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IMAPS 2018
System-level Trade-offs and Optimization for Data-Driven Applications
Pushkar Apte; Tom Salmon; Richard Rice; Mark Gerber; Patricia Macleod; Rozalia Beica; Jeff Calvert; Dave Hemker; Yezdi Dordi; Manish Ranjan; Suresh Ramalingam; Jaspreet Gandhi; Alireza Kaviani; Subhasish Mitra; Philip Wong; Vincent Lee; Mohamed M. Sabry Aly
Design, Materials, Process, and Fabrication of Fan-Out Panel-Level Heterogeneous Integration
Cheng-Ta Ko; Henry Yang; John Lau; Ming Li; Margie Li; Curry Lin; JW Lin; Chieh-Lin Chang; Jhih-Yuan Pan; Hsing-Hui Wu; YH Chen; Tony Chen; Iris Xu; Penny Lo; Nelson Fan; Eric Kuah; Zhang Li; Kim Hwee Tan; Chia-Hung Lin; Rozalia Beica; Marc Lin; Cao Xi; Sze Pei Lim; NC Lee; Mian Tao; Jeffery Lo; Ricky Lee
A comparison of the Cu electrochemical migration behavior between Cu lines with 5 um L/S realized by conventional Semi Additive Process (SAP) and an innovative Excimer Laser Damascene Pro...
Robert Gernhardt; Friedrich Müller; Markus Woehrmann; Habib Hichri; Karin Hauck; Markus Arendt; Klaus-Dieter Lang
Chip Package Interaction: Understanding of Contributing Factors in Back End of Line (BEoL) Silicon, Cu Pillar Design and Applied Process Improvements
Frank Kuechenmeister; Dirk Breuer; Holm Geisler; Bjoern Boehme; Kashi Vishwanath Machani; Michael Hecker; Sven Kosgalwies; Jae Kyu Cho; Dongming He; Xuefeng Zhang; Lily Zhao
Reliability of Fan-Out Wafer-Level Heterogeneous Integration
John Lau; Ming Li; Yang Lei; Margie Li; Iris Xu; Tony Chen; Qing Xiang Yong; Zhong Cheng; Wu Kai; Penny Lo; Zhang Li; Kim Hwee Tan; Y. M. Cheung; Nelson Fan; Eric Kuah; Cao Xi; Jiang Ran; Rozalia Beica; Sze Pei Lim; N. C. Lee; C. T. Ko; Henry Yang; Y. H. Chen; Mian Tao; Jeffery Lo; Ricky Lee
Scalable hybrid microelectronic-microfluidic integration of highly sensitive biosensors
Patrick Reinecke; Marie-Theres Putze; Leopold Georgi; Ruben Kahle; David Kaiser; Daniel Hüger; Pavel Livshits; Jens Weidenmüller; Thomas Weimann; Andrey Turchanin; Tanja Braun; Karl-Friedrich Becker; Martin Schneider-Ramelow; Klaus-Dieter Lang
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Verification of Compartmental Electromagnetic Interference Shielding Effect with imprint-Through Mold Via (i-TMV) for RF modules
Motohiro Negishi<span class='al-author-delim'>, </span>Tomoaki Shibata<span class='al-author-delim'>, </span>Xinrong Li<span class='al-author-delim'>, </span>Naoya Suzuki
Emergence of Glass Solutions for 5G and Heterogeneous Integration
Aric B. Shorey<span class='al-author-delim'>, </span>Shelby F. Nelson<span class='al-author-delim'>, </span>David Levy<span class='al-author-delim'>, </span>Paul Ballentine
Fine-pitch Copper Pillar Flip Chips in High Reliability Applications
Catherine Farnum<span class='al-author-delim'>, </span>Kaysar Rahim, Ph.D.
Highly accelerated lifetime testing in power electronics
Bernhard Czerny<span class='al-author-delim'>, </span>Golta Khatibi
Implementation of Trusted Manufacturing & AI-based process optimization into microelectronic manufacturing research environments
K.-F. Becker<span class='al-author-delim'>, </span>S. Voges<span class='al-author-delim'>, </span>P. Fruehauf<span class='al-author-delim'>, </span>M. Heimann<span class='al-author-delim'>, </span>S. Nerreter<span class='al-author-delim'>, </span>R. Blank<span class='al-author-delim'>, </span>M. Erdmann<span class='al-author-delim'>, </span>S. Gottwald<span class='al-author-delim'>, </span>A. Hofmeister<span class='al-author-delim'>, </span>M. Hesse<span class='al-author-delim'>, </span>M. Thies<span class='al-author-delim'>, </span>S. Mehrafsun<span class='al-author-delim'>, </span>R. Fust<span class='al-author-delim'>, </span>E. Beck<span class='al-author-delim'>, </span>J. Pawlikowski<span class='al-author-delim'>, </span>B. Schröder<span class='al-author-delim'>, </span>C. Voight<span class='al-author-delim'>, </span>T. Braun<span class='al-author-delim'>, </span>M. Schneider-Ramelow
