Volume 2017 Issue 1 | International Symposium on Microelectronics

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IMAPS 2017

High Reliability and High Throughput Ball Bumping Process Solution – Solder Joint Encapsulant Adhesives

Mary Liu; Wusheng Yin

View Articletitled, High Reliability and High Throughput Ball Bumping Process Solution – Solder Joint Encapsulant Adhesives

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Power cycle reliability of SiC devices with metal-sinter die-attach and thermostable molding

Shijo Nagao; Hirofumi Fujita; Akio Shimoyama; Shinya Seki; Hao Zhang; Katsuaki Suganuma

View Articletitled, Power cycle reliability of SiC devices with metal-sinter die-attach and thermostable molding

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Temperature and Process Dependent Material Characterization and Multiscale Stress Evolution Analysis for Performance and Reliability Management under Chip Package Interaction

Aditya P. Karmarkar; Xiaopeng Xu; Karim El-Sayed

View Articletitled, Temperature and Process Dependent Material Characterization and Multiscale Stress Evolution Analysis for Performance and Reliability Management under Chip Package Interaction

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Development of Liquid Compression Molding (LCM) Material for Low Warpage

Tsuyoshi Kamimura; Satomi Kawamoto; Daisuke Hashimoto; Yuto Shigeno; Haruyuki Yoshii; Hirokazu Noma; Tomohiro Ookubo; Hisato Takahashi; Hidetoshi Inoue

View Articletitled, Development of Liquid Compression Molding (LCM) Material for Low Warpage

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Fine Resolution Photosensitive Polyimide Dry Film with High Resistance to Electromigration under HAST condition

Masao Tomikawa; Kazuyuki Matsumura; Yu Shoji; Yoshiko Tatsuta; Ryoji Okuda

View Articletitled, Fine Resolution Photosensitive Polyimide Dry Film with High Resistance to Electromigration under HAST condition

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Packaging and Miniaturization of a 2–18 GHz UWB Radar for Measurements of Snow and Ice: Initial Results

F. R. Morales; C. Leuschen; A. Feathers; J. McDaniel; A. Wolf; S. Garrison

View Articletitled, Packaging and Miniaturization of a 2–18 GHz UWB Radar for Measurements of Snow and Ice: Initial Results

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Ultra-Compact Four-Channel 5–18 GHz Switched Filter Bank Utilizing PolyStrata® Microfabrication and 3D Packaging

Chris Hermanson; Rob Reid; Will Stacy

View Articletitled, Ultra-Compact Four-Channel 5–18 GHz Switched Filter Bank Utilizing PolyStrata® Microfabrication and 3D Packaging

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RF Test Article to Assess the Impact of Non-Hexavalent Chromium-Based Conversion Coatings on Electrical Assemblies

Joshua S. Petko; Philip A. Lovell; Jeremy D. Clifton; Paul H. Cohen; Karl F. Schoch, Jr.

View Articletitled, RF Test Article to Assess the Impact of Non-Hexavalent Chromium-Based Conversion Coatings on Electrical Assemblies

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Fabrication of X-band Oscillator on LCP Substrate Using Aerosol Printing

Christopher Oakley; Premjeet Chahal; John Papapolymerou; John D. Albrecht

View Articletitled, Fabrication of X-band Oscillator on LCP Substrate Using Aerosol Printing

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Thin Film Capacitor Applications in RF/Microwave Circuits

William B. Kuhn; J. Ambrose Wolf

View Articletitled, Thin Film Capacitor Applications in RF/Microwave Circuits

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Integration and Miniaturization of a Ka-band Stepped Frequency Radar for Un-manned Aerial Vehicle Applications

Jay W. McDaniel; Mark B. Yeary; Hjalti H. Sigmarsson; J. Ambrose Wolf; Sean Garrison; Kyle Byers; Matthew Clewell

View Articletitled, Integration and Miniaturization of a Ka-band Stepped Frequency Radar for Un-manned Aerial Vehicle Applications

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Development of Stacking Process for 3D TSV (Through Silicon Via) Structure using Laser

Kwang-Seong Choi; Wagno Alves Braganca, Junior; Keon-Soo Jang; Hyun-Cheol Bae; Yong-Sung Eom

View Articletitled, Development of Stacking Process for 3D TSV (Through Silicon Via) Structure using Laser

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INDUCTORS USING 2.5D SILICON INTERPOSER WITH THICK RDL AND TSV-LAST TECHNOLOGIES

G. Pares; J.-P. Michel; E. Deschaseaux; V. Pernin; A. Giry; P. Ferris; A. Serhan

View Articletitled, INDUCTORS USING 2.5D SILICON INTERPOSER WITH THICK RDL AND TSV-LAST TECHNOLOGIES

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3D Printed Metalized Plastic Waveguides for Microwave Components

Mohd Ifwat Mohd Ghazali; Kyoung Youl Park; Vincens Gjokaj; Amanpreet Kaur; Premjeet Chahal

View Articletitled, 3D Printed Metalized Plastic Waveguides for Microwave Components

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Building an EcoSystem for User-friendly Design of Advanced System in Package (SiP) Solutions

Herb Reiter

View Articletitled, Building an EcoSystem for User-friendly Design of Advanced System in Package (SiP) Solutions

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In-line advanced process control solution for the fabrication of micro-bumps

Dario Alliata; Stephane Godny; Cleonisse Serrecchia; Tristan Combier; Astrid Sippel; Philippe Gastaldo

View Articletitled, In-line advanced process control solution for the fabrication of micro-bumps

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Printed Wiring for High-Power Electric Devices by Using Ag-sinter paste

Seungjun Noh; Chanyang Choe; Chuantong Chen; Shijo Nagao; Katsuaki Suganuma

View Articletitled, Printed Wiring for High-Power Electric Devices by Using Ag-sinter paste

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3D IPD on Thru Glass Via Substrate using panel Manufacturing Technology

Takamasa Takano; Satoru Kuramochi; Hobie Yun

View Articletitled, 3D IPD on Thru Glass Via Substrate using panel Manufacturing Technology

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The IC in the Flexible Hybrid Electronics Technology: Flexibility and Bend Testing

Val R. Marinov

View Articletitled, The IC in the Flexible Hybrid Electronics Technology: Flexibility and Bend Testing

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Shielding Effectiveness Simulation of SMT EMI Gaskets Utilizing ANSYS HFSS

Christopher M. Kerwien; Charlotte Blair, PhD

View Articletitled, Shielding Effectiveness Simulation of SMT EMI Gaskets Utilizing ANSYS HFSS

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Fine Line Routing and Micro via Patterning in ABF Enabled by Excimer Laser Ablation

Habib Hichri; Shohei Fujishima; Seongkuk Lee; Markus Arendt; Shigeo Nakamura

View Articletitled, Fine Line Routing and Micro via Patterning in ABF Enabled by Excimer Laser Ablation

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Ultra-fine Line Multi-Redistribution Layers with 10 μm Pitch Micro-Vias for Wafer Level and Panel Level Packaging realized by an innovative Excimer Laser Dual Damascene Process

Robert Gernhardt; Friedrich Müller; Markus Woehrmann; Habib Hichri; Karin Hauck; Michael Toepper; Markus Arendt; Klaus-Dieter Lang

View Articletitled, Ultra-fine Line Multi-Redistribution Layers with 10 μm Pitch Micro-Vias for Wafer Level and Panel Level Packaging realized by an innovative Excimer Laser Dual Damascene Process

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Separating Temporary Carrier from Large Thin Panel with Air Jetting

Hao Tang; My Nguyen; Ming Yin

View Articletitled, Separating Temporary Carrier from Large Thin Panel with Air Jetting

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Enhanced In-Plane Heat Transport in Embedded Mini Heat Pipes PCB

Jonathan Silvano de Sousa; Paul Fulmek; Michael Unger; Peter Haumer; Johann Nicolics; Mohamad Abo Ras; Daniel May

View Articletitled, Enhanced In-Plane Heat Transport in Embedded Mini Heat Pipes PCB

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Alternative deposition solution for cost reduction of TSV integration

J. Vitiello; F. Piallat; L. Bonnet

View Articletitled, Alternative deposition solution for cost reduction of TSV integration

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Highly Reliable Cu Wiring Layer of 1/1 μm Line/Space Using Newly Designed Insulation Barrier Film

Kazuyuki Mitsukura; Shinichiro Abe; Masaya Toba; Tomonori Minegishi; Kazuhiko Kurafuchi

View Articletitled, Highly Reliable Cu Wiring Layer of 1/1 μm Line/Space Using Newly Designed Insulation Barrier Film

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Experimental Assessment of Microwave Loss Caused by Non-Hexavalent Chromium-Based Conversion Coatings

Joshua S. Petko; Philip A. Lovell; Jeremy D. Clifton; Paul H. Cohen; Karl F. Schoch, Jr.

View Articletitled, Experimental Assessment of Microwave Loss Caused by Non-Hexavalent Chromium-Based Conversion Coatings

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Characterization of Ultra-Thin Epoxy-Resin Based Dielectric Substrate for Flexible Power Electronics Applications

Xin Zhao; K. Jagannadham; Wuttichai Reainthippayasakul; Michael T. Lanagan; Douglas C. Hopkins

View Articletitled, Characterization of Ultra-Thin Epoxy-Resin Based Dielectric Substrate for Flexible Power Electronics Applications

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A Frequency Swept Low-Cost Capacitive Fringing Field PCB Sensor

Robert N. Dean

View Articletitled, A Frequency Swept Low-Cost Capacitive Fringing Field PCB Sensor

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A Generic Strategy to Assess and Mitigate Chip Package Interaction Risk Factors for Semiconductor Devices with Ultra-low k Dielectric Materials in Back End of Line

Frank Kuechenmeister; Dirk Breuer; Holm Geisler; Christian Klewer; Bjoern Boehme; Kashi Vishwanath Machani; Michael Hecker; Christian Goetze; Jae Kyu Cho; Himani Kamineni; Jens Paul; Michael Thiele

View Articletitled, A Generic Strategy to Assess and Mitigate Chip Package Interaction Risk Factors for Semiconductor Devices with Ultra-low k Dielectric Materials in Back End of Line

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Co-Simulation Based Multi-Chip Module Design Flow and Wi-Fi Module Example with Integrated BAW and LNA

Jeff Dekosky; Deepukumar Nair; Larry Carastro; Scott Knapp

View Articletitled, Co-Simulation Based Multi-Chip Module Design Flow and Wi-Fi Module Example with Integrated BAW and LNA

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Direct Measurement of Silicon Strain in a Fine Pitch Flip Chip BGA Package

Nathan Whitchurch; Glenn Rinne; Wei Lin; Devarajan Balaraman

View Articletitled, Direct Measurement of Silicon Strain in a Fine Pitch Flip Chip BGA Package

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Non-Destructive Testing for System-in-Package Integrity Analysis

Karl-Friedrich Becker; Mathias Minkus; Jeremias Pauls; Volker Bader; Steve Voges; Tanja Braun; Gerd Jungmann; Hubert Wieser; M. Schneider-Ramelow; K.-D. Lang

View Articletitled, Non-Destructive Testing for System-in-Package Integrity Analysis

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Silicon microfluidics: An enabling technology for life sciences application

Bivragh. Majeed; Lei Zhang; Giuseppe Fiorentino; Greet Verbinnen; Huma Ashraf; Edward Walsby; Kerry Roberts; Jafar Al Kuzee; Rhys Dawe; Dave Thomas; Deniz. Sabuncuoglu

View Articletitled, Silicon microfluidics: An enabling technology for life sciences application

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Reliability Analysis of a Wearable Sensor Patch (WSP) to Monitor ECG Signals

Varun Soman; Mark D. Poliks; James N. Turner; Mark Schadt; Michael Shay; Frank Egitto

View Articletitled, Reliability Analysis of a Wearable Sensor Patch (WSP) to Monitor ECG Signals

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Practical Application and Analysis of Lead-Free Solder on Chip-On-Flip-Chip SiP for Hearing Aids

Youngtak Lee; Doug Link

View Articletitled, Practical Application and Analysis of Lead-Free Solder on Chip-On-Flip-Chip SiP for Hearing Aids

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Microfabrication and Packaging Process for a Single-Chip Position, Navigation, and Timing System

Junjun Huan; Vamsy P. Chodavarapu; George Xereas; Charles Allan

View Articletitled, Microfabrication and Packaging Process for a Single-Chip Position, Navigation, and Timing System

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Plasma Dicing Process-Flows for Advanced Packaging Fabrications

Frank Wei; Tomotaka Tabuchi; Hideyuki Sando

View Articletitled, Plasma Dicing Process-Flows for Advanced Packaging Fabrications

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Investigation of Package Effects on the Edge Termination E-Field for HV WBG Power Semiconductors

Haotao Ke; Yifan Jiang; Adam J. Morgan; Douglas C. Hopkins

View Articletitled, Investigation of Package Effects on the Edge Termination E-Field for HV WBG Power Semiconductors

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Technology Transfer for MEMS and Advanced Packaging: Precision Surface Preparation Innovatively Applied to Emerging Technologies

Bob Roberts

View Articletitled, Technology Transfer for MEMS and Advanced Packaging: Precision Surface Preparation Innovatively Applied to Emerging Technologies

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Thermally Stable Ag-Ag Joints Bonded by Ultrasound-assisted Stress Migration Bonding

Hao Zhang; Norio Asatani; Yukiharu Kimoto; Aiji Suetake; Shijo Nagao; Tohru Sugahara; Katsuaki Suganuma

View Articletitled, Thermally Stable Ag-Ag Joints Bonded by Ultrasound-assisted Stress Migration Bonding

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Comparative Evaluation and Analysis of Gate Driver Impacts on a SiC MOSFET-Gate Driver Integrated Power Module

Liqi Zhang; Suxuan Guo; Pengkun Liu; Alex Q. Huang

View Articletitled, Comparative Evaluation and Analysis of Gate Driver Impacts on a SiC MOSFET-Gate Driver Integrated Power Module

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Inkjet and 3D Printing Technology for Fundamental Millimeter-Wave Wireless Packaging

Bijan K. Tehrani; Ryan A. Bahr; Manos M. Tentzeris

View Articletitled, Inkjet and 3D Printing Technology for Fundamental Millimeter-Wave Wireless Packaging

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Investigation of Wafer Level Packaging schemes for 3D RF interposer multi-chip module

Bart Vereecke; Philippe Soussan; Jian Zhu

View Articletitled, Investigation of Wafer Level Packaging schemes for 3D RF interposer multi-chip module

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Innovative Integration Solutions for SiP Packages Using Fan-Out Wafer Level eWLB Technology

Jacinta Aman Lim; Vinayak Pandey

View Articletitled, Innovative Integration Solutions for SiP Packages Using Fan-Out Wafer Level eWLB Technology

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Lighting System Packaging for Smart Underwater Reefs for Sensing, Communications, and Robotics

David Fries; Connor Tate; Tim Hutcheson; Noam Josef; David Millie

View Articletitled, Lighting System Packaging for Smart Underwater Reefs for Sensing, Communications, and Robotics

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Using SPICE to Model Nonlinearities Resulting from Heterogeneous Integration of Complex Systems

Aubrey N. Beal; Robert N. Dean

View Articletitled, Using SPICE to Model Nonlinearities Resulting from Heterogeneous Integration of Complex Systems

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Atmospheric Probe for Real Time Weather Monitoring

J. Craig Prather; Michael Bolt; Haley Harrell; Tyler Horton; John Manobianco; Mark L. Adams

View Articletitled, Atmospheric Probe for Real Time Weather Monitoring

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Environmentally Isolating Packaging for MEMS Sensors

Michael Kranz; Michael Whitley; Carl Rudd; Jeff D. Craven, II; Steven D. Clark; Robert N. Dean; George T. Flowers

View Articletitled, Environmentally Isolating Packaging for MEMS Sensors

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Encapsulation of Microelectronic Assemblies for use in Harsh Environments

H. Varner; J. Mahaffey; T. Marinis; C. DiBiasio

View Articletitled, Encapsulation of Microelectronic Assemblies for use in Harsh Environments

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Ablative Laser Patterning of Polymeric Dielectric Materials

Cristina R. Matos-Pérez; Deborah Blumenshine; Lisa M. Kirchner; Tony Flaim; Rama Puligadda; Habib Hichri; Markus Arendt; Seongkuk Lee

View Articletitled, Ablative Laser Patterning of Polymeric Dielectric Materials

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Adhesion Characteristics of Epoxy Molding Compound and Copper Leadframe Interface: Impact of Environmental Reliability Stresses

Nishant Lakhera; Sandeep Shantaram; AR Nazmus Sakib

View Articletitled, Adhesion Characteristics of Epoxy Molding Compound and Copper Leadframe Interface: Impact of Environmental Reliability Stresses

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Characterization of Silicone Gel for High Temperature Encapsulation in High Voltage WBG Power Modules

Adam Morgan; Xin Zhao; Jason Rouse; Douglas Hopkins

View Articletitled, Characterization of Silicone Gel for High Temperature Encapsulation in High Voltage WBG Power Modules

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Reliability of Coated and Alloyed Copper/Silver Ball Bonds

Sarangapani Murali; Bayaras Abito Danila; Zhang Xi

View Articletitled, Reliability of Coated and Alloyed Copper/Silver Ball Bonds

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Electrical Chip-Board Interaction (e-CBI) of Wafer Level Packaging Technology

Wei Zhao; Mark Nakamoto; Karthikeyan Dhandapani; Brian Henderson; Ron Lindley; Riko Radojcic; Urmi Ray; Aurel Gunterus; Mark Schwarz; Ahmer Syed; Vidhya Ramachandran

View Articletitled, Electrical Chip-Board Interaction (e-CBI) of Wafer Level Packaging Technology

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14nm Chip Package Interaction (CPI) Technology Development

Lei Fu; YS Low; Milind Bhagavat; Ivor Barber

View Articletitled, 14nm Chip Package Interaction (CPI) Technology Development

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2.5D FPGA-HBM Integration Challenges

Jaspreet Gandhi; Boon Ang; Tom Lee; Henley Liu; Myongseob Kim; Ho Hyung Lee; Gamal Refai-Ahmed; Hong Shi; Suresh Ramalingam

View Articletitled, 2.5D FPGA-HBM Integration Challenges

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Next Generation Xeon Server Package Architecture

Raja Swaminathan; Ram Viswanath; Sriram Srinivasan; Arun Chandrasekhar

View Articletitled, Next Generation Xeon Server Package Architecture

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High Density, Tall Cu Pillars for 3D Packaging

Tom Swarbrick; Kevin Martin; Kousuki Mori

View Articletitled, High Density, Tall Cu Pillars for 3D Packaging

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Multiphysics Performance Evaluation of Flexible Substrate Based 1.2kV SiC Half Bridge Intelligent Power Module with Stacked Dies

Xin Zhao; K. Jagannadham; Douglas C. Hopkins

View Articletitled, Multiphysics Performance Evaluation of Flexible Substrate Based 1.2kV SiC Half Bridge Intelligent Power Module with Stacked Dies

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Morphological and Electrical Stability Studies of Pt/Yttria-Stabilized Zirconia Nanocomposite Thin Film Cathodes for Microfabricated Solid Oxide Fuel Cells

Michael Rottmayer; Raj Singh; Hong Huang

View Articletitled, Morphological and Electrical Stability Studies of Pt/Yttria-Stabilized Zirconia Nanocomposite Thin Film Cathodes for Microfabricated Solid Oxide Fuel Cells

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Design of 240°C Low Voltage Power Supply

Saurabh Kulkarni

View Articletitled, Design of 240°C Low Voltage Power Supply

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Direct Aerosol Printing of Lithium-ion Batteries

Xiaowei Yu; I-Meng Chen; Susmita Sarkar; Jonghyun Park; Heng Pan; Yangtao Liu; Yan Wang; Wesley Everhart

View Articletitled, Direct Aerosol Printing of Lithium-ion Batteries

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LTCC Based Highly Integrated SiPM Module With Integrated Liquid Cooling Channels for High Resolution Molecular Imaging

Rainer Dohle; Ilaria Sacco; Thomas Rittweg; Thomas Friedrich; Gerold Henning; Jörg Goßler; Peter Fischer

View Articletitled, LTCC Based Highly Integrated SiPM Module With Integrated Liquid Cooling Channels for High Resolution Molecular Imaging

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Direct sapphire to ceramic bonding for CMOS image sensor packaging using room temperature bonding technology

H. Lundén; A. Määttänen; L. Murphy

View Articletitled, Direct sapphire to ceramic bonding for CMOS image sensor packaging using room temperature bonding technology

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Thick Film Materials for High Power Hybrid Circuits on Aluminum Nitride

Matt Sgriccia; Frank Sandoval; Ryan Persons

View Articletitled, Thick Film Materials for High Power Hybrid Circuits on Aluminum Nitride

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Embedded Passive Circuit Elements in Low Temperature Co-Fired Ceramic Substrates for Aerospace Electronics

Devin A. Smarra; Guru Subramanyam; Vamsy P. Chodavarapu; Sivaram P. Gogineni; Kenneth J. Semega; Alireza R. Behbahani

View Articletitled, Embedded Passive Circuit Elements in Low Temperature Co-Fired Ceramic Substrates for Aerospace Electronics

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Wire Bonding Looping Solutions for High Density System-in-Package (SiP)

Basil Milton; Odal Kwon; Cuong Huynh; Ivy Qin; Bob Chylak

View Articletitled, Wire Bonding Looping Solutions for High Density System-in-Package (SiP)

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High Temperature Storage Reliability of Bond Resistance of Palladium-Coated Copper Ball Bonds

Michael David Hook; Michael Mayer; Stevan Hunter

View Articletitled, High Temperature Storage Reliability of Bond Resistance of Palladium-Coated Copper Ball Bonds

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Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design

Paul Eichwald; Simon Althoff; Reinhard Schemmel; Walter Sextro; Andreas Unger; Michael Brökelmann; Matthias Hunstig

View Articletitled, Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design

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Aluminum Wedge-Wedge Bonding Using Capillary and Ball Bonder

Sarangapani Murali; Ei Phyu Phyu Theint; Hamdan Faizul Fitri; Tan Kean Tiong; Zhang Xi

View Articletitled, Aluminum Wedge-Wedge Bonding Using Capillary and Ball Bonder

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A Critical Review of Wirebond Visual Inspection Criteria

Thomas Green

View Articletitled, A Critical Review of Wirebond Visual Inspection Criteria

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Using a Metal Oxide Adhesion Layer and Wet Chemical Cu Metallization for Fine Line Pattern Formation on Glass

Michael Merschky; Fabian Michalik; Martin Thoms; Robin Taylor; Diego Reinoso-Cocina; Stephan Hotz; Patrick Brooks

View Articletitled, Using a Metal Oxide Adhesion Layer and Wet Chemical Cu Metallization for Fine Line Pattern Formation on Glass

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Direct copper metallization on TGV (Thru-Glass-Via) for high performance glass substrate

Shigeo ONITAKE; Kotoku INOUE; Masatoshi TAKAYAMA

View Articletitled, Direct copper metallization on TGV (Thru-Glass-Via) for high performance glass substrate

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A novel production process for 10 μm microvias.

Abdelghani Renbi; Jerker Delsing

View Articletitled, A novel production process for 10 μm microvias.

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Glass Solutions for Packaging and IoT

Rachel Lu; Aric Shorey

View Articletitled, Glass Solutions for Packaging and IoT

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OPTIMIZATION OF CHEMISTRY FOR A VAPOUR PHASE PROCESS TO DEFLUX NO CLEAN LEAD FREE MATERIALS ON PCBS

Patrick J. Duchi; Jonathan Cetier; Laurent Levasseur; Jaquemine Coquio; Rodrigo Aguilar

View Articletitled, OPTIMIZATION OF CHEMISTRY FOR A VAPOUR PHASE PROCESS TO DEFLUX NO CLEAN LEAD FREE MATERIALS ON PCBS

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Automotive IC probing challenges –FFI MEMS Technology meets and exceeds expectation

Ashish Bhardwaj; Amy Leong

View Articletitled, Automotive IC probing challenges –FFI MEMS Technology meets and exceeds expectation

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Journey to Success for New Analog Technologies for Texas Instruments

Mario Magaña; Basab Chatterjee; Rey Javier

View Articletitled, Journey to Success for New Analog Technologies for Texas Instruments

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Die Placement Error management for Fan out Applications using Projection Lithography

Habib Hichri; Mo Abdol; Markus Arendt

View Articletitled, Die Placement Error management for Fan out Applications using Projection Lithography

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Reduction of Thermal Stress - Part I: Passivation Thickness Optimization of Standard Surface Bump Design

Raj Sekar Sethu; Salil Hari Kulkarni; How Ung Ha; Kok Heng Soon

View Articletitled, Reduction of Thermal Stress - Part I: Passivation Thickness Optimization of Standard Surface Bump Design

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Reduction of Thermal Stress - Part II: Passivation Thickness Optimization of FLATPV Surface Bump Design

Raj Sekar Sethu; Salil Hari Kulkarni; How Ung Ha; Kok Heng Soon

View Articletitled, Reduction of Thermal Stress - Part II: Passivation Thickness Optimization of FLATPV Surface Bump Design

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Electrochemical Analysis of Aged Copper Plating Bath in Wafer Level Packaging (Part 1)

Michael Pavlov; Danni Lin; Eugene Shalyt

View Articletitled, Electrochemical Analysis of Aged Copper Plating Bath in Wafer Level Packaging (Part 1)

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Design for Reliability Analysis of Vibration-Induced Failures due to Equipment Assembly Bending Load and Vibration Responses

Josh Liew; Otto Fanini

View Articletitled, Design for Reliability Analysis of Vibration-Induced Failures due to Equipment Assembly Bending Load and Vibration Responses

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Operation of Silicon Carbide Integrated Circuits under High Temperature and Pressure

M. Barlow; A. M. Francis; J. Holmes

View Articletitled, Operation of Silicon Carbide Integrated Circuits under High Temperature and Pressure

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High-Temperature Reliability of Wire Bonds on Thick Film

Zhenzhen Shen; Aleksey Reiderman

View Articletitled, High-Temperature Reliability of Wire Bonds on Thick Film

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Durability and Reliability of Electro-Mechanical Relays for Oil and Gas

Saeed Rafie, Ph.D.; Youssef Boulaknadal

View Articletitled, Durability and Reliability of Electro-Mechanical Relays for Oil and Gas

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Thermal and Viscoelastic Properties of Underfill Using hexagonal Boron Nitride (hBN) Nanofiller

S. A. Razgaleh; Shyam Aravamudhan

View Articletitled, Thermal and Viscoelastic Properties of Underfill Using hexagonal Boron Nitride (hBN) Nanofiller

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Solderability and Reliability Evolution of No-Clean Solder Fluxes For Selective Soldering

Emmanuelle Guéné; Richard Anisko; Céline Puechagut

View Articletitled, Solderability and Reliability Evolution of No-Clean Solder Fluxes For Selective Soldering

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Characterizations of Fan-out Wafer-Level Packaging

Ming Li; Qingqian Li; John Lau; Nelson Fan; Eric Kuah; Wu Kai; Ken Cheung; Zhang Li; Kim Hwee Tan; Iris Xu; Dong Chen; Rozalia Beica; CT Ko; Henry Yang; Sze Pei Lim; Jiang Ran; Cao Xi

View Articletitled, Characterizations of Fan-out Wafer-Level Packaging

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Effective Inspection Methods for Advanced Packaging Technologies

Julia Brueckner; Michael Schwander; Moritz Jurgschat; Ramon Tuason

View Articletitled, Effective Inspection Methods for Advanced Packaging Technologies

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Implementation of Wafer Level Packaging KOZ using SU-8 as Dielectric for the Merging of WL Fan Out to Microfluidic and Biomedical Applications

André Cardoso; Raquel Pinto; Elisabete Fernandes; Steffen Kroehnert

View Articletitled, Implementation of Wafer Level Packaging KOZ using SU-8 as Dielectric for the Merging of WL Fan Out to Microfluidic and Biomedical Applications

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Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution-Layers (RDLs)

View Articletitled, Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution-Layers (RDLs)

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Photoresist Residue Detection in Advanced Packaging

Jonathan Cohen; Woo Young Han; Gurvinder Singh; Keith Best; Amy Shay; Mike Marshall

View Articletitled, Photoresist Residue Detection in Advanced Packaging

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Antenna Systems for Simultaneous Transmit and Receive (STAR) Applications

Ehab A. Etellisi; Mohamed A. Elmansouri; Dejan S. Filipovic

View Articletitled, Antenna Systems for Simultaneous Transmit and Receive (STAR) Applications

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E-Band 4-Bit Phase Shifter using SP4T Flip Chip Switches

Jia-Chi Samuel Chieh; Anh-Vu Nguyen; Jason Rowland; Satish Sharma

View Articletitled, E-Band 4-Bit Phase Shifter using SP4T Flip Chip Switches

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Planar Antenna for Terahertz Application in Fan Out Wafer Level Package

Daijiro Ishibashi; Yoshihiro Nakata

View Articletitled, Planar Antenna for Terahertz Application in Fan Out Wafer Level Package

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Fully Printed Static Gain Reconfigurable Conformal Patch Antenna Arrays

Nolan Grant; Mahdi Haghzadeh; Alkim Akyurtlu

View Articletitled, Fully Printed Static Gain Reconfigurable Conformal Patch Antenna Arrays

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Multi-factor product authentication using integrated Quick Response (QR) code pixelated antenna

John Doroshewitz; Amanpreet Kaur; Jeffrey Nanzer; Premjeet Chahal

View Articletitled, Multi-factor product authentication using integrated Quick Response (QR) code pixelated antenna

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Strength assessment for direct-sintered Al₂O₃-to-Cu joints based on damage modeling

Adrian Lis; Koji Asama; Tomoki Matsuda; Tomokazu Sano; Akio Hirose

View Articletitled, Strength assessment for direct-sintered Al<sub>2</sub>O<sub>3</sub>-to-Cu joints based on damage modeling

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Design of Experiments Approach to Evaluating the Reliability of System-in-Package Assemblies

Timothy Dittman; David Ebner; Alex Bailey

View Articletitled, Design of Experiments Approach to Evaluating the Reliability of System-in-Package Assemblies

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RELIABILITY; WHAT'S RIGHT FOR YOUR BUSINESS?

Rita Mohanty, Ph.D.

View Articletitled, RELIABILITY; WHAT'S RIGHT FOR YOUR BUSINESS?

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Surviving the Heat Wave – A presentation on thermally induced failures and reliability risks created by advancements in electronics technologies

Greg Caswell

View Articletitled, Surviving the Heat Wave – A presentation on thermally induced failures and reliability risks created by advancements in electronics technologies

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Modeling Vibration Induced Fatigue Failure of Free Standing Wire Bonds

Zhenzhen Shen; James Storey; Otto Fanini; Michael Osterman

View Articletitled, Modeling Vibration Induced Fatigue Failure of Free Standing Wire Bonds

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Reinforced Solder Technology for Increased Reliability

Tim Jensen; Sunny Neoh; Adam Murling

View Articletitled, Reinforced Solder Technology for Increased Reliability

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Stencil Print solutions for Advance Packaging Applications

Phani Vallabhajosyula, PhD

View Articletitled, Stencil Print solutions for Advance Packaging Applications

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Rapid Prototyping Tape Stencils for the Application of Solder Paste

Mimi X. Yang; Karen Dowling; Debbie Senesky; H.-S. Philip Wong

View Articletitled, Rapid Prototyping Tape Stencils for the Application of Solder Paste

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High Current Testing and Simulation for Land Grid Array Sockets

Brian Beaman; Jean Audet

View Articletitled, High Current Testing and Simulation for Land Grid Array Sockets

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Relation between relative humidity and electrical performance of electrochromic displays

Alexandre Garcia; Huiting Jin; Kjell Olafsen; Sigbjørn Kolberg; Daniel Nilsen Wright; Maaike M. Visser Taklo; Annelie Eveborn; Olle Hagel; Torbjörn Eriksson

View Articletitled, Relation between relative humidity and electrical performance of electrochromic displays

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Dark Current Leakage in Optoelectronic Hermetic Packages

Clara Dionet; Goran Perosevic; Jeff Javier; Sammie Fernandez; Taylor Hurdle; Maziar Moradi; Andrew Neely; Kevin Ma; Marwan Albarghouti

View Articletitled, Dark Current Leakage in Optoelectronic Hermetic Packages

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3D Printed Integrated Microfluidic Cooling for High Power RF Applications

Michael Craton; Mohd Ifwat Mohd Ghazali; Brian Wright; Kyoung Youl Park; Premjeet Chahal; John Papapolymerou

View Articletitled, 3D Printed Integrated Microfluidic Cooling for High Power RF Applications

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Reliable Chip & Bond Wire QA Sampling, Counting & Inspection by Implementing Multiple Magnification AOI

Hector L. Fonseca

View Articletitled, Reliable Chip & Bond Wire QA Sampling, Counting & Inspection by Implementing Multiple Magnification AOI

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Investigation & Resolution of Current Leakage Failure caused by Carbon Black Aggregation in Mold Compound

Akhilesh Kumar Singh; Teck Beng Lau; Nishant Lakhera; Hoffmann James; Boon Yew Low

View Articletitled, Investigation & Resolution of Current Leakage Failure caused by Carbon Black Aggregation in Mold Compound

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Demonstration of Embedded Cu Trench RDL using Panel Scale Lithography and Photosensitive Dry Film Polymer Dielectrics

Venky Sundaram; Fuhan Liu; Chandra Nair; Rao Tummala; Atsushi Kubo; Tomoyuki Ando; Keith Best; Corey Shay

View Articletitled, Demonstration of Embedded Cu Trench RDL using Panel Scale Lithography and Photosensitive Dry Film Polymer Dielectrics

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Reduction of Thermal Stress - Part III: UBM and Passivation Thickness Optimization

Raj Sekar Sethu; Salil Hari Kulkarni; How Ung Ha; Kok Heng Soon

View Articletitled, Reduction of Thermal Stress - Part III: UBM and Passivation Thickness Optimization

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Supply Chain Hardware Integrity for Electronics Defense (SHIELD) Using Small “Dielets”

Len Chorosinski; Venky Sundaram; Klaus Wolter; Richard Calatayud; Parrish Ralston; Scott Suko; David Fry; Nathanael Ellerhoff

View Articletitled, Supply Chain Hardware Integrity for Electronics Defense (SHIELD) Using Small “Dielets”

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A Secure Tunable LNA Design for Internet of Things

Bruce Kim; Sang-Bock Cho

View Articletitled, A Secure Tunable LNA Design for Internet of Things

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Nondestructive Imaging of Packaged Microelectronics using Pulsed Terahertz Technology

Tyler Bowman; Magda El-Shenawee

View Articletitled, Nondestructive Imaging of Packaged Microelectronics using Pulsed Terahertz Technology

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Development of Thinner POP Base Package by Die Embedded and RDL Structure

Masahiro Kyozuka; Takahiko Kiso; Hiroki Toyazaki; Koichi Tanaka; Tetsuya Koyama

View Articletitled, Development of Thinner POP Base Package by Die Embedded and RDL Structure

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Cost Comparison of Fan-out Wafer-Level Packaging to Embedded Die Packaging

Chet Palesko; Amy Lujan

View Articletitled, Cost Comparison of Fan-out Wafer-Level Packaging to Embedded Die Packaging

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Multichip Module Planarity Requirements Derived From Solder Surface Tension Models

Thomas F. Marinis; Joseph W. Soucy

View Articletitled, Multichip Module Planarity Requirements Derived From Solder Surface Tension Models

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Next Generation Chip Embedding Technology for High Efficient Mid Power Modules

Kay S. Essig; CT Chiu; Jarris Kuo; Phidia Chen; Jean-Marc Yannou

View Articletitled, Next Generation Chip Embedding Technology for High Efficient Mid Power Modules

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Ultra-fine Cu Wiring Surrounded by Electroless-Plated Ni: Effective Structure for High Insulation Reliable Wiring Applicable to Panel Level Fabrication

Masaya Toba; Kazuyuki Mitsukura; Yoshinori Ejiri; Tomonori Minegishi; Kazuhiko Kurafuchi

View Articletitled, Ultra-fine Cu Wiring Surrounded by Electroless-Plated Ni: Effective Structure for High Insulation Reliable Wiring Applicable to Panel Level Fabrication

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Challenges of Large Format Packaging and Some of Its Assembly Solutions

TH Eric Kuah; Hao Ji Yuan; Catherine Chan; Wu Kai; Nelson Fan; Li Ming; John Lau; Eric Ng; Margie Li

View Articletitled, Challenges of Large Format Packaging and Some of Its Assembly Solutions

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Flip chip reliability and design rules for SIP module

Adrien Morard; Jean-Christophe Riou; Gabriel Pares

View Articletitled, Flip chip reliability and design rules for SIP module

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Prototyping and Production of High-temperature Power Electronic Substrates through Additive Manufacturing Processes

Thomas Stoll; Aarief Syed-Khaja; Joerg Franke

View Articletitled, Prototyping and Production of High-temperature Power Electronic Substrates through Additive Manufacturing Processes

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Additive Packaging for Microwave Applications

Susan Trulli; Craig Armiento; Christopher Laighton; Elicia Harper; Mahdi Haghzadeh; Alkim Akyurtlu

View Articletitled, Additive Packaging for Microwave Applications

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The Relevance of Low Temperature Co-fired Ceramic Module Packaging in the 5G Market

Ton Schless

View Articletitled, The Relevance of Low Temperature Co-fired Ceramic Module Packaging in the 5G Market

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