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IMAPS 2018
System-level Trade-offs and Optimization for Data-Driven Applications
Pushkar Apte; Tom Salmon; Richard Rice; Mark Gerber; Patricia Macleod; Rozalia Beica; Jeff Calvert; Dave Hemker; Yezdi Dordi; Manish Ranjan; Suresh Ramalingam; Jaspreet Gandhi; Alireza Kaviani; Subhasish Mitra; Philip Wong; Vincent Lee; Mohamed M. Sabry Aly
Design, Materials, Process, and Fabrication of Fan-Out Panel-Level Heterogeneous Integration
Cheng-Ta Ko; Henry Yang; John Lau; Ming Li; Margie Li; Curry Lin; JW Lin; Chieh-Lin Chang; Jhih-Yuan Pan; Hsing-Hui Wu; YH Chen; Tony Chen; Iris Xu; Penny Lo; Nelson Fan; Eric Kuah; Zhang Li; Kim Hwee Tan; Chia-Hung Lin; Rozalia Beica; Marc Lin; Cao Xi; Sze Pei Lim; NC Lee; Mian Tao; Jeffery Lo; Ricky Lee
A comparison of the Cu electrochemical migration behavior between Cu lines with 5 um L/S realized by conventional Semi Additive Process (SAP) and an innovative Excimer Laser Damascene Pro...
Robert Gernhardt; Friedrich Müller; Markus Woehrmann; Habib Hichri; Karin Hauck; Markus Arendt; Klaus-Dieter Lang
Chip Package Interaction: Understanding of Contributing Factors in Back End of Line (BEoL) Silicon, Cu Pillar Design and Applied Process Improvements
Frank Kuechenmeister; Dirk Breuer; Holm Geisler; Bjoern Boehme; Kashi Vishwanath Machani; Michael Hecker; Sven Kosgalwies; Jae Kyu Cho; Dongming He; Xuefeng Zhang; Lily Zhao
Reliability of Fan-Out Wafer-Level Heterogeneous Integration
John Lau; Ming Li; Yang Lei; Margie Li; Iris Xu; Tony Chen; Qing Xiang Yong; Zhong Cheng; Wu Kai; Penny Lo; Zhang Li; Kim Hwee Tan; Y. M. Cheung; Nelson Fan; Eric Kuah; Cao Xi; Jiang Ran; Rozalia Beica; Sze Pei Lim; N. C. Lee; C. T. Ko; Henry Yang; Y. H. Chen; Mian Tao; Jeffery Lo; Ricky Lee
Scalable hybrid microelectronic-microfluidic integration of highly sensitive biosensors
Patrick Reinecke; Marie-Theres Putze; Leopold Georgi; Ruben Kahle; David Kaiser; Daniel Hüger; Pavel Livshits; Jens Weidenmüller; Thomas Weimann; Andrey Turchanin; Tanja Braun; Karl-Friedrich Becker; Martin Schneider-Ramelow; Klaus-Dieter Lang
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Verification of Compartmental Electromagnetic Interference Shielding Effect with imprint-Through Mold Via (i-TMV) for RF modules
Motohiro Negishi, Tomoaki Shibata, Xinrong Li, Naoya Suzuki
Emergence of Glass Solutions for 5G and Heterogeneous Integration
Aric B. Shorey, Shelby F. Nelson, David Levy, Paul Ballentine
Fine-pitch Copper Pillar Flip Chips in High Reliability Applications
Catherine Farnum, Kaysar Rahim, Ph.D.
Highly accelerated lifetime testing in power electronics
Bernhard Czerny, Golta Khatibi
Implementation of Trusted Manufacturing & AI-based process optimization into microelectronic manufacturing research environments
K.-F. Becker, S. Voges, P. Fruehauf, M. Heimann, S. Nerreter, R. Blank, M. Erdmann, S. Gottwald, A. Hofmeister, M. Hesse, M. Thies, S. Mehrafsun, R. Fust, E. Beck, J. Pawlikowski, B. Schröder, C. Voight, T. Braun, M. Schneider-Ramelow