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Volume 2016, Issue S1

1 October 2016

International Symposium on Microelectronics Cover Image for Volume 2016, Issue S1

ISSN 1085-8024

eISSN 2380-4505

In this Issue

Keynote Presentations

KEYNOTE PRESENTATIONS from IMAPS 2016 Pasadena

Keynote Presentations

Creating Semiconductor Value through Advanced Package Technology

Ron Huemoeller

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Strategy and Ecosystem for Microelectronics Assembly in the United States

Jonathon Greenwood

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Lift up! to IC Packaging: Trends and Assembly Reliability

Reza Ghaffarian

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Latest
Most Read
Most Cited

Verification of Compartmental Electromagnetic Interference Shielding Effect with imprint-Through Mold Via (i-TMV) for RF modules

Motohiro Negishi, Tomoaki Shibata, Xinrong Li, Naoya Suzuki

Emergence of Glass Solutions for 5G and Heterogeneous Integration

Aric B. Shorey, Shelby F. Nelson, David Levy, Paul Ballentine

Fine-pitch Copper Pillar Flip Chips in High Reliability Applications

Catherine Farnum, Kaysar Rahim, Ph.D.

Highly accelerated lifetime testing in power electronics

Bernhard Czerny, Golta Khatibi

Implementation of Trusted Manufacturing & AI-based process optimization into microelectronic manufacturing research environments

K.-F. Becker, S. Voges, P. Fruehauf, M. Heimann, S. Nerreter, R. Blank, M. Erdmann, S. Gottwald, A. Hofmeister, M. Hesse, M. Thies, S. Mehrafsun, R. Fust, E. Beck, J. Pawlikowski, B. Schröder, C. Voight, T. Braun, M. Schneider-Ramelow

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eISSN 2380-4505
ISSN 1085-8024

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