adaptive On-Chip Video Memory

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A New Package for High Speed and High Density eStorage Using the Frequency Boosting Chip

Geukchan Kim; Hyejin Kim; Sunghoon Chun

View Articletitled, A New Package for High Speed and High Density eStorage Using the Frequency Boosting Chip

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High-Voltage Stacked Diode Package

Lauren Boteler; Alexandra Rodriguez; Miguel Hinojosa; Damian Urciuoli

View Articletitled, High-Voltage Stacked Diode Package

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Bonding Technologies for 3D integration

Sascha Lohse; Alexander Wollanke

View Articletitled, Bonding Technologies for 3D integration

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Embedded solutions: Fan-out and Embedded Die Packages market and technology trends

Jérôme Azémar

View Articletitled, Embedded solutions: Fan-out and Embedded Die Packages market and technology trends

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FOWLP Technology eWLB – Enabler for Packaging of IoT/IoE Modules

Steffen Kroehnert; José Campos; André Cardoso; Eoin O'Toole; Abel Janeiro; Nuno Vieira

View Articletitled, FOWLP Technology eWLB – Enabler for Packaging of IoT/IoE Modules

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Chip Last Fan Out as an Alternative to Chip First

Scott Chen; Simon Wang; Coltrane Lee; Adren Hsieh; John Hunt; William Chen

View Articletitled, Chip Last Fan Out as an Alternative to Chip First

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Advanced Manufacturing Technology for Fan-Out Wafer Level Packaging

Doug Shelton

View Articletitled, Advanced Manufacturing Technology for Fan-Out Wafer Level Packaging

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Sol-gel doped-PZT thin films for integrated tunable capacitors

Warda Benhadjala; Gwenael Le Rhun; Christel Dieppedale; Florence Sonnerat; Jennifer Guillaume; Clémence Bonnard; Philippe Renaux; Henri Sibuet; Christophe Billard; Pascal Gardes; Patrick Poveda

View Articletitled, Sol-gel doped-PZT thin films for integrated tunable capacitors

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Ceramic decals – predesigned thick-film sensors for variable surfaces

Thomas Seuthe; Markus Eberstein; Rolf Petersen; Hans-Jürgen Amann

View Articletitled, Ceramic decals – predesigned thick-film sensors for variable surfaces

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Shrinkage controlled pastes for bulky silver and copper thick films in power electronics

Richard Schmidt; Kathrin Reinhardt; Thomas Seuthe; Olga Schwab; Claudia Feller; Markus Eberstein

View Articletitled, Shrinkage controlled pastes for bulky silver and copper thick films in power electronics

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A Case Study of Ultra-Leach Resistant Thick Film Conductors for Non-Magnetic Applications

John J. B. Silvia, III

View Articletitled, A Case Study of Ultra-Leach Resistant Thick Film Conductors for Non-Magnetic Applications

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Characterization of a New and Complete Lead-Free Thick Film Resistor System for the Hybrid Circuit Market

Michael A. Skurski; Marc H. LaBranche

View Articletitled, Characterization of a New and Complete Lead-Free Thick Film Resistor System for the Hybrid Circuit Market

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Corrosion reliability of copper wirebond (CuWB) packages-Impact of voltage and corrosive ions from packaging materials

Varughese Mathew; Sheila Chopin

View Articletitled, Corrosion reliability of copper wirebond (CuWB) packages-Impact of voltage and corrosive ions from packaging materials

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Reliability Performance of Palladium Coated Copper Wire in High Temperature Bake at Extreme Durations

Tu Anh Tran; Chu-Chung (Stephen) Lee; Varughese Mathew

View Articletitled, Reliability Performance of Palladium Coated Copper Wire in High Temperature Bake at Extreme Durations

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Thermal Aging Behavior of Fine Pitch Palladium Coated Silver (PCS) Ball Bonds on Al Metallization

Di Erick Xu; Jimy Gomes; Michael Mayer; Rob Lyn; John Persic

View Articletitled, Thermal Aging Behavior of Fine Pitch Palladium Coated Silver (PCS) Ball Bonds on Al Metallization

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Enhanced Mpilog macromodels for Signal and Power Integrity Simulations

Gianni Signorini; Claudio Siviero; Igor Simone Stievano; Stefano Grivet-Talocia

View Articletitled, Enhanced Mpilog macromodels for Signal and Power Integrity Simulations

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Simulation Methodology and Design Flow for Decoupling Optimization in Case of Design Reusing

Benoit Goral; Cyrille Gautier; Alexandre Amédéo

View Articletitled, Simulation Methodology and Design Flow for Decoupling Optimization in Case of Design Reusing

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Line coding methods for high speed serial links

Abdelaziz Goulahsen; Julien Saadé; Frédéric Pétrot

View Articletitled, Line coding methods for high speed serial links

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A Gallium Nitride-Based Power Module for Totem-Pole Bridgeless Power Factor Correction Rectifier

Wenli Zhang; Zhengyang Liu; Fred Lee; Shuojie She; Xiucheng Huang; Qiang Li

View Articletitled, A Gallium Nitride-Based Power Module for Totem-Pole Bridgeless Power Factor Correction Rectifier

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Print Copper on Ceramic for High Reliability Electronics

Ryan Persons; Paul Gundel

View Articletitled, Print Copper on Ceramic for High Reliability Electronics

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Optimizing Diamond Heat Spreaders for Thermal Management of Hotspots for GaN Devices

Thomas Obeloer; Bruce Bolliger; Yong Han; Boon Long Lau; Gongyue Tang; Xiaowu Zhang

View Articletitled, Optimizing Diamond Heat Spreaders for Thermal Management of Hotspots for GaN Devices

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Pressure-less AgNP Sintering for High-power MCM Assembly for Extreme Environment Applications

Zhenzhen Shen; Aleksey Reiderman; Casey Anude

View Articletitled, Pressure-less AgNP Sintering for High-power MCM Assembly for Extreme Environment Applications

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High Thermal Stability of SiC Packaging with Sintered Ag Paste Die-attach combined with Imide-based Molding

Shijo Nagao; Takuo Sugioka; Satoshi Ogawa; Teruhisa Fujibayashi; Zhang Hao; Katsuaki Suganuma

View Articletitled, High Thermal Stability of SiC Packaging with Sintered Ag Paste Die-attach combined with Imide-based Molding

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A High Performance Power Package for Wide Bandgap Semiconductors Using Novel Wire Bondless Power Interconnections

Jennifer Stabach; Zach Cole; Chad B. O'Neal; Brice McPherson; Robert Shaw; Brandon Passmore

View Articletitled, A High Performance Power Package for Wide Bandgap Semiconductors Using Novel Wire Bondless Power Interconnections

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A Robust, Composite Packaging Approach for a High Voltage 6.5kV IGBT and Series Diode

Adam Morgan; Ankan De; Haotao Ke; Xin Zhao; Kasunaidu Vechalapu; Douglas C. Hopkins; Subhashish Bhattacharya

View Articletitled, A Robust, Composite Packaging Approach for a High Voltage 6.5kV IGBT and Series Diode

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A metal oxide adhesion layer prepared with water based coating solution for wet Cu metallization of glass interposer

Zhiming Liu; Sara Hunegnaw; Hailuo Fu; Jun Wang; Tafadzwa Magaya; Michael Merschky; Tobias Bernhard; Aric Shorey; Hobie Yun

View Articletitled, A metal oxide adhesion layer prepared with water based coating solution for wet Cu metallization of glass interposer

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Leveraging Glass Properties for Advanced Packaging

A.B. Shorey; Y.J. Lu; G.A. Smith

View Articletitled, Leveraging Glass Properties for Advanced Packaging

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Hermetically Sealed Glass Packages

Roupen Keusseyan; Tim Mobley

View Articletitled, Hermetically Sealed Glass Packages

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Design and Demonstration of 40 micron Bump Pitch Multi-layer RDL on Panel-based Glass Interposers

Brett Sawyer; Yuya Suzuki; Zihan Wu; Hao Lu; Venky Sundaram; Kadappan Panayappan; Rao Tummala

View Articletitled, Design and Demonstration of 40 micron Bump Pitch Multi-layer RDL on Panel-based Glass Interposers

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Through Glass Via (TGV) Technology for RF Applications

A. B. Shorey; S. Kuramochi; C. H. Yun

View Articletitled, Through Glass Via (TGV) Technology for RF Applications

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The Glass Core with an Anti-crack Propagation Structure

Sukhyeon Cho; Yongho Baek; Yoong Oh; Dahee Kim; Hyungki Lee

View Articletitled, The Glass Core with an Anti-crack Propagation Structure

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Critical Barriers Associated with Copper Wire

William G. Crockett, Jr.

View Articletitled, Critical Barriers Associated with Copper Wire

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Copper wire bonding ready for industrial mass production

M. Brökelmann; D. Siepe; M. Hunstig; M. McKeown; K. Oftebro

View Articletitled, Copper wire bonding ready for industrial mass production

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Advances in Wire Bonding Technology for Different Bonding Wire Material

Ivy Qin; Aashish Shah; Hui Xu; Bob Chylak; Nelson Wong

View Articletitled, Advances in Wire Bonding Technology for Different Bonding Wire Material

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Wedge Bond Process Optimization Method for 1.5 mil Al Wire on Al Bond Pad

Wenjuan Qi; Daniel D. Evans, Jr.

View Articletitled, Wedge Bond Process Optimization Method for 1.5 mil Al Wire on Al Bond Pad

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Real-Time Observation of Interface Relative Motion during Ultrasonic Wedge-Wedge Bonding Process

Yangyang Long; Jens Twiefel; Joscha Roth; Jörg Wallaschek

View Articletitled, Real-Time Observation of Interface Relative Motion during Ultrasonic Wedge-Wedge Bonding Process

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Improving Stitch Bond on Hybrid Thick Film Substrate using Stand-Off Stitch Wire Bond Technique

Richard C. Garcia

View Articletitled, Improving Stitch Bond on Hybrid Thick Film Substrate using Stand-Off Stitch Wire Bond Technique

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Understanding the Role of Ultrasonic Welding in Wire Bonding

Lee Levine

View Articletitled, Understanding the Role of Ultrasonic Welding in Wire Bonding

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High Reliability No-Clean Solder Paste for Designs where Flux Cannot be Dried

Fen Chen; Ning-Cheng Lee

View Articletitled, High Reliability No-Clean Solder Paste for Designs where Flux Cannot be Dried

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Improvement of High Power Cycling Reliability having Sn-Cu Based Solder

Miyazaki Takaaki; Ikeda Osamu

View Articletitled, Improvement of High Power Cycling Reliability having Sn-Cu Based Solder

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Microstructure of Transient Liquid Phase Sintering Joint by Sn-Coated Cu Particles for High Temperature Packaging

Xiangdong Liu; Hiroshi Nishikawa

View Articletitled, Microstructure of Transient Liquid Phase Sintering Joint by Sn-Coated Cu Particles for High Temperature Packaging

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Transient Liquid Phase Sintering Pastes as Solder Alternatives in High Temperature Applications

Catherine Shearer; Ken Holcomb

View Articletitled, Transient Liquid Phase Sintering Pastes as Solder Alternatives in High Temperature Applications

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Application of transient liquid phase sintering (TLPS) interconnect material for high temperature Pb-free RoHS compliant MLCC lead attachment

John McConnell; J. Bultitude; J. Qazi; J. Magee; C. Shearer; K. Holcomb

View Articletitled, Application of transient liquid phase sintering (TLPS) interconnect material for high temperature Pb-free RoHS compliant MLCC lead attachment

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Large Scale Photodesmear for Via Residue Cleaning in High Density Interconnect substrates

Tomoyuki Habu; Masahito Namai; Akira Aiba; Hajime Kikuiri; Shun Maruyama; Hiroki Horibe; Hiroko Suzuki; Shinichi Endo; Toru Fujinami; Shintaro Yabu; Rahul Jain; Kristof Darmawikarta; Michael Obrien

View Articletitled, Large Scale Photodesmear for Via Residue Cleaning in High Density Interconnect substrates

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Failure Analysis Work Flow for Electrical Shorts in Triple Stacked 3D TSV Daisy Chains

J. Gaudestad; A. Orozco; I. De Wolf; T. Wang; T. Webers; R. Kelley; T. Morrison; S. Madala

View Articletitled, Failure Analysis Work Flow for Electrical Shorts in Triple Stacked 3D TSV Daisy Chains

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Multi Beam Full Cut Dicing of Thin Si IC wafers

Jeroen van Borkulo; Richard van der Stam; Won Chul Jung; Paul Verburg

View Articletitled, Multi Beam Full Cut Dicing of Thin Si IC wafers

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Control of 3D IC process steps by optical metrologies

G. Fresquet; D. Le Cunff; Th. Raymond; D. K. de Vries

View Articletitled, Control of 3D IC process steps by optical metrologies

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A New In-line Laser-based Acoustic Technique for Pillar Bump Metrology

Todd W. Murray; Andrew Bakir; David M. Stobbe; Michael J. Kotelyanskii; Robin A. Mair; Manjusha Mehendale; Xueping Ru; Jonathan D. Cohen; Michelle T. Schulberg; Priya Mukundhan; Timothy J. Kryman

View Articletitled, A New In-line Laser-based Acoustic Technique for Pillar Bump Metrology

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Improving mean time to develop micro-bump/pillar fabrication process for vertical interconnections by combined defectivity and metrology approach

Nicolas Devanciard; Franck Bana; Nicolas Bresson; Stéphane Rey; Carlos Beitia; Dario Alliata; Darcy Hart; John Thornell; Justin Miller

View Articletitled, Improving mean time to develop micro-bump/pillar fabrication process for vertical interconnections by combined defectivity and metrology approach

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Predicting Package Level Failure Modes in Multi Layered Packages

Gil Sharon; Greg Caswell; Nathan Blattau

View Articletitled, Predicting Package Level Failure Modes in Multi Layered Packages

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TCT Reliability of Organic Passivation Layer for WLCSP

Mitsuru Fujita; Atsushi Fujii; Shuji Shimoda; Yoshiharu Kariya

View Articletitled, TCT Reliability of Organic Passivation Layer for WLCSP

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RF and Microwave Power Amplifiers assembly – Interaction between materials, design and process on reliability

Tennyson Nguty; Tyrone Plata; Henk Thoonen

View Articletitled, RF and Microwave Power Amplifiers assembly – Interaction between materials, design and process on reliability

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Thermal Management Solutions for enhanced Digital Flight Data Acquisition Unit in Avionics Applications

Vicentiu Grosu; Chris Lindgren; Tamas Vejsz

View Articletitled, Thermal Management Solutions for enhanced Digital Flight Data Acquisition Unit in Avionics Applications

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Multiphysics Modeling of Underfill Flow and Cure during Thermocompression Bonding

Mark Oliver; Nagi Elabbasi

View Articletitled, Multiphysics Modeling of Underfill Flow and Cure during Thermocompression Bonding

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Thermally Conductive Plastics for Enhanced Thermal Management

Chandrashekar Raman

View Articletitled, Thermally Conductive Plastics for Enhanced Thermal Management

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Isolation Resistance of Encapsulated Electrical Conductors and Terminations for Biomedical Applications

Thomas F. Marinis; Joseph W. Soucy

View Articletitled, Isolation Resistance of Encapsulated Electrical Conductors and Terminations for Biomedical Applications

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Embedded passives on low profile Silicon substrate technology for Medical implants, Wearables and Internet of Things

Sébastien Leruez; Catherine Bunel

View Articletitled, Embedded passives on low profile Silicon substrate technology for Medical implants, Wearables and Internet of Things

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Packaging Architecture for an Implanted System that Monitors Brain Activity and Applies Therapeutic Stimulation

Caroline K. Bjune; Thomas F. Marinis; Tirunelveli S. Sriram; Jeanne M. Brady; James Moran; Philip D. Parks; Alik S. Widge; Darin D. Dougherty; Emad N. Eskandar

View Articletitled, Packaging Architecture for an Implanted System that Monitors Brain Activity and Applies Therapeutic Stimulation

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Two step silicon microfluidics for capillary valve applications

Bivragh Majeed; Ahmed Taher; Ben Jones; Deniz Sabuncuoglu

View Articletitled, Two step silicon microfluidics for capillary valve applications

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PERSPECTIVE ON REQUIRED PACKAGING TECHNOLOGIES FOR NEUROMORPHIC DEVICES

Yasumitsu Orii; Akihiro Horibe; Kuniaki Sueoka; Keiji Matsumoto; Toyohiro Aoki; Hirokazu Noma; Sayuri Kohara; Keishi Okamoto; Shintaro Yamamichi; Kohji Hosokawa; Hiroyuki Mori

View Articletitled, PERSPECTIVE ON REQUIRED PACKAGING TECHNOLOGIES FOR NEUROMORPHIC DEVICES

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A Novel Back-side Via Process For Low-cost TSV.

Toshiyuki Sakuishi; Takahide Murayama; Yasuhiro Morikawa

View Articletitled, A Novel Back-side Via Process For Low-cost TSV.

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Development and usability study of pre-applied inter chip fill for 3D-IC

Kan Takeshita; Makoto Ikemoto; Masaya Sugiyama; Hidehiro Yamamoto; Hideki Kiritani; Yashuhiro Kawase

View Articletitled, Development and usability study of pre-applied inter chip fill for 3D-IC

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Copper Oxide Direct Bonding of 200mm CMOS Wafers: Morphological and Electrical Characterization

Celso Cavaco; Lan Peng; Koen De Leersnijder; Stefano Guerrieri; Deniz S. Tezcan; Haris Osman

View Articletitled, Copper Oxide Direct Bonding of 200mm CMOS Wafers: Morphological and Electrical Characterization

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Hermetic package for optical devices using room temperature welding technology and transparent lid, for space applications

H. Lundén; L. Murphy; A. Määttänen; T. Kumpulainen

View Articletitled, Hermetic package for optical devices using room temperature welding technology and transparent lid, for space applications

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Modeling, Design, Fabrication, and Characterization of Ultra-high Bandwidth 3D Glass Photonic Substrates

Bruce Chou; William Vis; Ryuta Furuya; Venky Sundaram; Tummala Rao

View Articletitled, Modeling, Design, Fabrication, and Characterization of Ultra-high Bandwidth 3D Glass Photonic Substrates

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Expanded Beam Fiber Optic Connectors Increase Optical Link Margin

John Mazurowski

View Articletitled, Expanded Beam Fiber Optic Connectors Increase Optical Link Margin

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HIGH DATA RATE SILICON PHOTONIC - CMOS ELECTRONIC MODULES USING COPPER MICROBUMPS

S. Bernabé; G. Pares; B. Blampey; K. Rida; O. Castany; S. Menezo; S. Malhouitre; C. Kopp; K. Dieng; E. Temporiti

View Articletitled, HIGH DATA RATE SILICON PHOTONIC - CMOS ELECTRONIC MODULES USING COPPER MICROBUMPS

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Heterogeneous Integration of a 300mm Silicon Photonics-CMOS Wafer Stack by Direct Oxide Bonding and Via-last 3D Interconnection

Colin McDonough; Doug La Tulipe; Dan Pascual; Paul Tariello; John Mucci; Matt Smalley; Anh Nguyen; Tuan Vo; Corbet Johnson; Phung Nguyen; Jeremiah Hebding; Gerald Leake; Michele Moresco; Erman Timurdogan; Vladimir Stojanović; Michael R. Watts; Douglas Coolbaugh

View Articletitled, Heterogeneous Integration of a 300mm Silicon Photonics-CMOS Wafer Stack by Direct Oxide Bonding and Via-last 3D Interconnection

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A HIGH THROUGHPUT, LOW COST ASSEMBLY APPROACH FOR LED IMS PACKAGES TO HEAT SINK USING ADVANCED THERMAL INTERFACE MATERIALS

Swapan K. Bhattacharya; Fei Xie; Han Wu; Kelley Hodge; Keck Pathammavong; Paul N. Houston; Daniel F. Baldwin; Albert Giorgini

View Articletitled, A HIGH THROUGHPUT, LOW COST ASSEMBLY APPROACH FOR LED IMS PACKAGES TO HEAT SINK USING ADVANCED THERMAL INTERFACE MATERIALS

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Challenge to zero CTE and lower shrinkage organic substrate material for thin CSP package

Shintaro Hashimoto; Shin Takanezawa; Shinji Tsuchikawa; Masaaki Takekoshi; Kenichi Oohashi; Koji Morita

View Articletitled, Challenge to zero CTE and lower shrinkage organic substrate material for thin CSP package

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Highly conductive MWNT/silicone composite with low density MWNT bundles

Sangeui Lee; Shinje Cho; Hajin Kim; Intaek Han; Yoonchul Sohn

View Articletitled, Highly conductive MWNT/silicone composite with low density MWNT bundles

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The Future of Solder Joint Encapsulant

Mary Liu; Wusheng Yin, Ph.D

View Articletitled, The Future of Solder Joint Encapsulant

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Phase Change Material for Thermal Management in 3D Integrated Circuits Packaging

Mingli Li; Na Gong; Jinhui Wang; Zhibin Lin

View Articletitled, Phase Change Material for Thermal Management in 3D Integrated Circuits Packaging

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Low Temperature, Fast Sintering of Micro-Scale Silver Paste for Die Attach for 300°C Applications

Fang Yu; R. Wayne Johnson; Michael C. Hamilton

View Articletitled, Low Temperature, Fast Sintering of Micro-Scale Silver Paste for Die Attach for 300°C Applications

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Solder Paste Corrosivity Assesment: Bono Test

Céline Puechagut; Anne-Marie Laügt; Emmanuelle Guéné; Richard Anisko

View Articletitled, Solder Paste Corrosivity Assesment: Bono Test

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Metal Salt Solution-Nanoprecipitation Method for Improvement in Reliability of Sintered Ag Nanoparticle Bonding

Daisuke Hiratsuka; Akihiro Sasaki; Tomohiro Iguchi; Tetsuya Yamamoto; Tsuyoshi Sato

View Articletitled, Metal Salt Solution-Nanoprecipitation Method for Improvement in Reliability of Sintered Ag Nanoparticle Bonding

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Analysis of 16 QFN Device I/O Pads for Solderability Failures

Rama Hegde; Anne Anderson; Sam Subramanian; Andrew Mawer; Ed Hall; VK Leong; A. Selvakumar

View Articletitled, Analysis of 16 QFN Device I/O Pads for Solderability Failures

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Implication of Multiple Leak Tests and Impact of Rest Time on Avionic Hybrids

Maureen Perry; Steve Smalley

View Articletitled, Implication of Multiple Leak Tests and Impact of Rest Time on Avionic Hybrids

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Failure Analyses of Modern Power Semiconductor Switching Devices

Nathan Valentine; Diganta Das; Bhanu Sood; Michael Pecht

View Articletitled, Failure Analyses of Modern Power Semiconductor Switching Devices

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Technique to predict reliability failure in side-gate transfer molded packages

Nishant Lakhera; Tom Battle; Sheila Chopin; Sandeep Shantaram; Akhilesh K. Singh

View Articletitled, Technique to predict reliability failure in side-gate transfer molded packages

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Cost Analysis of Flip Chip Assembly Processes: Mass Reflow with Capillary Underfill and Thermocompression Bonding with Nonconductive Paste

Amy Palesko

View Articletitled, Cost Analysis of Flip Chip Assembly Processes: Mass Reflow with Capillary Underfill and Thermocompression Bonding with Nonconductive Paste

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A Curvature-Based Interpretation of the Steinberg Criterion for Fatigue Life of Electronic Components

Michael G. Béda

View Articletitled, A Curvature-Based Interpretation of the Steinberg Criterion for Fatigue Life of Electronic Components

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Reliability of Manganese Dioxide and Conductive Polymer Tantalum Capacitors under Temperature Humidity Bias Testing

Anto Peter; Michael H. Azarian; Michael Pecht

View Articletitled, Reliability of Manganese Dioxide and Conductive Polymer Tantalum Capacitors under Temperature Humidity Bias Testing

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Cleaning in Electronics: Understanding Today's Needs

P.J. Duchi; Anne-Marie Laügt; Laurent Levasseur

View Articletitled, Cleaning in Electronics: Understanding Today's Needs

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Pure Chemical Reduction of Tin Oxides to Metallic Tin by Atmospheric Plasma to Improve Interconnection Reflow of Pb-free Solders

Kang-Wook Lee; Katsuyuki Sakuma; Thomas Lombardi; Jason Rowland; David Lewison; Eric Schulte

View Articletitled, Pure Chemical Reduction of Tin Oxides to Metallic Tin by Atmospheric Plasma to Improve Interconnection Reflow of Pb-free Solders

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Packaging Tradeoff for SIP Integration Targeting High Speed PAM-4 Applications

B Haentjens; G Desruelles; G Chrétien; A Leborgne; Y Haentjens; J Dupuy; F Jorge; A Konczykowska; I Beauvisage; R Delleme; D Martin; S Bila; K Frigui; S Ngoho; B Frigui; H Mardoyan

View Articletitled, Packaging Tradeoff for SIP Integration Targeting High Speed PAM-4 Applications

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Reliability of silver wedge bonding for power devices

Xing Wei; Zhou Yu; Wanmeng Xu; Tomonori Iizuka; Kohei Tatsumi

View Articletitled, Reliability of silver wedge bonding for power devices

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Dual-frequency MEMS based Oscillator using a single ZnO-on-SOI Resonator

Di Lan; Julio Dewdney; I-Tsang Wu; Ivan Rivera; Adrian Avila; Jing Wang

View Articletitled, Dual-frequency MEMS based Oscillator using a single ZnO-on-SOI Resonator

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A Direct Digital Manufactured RFID System Applied to Teaching Antenna Theory to Pre-College Students

Eduardo A. Rojas-Nastrucci; Ramiro A. Ramirez; Sean T. Murphy; Mike Newton; Thomas M. Weller

View Articletitled, A Direct Digital Manufactured RFID System Applied to Teaching Antenna Theory to Pre-College Students

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Ensuring Suitability of Cu Wire Bonded ICs for Automotive Applications

James McLeish; Randy Schueller

View Articletitled, Ensuring Suitability of Cu Wire Bonded ICs for Automotive Applications

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Low Inductance Antenna (LIA) plasma source and plasma-enhanced dual rotatable magnetron sputter assisted with LIA

Y. Takaya; Y. Tanioka; H. Yoshino; A. Osawa

View Articletitled, Low Inductance Antenna (LIA) plasma source and plasma-enhanced dual rotatable magnetron sputter assisted with LIA

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High Speed, High Density Separable Interconnect - 1000 plus I/O ultra-low profile interfaces

James Rathburn

View Articletitled, High Speed, High Density Separable Interconnect - 1000 plus I/O ultra-low profile interfaces

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Heterogeneous integration of a miniaturized W-band radar module

K.-F. Becker; L. Georgi; R. Kahle; S. Voges; F. Brandenburger; J. Höfer; C. Ehrhardt; C. Zech; B. Baumann; A. Huelsmann; A. Grasenack; S. Reinold; B. Kleiner; T. Braun; M. Schneider-Ramelow; K.-D. Lang

View Articletitled, Heterogeneous integration of a miniaturized W-band radar module

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Hi Density QFN Packages and Modules Incorporating Windings for Inductors, Chokes and Antennae

CVInc

View Articletitled, Hi Density QFN Packages and Modules Incorporating Windings for Inductors, Chokes and Antennae

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Broadband 1-to-N Circuit Combiner for mm-wave Applications

Ali M. Darwish; H. Alfred Hung; Joe Qiu; Amr Ibraheem; Edward Viveiros

View Articletitled, Broadband 1-to-N Circuit Combiner for mm-wave Applications

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Types of Solder Preforms and Difficult Geometries

Herbert Ludowieg; Adam Murling

View Articletitled, Types of Solder Preforms and Difficult Geometries

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C4 EM and CPI Reliability Benefits and Process Challenges of FBEOL Integration Changes Implemented in Lead-free C4 Products

E. Misra; T. Wassick; I. Melville; K. Tunga; D. Questad; C. Muzzy; J. Coffin; C. Carey; R. Mendelson

View Articletitled, C4 EM and CPI Reliability Benefits and Process Challenges of FBEOL Integration Changes Implemented in Lead-free C4 Products

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Advanced lithography and electroplating approach to form high-aspect ratio copper pillars

Keith Best; Roger McCleary; Richard Hollman; Phillip Holmes

View Articletitled, Advanced lithography and electroplating approach to form high-aspect ratio copper pillars

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Study on electromigration in flip chip lead-free solder connections with 40 μm or 30 μm diameter on thin film ceramic substrates

Marek Gorywoda; Rainer Dohle; Bernd Kandler; Bernd Burger

View Articletitled, Study on electromigration in flip chip lead-free solder connections with 40 μm or 30 μm diameter on thin film ceramic substrates

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Flex-DIMM – A New High Density Module Form Factor

James E. Clayton

View Articletitled, Flex-DIMM – A New High Density Module Form Factor

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A Low-Impedance Projection Welding Device for Large Package Hermetic Sealing

Thomas E. Salzer

View Articletitled, A Low-Impedance Projection Welding Device for Large Package Hermetic Sealing

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High Performance High Density Interconnects using Liquid Crystal Polymer-Substrates, Circuits Driven by Mobile Applications

James Rathburn

View Articletitled, High Performance High Density Interconnects using Liquid Crystal Polymer-Substrates, Circuits Driven by Mobile Applications

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Ultra Fine Pitch RDL Development in Multi-layer eWLB (embedded Wafer Level BGA) Packages

Won Kyoung Choi; Duk Ju Na; Kyaw Oo Aung; Andy Yong; Jaesik Lee; Urmi Ray; Riko Radojcic; Bernard Adams; Seung Wook Yoon

View Articletitled, Ultra Fine Pitch RDL Development in Multi-layer eWLB (embedded Wafer Level BGA) Packages

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The Benefits of Flux-Coated Solder Preforms in a QFN Assembly Process

Brandon Judd; Maria Durham

View Articletitled, The Benefits of Flux-Coated Solder Preforms in a QFN Assembly Process

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Porosity Evolution of Ag-Sintering at Die Attach

Sihai Chen; Guangyu Fan; Xue Yan; Chris Labarbera; Lee Kresge; Ning-Cheng Lee

View Articletitled, Porosity Evolution of Ag-Sintering at Die Attach

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Impact of Metallurgical and Mechanical Properties of Sintered Silver Nanoparticles on Die-attach Reliability of High-temperature Power Modules

Hiroaki Tatsumi; Sho Kumada; Atsushi Fukuda; Hiroshi Yamaguchi; Yoshihiro Kashiba

View Articletitled, Impact of Metallurgical and Mechanical Properties of Sintered Silver Nanoparticles on Die-attach Reliability of High-temperature Power Modules

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Maintaining Low Voiding Solder Die Attach for Power Die While Minimizing Die Tilt

Randy Hamm; Ken Peterson

View Articletitled, Maintaining Low Voiding Solder Die Attach for Power Die While Minimizing Die Tilt

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Design of Filled One Step Chip Attach Materials (OSCA) for Conventional Mass Reflow Processing: Rheology Considerations for Jet Dispensing and Die Placement

Daniel Duffy; Hemal Bhavsar; Lin Xin; Jean Liu; Bruno Tolla

View Articletitled, Design of Filled One Step Chip Attach Materials (OSCA) for Conventional Mass Reflow Processing: Rheology Considerations for Jet Dispensing and Die Placement

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Barrier Properties of Electroless Ni-B UBM for Solder Joining

Masaru Morita; Toshiya Akamatsu; Nobuhiro Imaizumi; Seiki Sakuyama

View Articletitled, Barrier Properties of Electroless Ni-B UBM for Solder Joining

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2.5D Smart Objects Using Thermoplastic Stretchable Interconnects

Bart Plovie; Sheila Dunphy; Kristof Dhaenens; Steven Van Put; Bjorn Vandecasteele; Frederick Bossuyt; Jan Vanfleteren

View Articletitled, 2.5D Smart Objects Using Thermoplastic Stretchable Interconnects

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L/S ≤ 5/5μm Line Embedded Organic Substrate Manufacturing for 2.1D/2.5D SiP Application

Yu-Hua Chen; Shyh-Lian Cheng; Dyi-Chung Hu; Tzvy-Jang Tseng

View Articletitled, L/S ≤ 5/5μm Line Embedded Organic Substrate Manufacturing for 2.1D/2.5D SiP Application

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Enhanced optical performance for a reduction stepper to meet the challenges for advanced packaging applications

James E. Webb; Philippe Cochet

View Articletitled, Enhanced optical performance for a reduction stepper to meet the challenges for advanced packaging applications

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