Volume 2018 Issue 1 | International Symposium on Microelectronics

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IMAPS 2018

A 3D System-in-Package for RF Applications

Shihwen Lu; Chanlin Yeh; Gavin Kao; YE Yeh; Harrison Chang

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“A Cross-Domain, System Planning Methodology”

Bill ACITO

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Recess in the motherboard architectures for small form factor systems

Tim Swettlen; Juan Landeros; Scott Mokler; Antonio Caputo

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Universal Connection Matrix: A Breadboard in a Package

Erik Welsh; Gene Frantz; Masood Murtuza

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System-level Trade-offs and Optimization for Data-Driven Applications

Pushkar Apte; Tom Salmon; Richard Rice; Mark Gerber; Patricia Macleod; Rozalia Beica; Jeff Calvert; Dave Hemker; Yezdi Dordi; Manish Ranjan; Suresh Ramalingam; Jaspreet Gandhi; Alireza Kaviani; Subhasish Mitra; Philip Wong; Vincent Lee; Mohamed M. Sabry Aly

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Flip chip reliability and intermetallic compounds for SIP module

Adrien Morard; Jean-Christophe Riou; Gabriel Pares

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Upscaling panel size for Cu plating on FOPLP (Fan Out Panel Level Packaging) applications to reduce manufacturing cost

Henning Hübner; Christian Ohde; Dirk Ruess

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Unlocking the full Potential of Lithography for Advanced Packaging

Jelle van der Voort; Michiel van der Stam

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Advances in Temporary Bonding and Debonding Technologies for use with Wafer-Level System-in-Package (WLSiP) and Fan-Out Wafer-Level Packaging (FOWLP) Processes

Michelle Fowler; John P. Massey; Matthew Koch; Kevin Edwards; Tanja Braun; Steve Voges; Robert Gernhardt; Markus Wohrmann

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Design, Materials, Process, and Fabrication of Fan-Out Panel-Level Heterogeneous Integration

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Fine Pitch(40μm) Integration Platform for Flexible Hybrid Electronics using Fan-Out Wafer-level Packaging

Amir Hanna; Arsalan Alam; G. Ezhilarasu; Subramanian S. Iyer

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Converter-Level Integration for Wide Band-Gap Automotive Power Electronics

C Mark Johnson; Jordi Espina; Behzad Ahmadi; Jingru Dai; Bassem Mouawad; Lee Empringham; Liliana De Lillo; Christina Dimarino

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Novel Solder Alloy with Wide Service Temperature Capability for Automotive Applications

Jie Geng; Hongwen Zhang; Francis Mutuku; Ning-Cheng Lee

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Power cycle tests of high temperature Ag sinter die-attach on metalized ceramic substrate by using micro-heater SiC chip

Dongjin Kim; Shijo Nagao; Naoki Wakasugi; Yasuyuki Yamamoto; Aiji Suetake; Tetsu Takemasa; Katsuaki Suganuma

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Perspectives of High-Temperature Pb-Free Bonding Materials

Hongwen Zhang, Ph.D.; Ning-Cheng Lee, Ph.D.

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3D Printed and Additively Manufactured RoboSiC™ for Space, Cryogenic, Laser and Nuclear Environments

William A. Goodman

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Solder-Joint Reliability of a Radar Processor for Semi-Autonomous Driving Applications

Mollie Benson; Burton Carpenter; Andrew Mawer

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Thin Core Substrate Large Size FCBGA Stress and Thermal Challenges and Characterization

PoHsien Sung; Ian Hu; Penny Yang; Avis Feng; Shouyi Chin; MengKai Shih; David Tarng; Marwan Wang; CP Hung

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fcLGA Package Assembly Qualification for Mobile Applications

Mumtaz Y. Bora

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Molding Recipe Study for MUF Solder Crack Improvement

Scott Chen; Leander Liang; Pallas Hsu; Tim Tsai; Mason Liang; Michael Shy

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Understanding Mold Compound Behavior on Flip Chip QFN Packages

Ruby Ann M. Camenforte; Jason Colte; Richard Sumalinog; Sylvester Sanchez; Jaimal Williamson

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FCCSP IMC Growth under Reliability Stress follow Automotive Criteria

Wei-Wei Liu (Xenia); Berdy Weng; Jerry Li; CK Yeh

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Fluxes Effective in Suppressing Non-Wet-Open at BGA Assembly

Fengying Zhou; Fen Chen; Ning-Cheng Lee

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A comparison of the Cu electrochemical migration behavior between Cu lines with 5 um L/S realized by conventional Semi Additive Process (SAP) and an innovative Excimer Laser Damascene Pro...

Robert Gernhardt; Friedrich Müller; Markus Woehrmann; Habib Hichri; Karin Hauck; Markus Arendt; Klaus-Dieter Lang

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The Effect of Nickel Oxidation Formed in the Interface of ENEPIG Structure for Flip Chip Technology

Chuan Lung Chuang; Min-Fong Shu; Yi-Hsiu Tseng

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Result of high accelerated stress test of organic substrates made by integrated dry process

Tomoyuki Habu; Shinichi Endo; Shintaro Yabu

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Copper Oxidation Effect in the EMC/Cu Interfacial Adhesion Improvement for a Novel Copper Interconnection Substrate Application

Min-Fong Shu; Yi-Hsiu Tseng

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Shear Strength and Thermomechanical Reliability of Sintered Ag Joints Containing low CTE Non-metal Additives for Die Attach

Guangyu Fan; Christine Labarbera; Ning-Cheng Lee; Colin Clark

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Chip Package Interaction: Understanding of Contributing Factors in Back End of Line (BEoL) Silicon, Cu Pillar Design and Applied Process Improvements

Frank Kuechenmeister; Dirk Breuer; Holm Geisler; Bjoern Boehme; Kashi Vishwanath Machani; Michael Hecker; Sven Kosgalwies; Jae Kyu Cho; Dongming He; Xuefeng Zhang; Lily Zhao

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System Co-Design Modeling Methodology of a High Speed (25Gbps) Multi-Rate 4-Channel Retimer: Simulation to Measurement Correlation

Tony Tang; Bridger Wray; Rajen Murugan

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A Systematic Approach to the Reliability Characterization of System in Package (SiP)

Karthikeyan Dhandapani; Brian Roggeman; David Rae

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System ElectroThermal Co-Design of a Zero-Drift Current-Shunt Monitor with Precision Integrated Shunt Resistor

Jie Chen; Rajen Murugan; Steven Kummerl; Usman Chaudhry; Edwin Lim; Tatsuhiro Shimizu; Thatcher Klumpp; Jack Grantham

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Sn3.2Ag0.7Cu5.5Sb Solder Alloy with High Reliability Performance up to 175C

Jie Geng; Hongwen Zhang; Francis Mutuku; Ning-Cheng Lee

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Enabling a Robust Copper Seed Etch Process for Fine Line RDL by Electroplating on a Thin PVD Seed Layer

Marvin Bernt; Paul Van Valkenburg; David Surdock; Prayudi Lianto

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Enhancements to Picosecond Acoustic Metrology for application in FO-WLP Process

M. Mehendale; R. Mair; J. Chen; J. Tan; J. Dai; P. Mukundhan; C. Kim; T. Kryman

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Optical Run-Out Correction for Improved Lithography Overlay Accuracy for FOWLP Applications

Habib Hichri; William Vis; Markus Arendt

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Reliability of Fan-Out Wafer-Level Heterogeneous Integration

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5G Systems and Packaging Opportunities

Rick Sturdivant, Ph.D.

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Systematic Design of Ka-band Transmitter Modules using the M3-Approach

Ivan Ndip; Christian Tschoban; Jacob Reyes; Brian Curran; Klaus-Dieter Lang

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Enabling High-Performance Heterogeneous Integration via Interface Standards, IP Reuse, and Modular Design

Andreas Olofsson; Daniel S. Green; Jeffrey Demmin

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Packaging and Integration Strategy for mm-Wave Products

Urmi Ray; NJ Cho; YC Kim; SW Yoon; WK Choi; Pandi Marimuthu

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Cu diffusion into the glass under bias temperature stress condition for through glass vias (TGV) applications

Hoon Kim; Ling Cai; Albert Fahey; Rajesh Vaddi; Bin Zhu; Prantik Mazumder

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Processing Through Glass Via (TGV) Interposers for Advanced Packaging

Charles Woychik; John Lauffer; David Bajkowski; Michael Gaige; Robert Edwards; Gordon Benninger; William Wilson

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Bumping Process Impact on the Chip Package Interaction (CPI) Reliability

Lei Fu; Milind Bhagavat; Ivor Barber

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High Frequency Base Materials: Laser-Material Interaction for HDI/ICP Applications

Christopher Ryder, ESI; Geoffrey Lott, ESI; Ruolin Chen, ESI; Nicolas Falletto, ESI

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Smart Passivation Materials with a Microencapsulated Liquid Metal for Self-Healing Conductors in Sustainable Electronic Devices

Kunmo Chu; Byong Gwon Song; Yongsung Kim; Chang Seung Lee

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Fabrication of an advanced epoxy based molding compound with high thermal conductivity and outstanding mechanical properties

Nazila Dadvand; Mina Dadvand; Georges Kipouros

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Advanced Build-up Materials for High Speed Transmission Application

Shiro Tatsumi; Shohei Fujishima; Hiroyuki Sakauchi

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Solderable Polymer Thick-film Conductors for Low Temperature Substrates

Seigi Suh; Ryan Persons; Doug Hargrove; Gregory Berube

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Evaluation of Low Cost, High Temperature Die and Substrate Attach Materials for Silicon Carbide (SiC) Power Modules

Sayan Seal; Brandon Passmore; Brice McPherson

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Increase Power Density and Simplify Designs Using 3-D SiP Modules

Steven Kummerl; Charles Devries; Usman Chaudhry; Chong Han Lim

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Design and demonstration of Glass Panel Embedding for 3D System Packages for heterogeneous integration applications

Siddharth Ravichandran; Shuhei Yamada; Tomonori Ogawa; Tailong Shi; Fuhan Liu; Vanessa Smet; Venky Sundaram; Rao Tummala

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Reliability of an Electronic Product Fabricated of Mass-Produced Components

E. Suhir

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Warpage Behaviors of System-in-Packages on a Substrate Strip

Eric Ouyang; Billy Ahn; SeonMo Gu; Jim Hsu; Yonghyuk Jeong; JaeMyong Kim; Susan Lin; Goran Liu; Anthony Yang

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Fine line panel level fan out changes the SiP landscape

David Fang; Michael Hsu; CC Chang; KW Chung; Alex Liu; Irving Lin; Daniel Fann

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A numerical study on mitigation of flying dies in compression molding of microelectronic packages

Marc Dreissigacker; Ole Hoelck; Joerg Bauer; Tanja Braun; Karl-Friedrich Becker; Martin Schneider-Ramelow; Klaus-Dieter Lang

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Lithographic evaluation of thin photoimageable dielectric dry film for advanced panel level packaging applications

Keith Best; Ognian Dimov; Sudmun Habib; Sanjay Malik

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Low-fire Processing and Dielectric Properties of a Binary Crystallizable Glasses+alumina System

Shih-An Tung; Jau-Ho Jean

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Mixed-Port Hybrid Parameters for High-Speed Differential Lines

A. Ege Engin; Ivan Ndip; Klaus-Dieter Lang; Jerry Aguirre

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Integration of a K-Band Receiver Front-End Using a Copper Core Printed Circuit Board

Brian Curran; Jacob Reyes; Christian Tschoban; Ivan Ndip; Klaus-Dieter Lang; Jens Leiß; Marta Martinez-Vazquez; Rens Baggen

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A Reusable 3D Printed Cavity Resonator for Liquid Sample Characterization

Saranraj Karuppuswami; Saikat Mondal; Mohd Ifwat Mohd Ghazali; Premjeet Chahal

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Design of Solder Connections for Self-Assembly of Optoelectronic Devices

Thomas F. Marinis; Joseph W. Soucy

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Reversed Pulse Plating of Silver-Cobalt for Connector Applications

Nazila Dadvand; Mina Dadvand; Georges Kipouros

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X-ray Advances in Support of Advanced Packaging – Today and Tomorrow

David Bernard

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Low D_k and D_f Photosensitive Insulation Material for Low Transmission Loss Packages

Shinichiro Abe; Kazuyuki Mitsukura; Yuki Imazu; Masaya Toba; Takashi Masuko; Kazuhiko Kurafuchi

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Ribbon Ceramics

John A. Olenick

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Reliability of Novel Ceramic Encapsulation Materials for Electronic Packaging

S. Kaessner; M.G. Scheibel; S. Behrendt; B. Boettge; K.G. Nickel

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High reliable and high bonding strength of silver sintered joints on copper surfaces by pressure sintering under air atmosphere

Ly May Chew; Wolfgang Schmitt

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Study on high temperature resistant die bonding formed by Al/Ni nano-particles composite paste

Yasunori Tanaka; Tatsumasa Wakata; Norihiro Murakawa; Tomonori Iizuka; Kohei Tatsumi

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Zinc Oxide Nanowire Sensor Packaging

Bruce Kim; Sang-Bock Cho

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Advanced Packaging for Automotive Dashboard Application

Nokibul Islam; HC Choi

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BATCH MICROWAVE PLASMA CLEANING FOR ROBUSTNESS ENHANCEMENT OF AUTOMOTIVE DEVICES: AN ALTERNATIVE TO STRIP-TYPE RADIOFREQUENCY PLASMA

Ghizelle Jane E. Abarro; Rod J. Delos Santos, Jr.; Alvin B. Denoyo; Darwin De Lazo; Manny S. Ramos

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New Photosensitive Dielectric Material for High-Density RDL with Ultra-Small Photo-Vias and High Reliability

Daichi Okamoto; Yoko Shibasaki; Daisuke Shibata; Tadahiko Hanada

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Highly Reliable Solderless Contact with Press-fit Technology for Power Modules

Minoru Egusa; Hidetoshi Ishibashi; Yoshitaka Otsubo; Masao Kikuchi; Yoshihiro Kashiba

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Photosensitive Polyimide having low loss tangent for RF application

Masao Tomikawa; Hitoshi Araki; Yohei Kiuchi; Akira Shimada

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Novel Low Temperature Curable Photo-Patternable Polyamide with High Planarity for Wafer Level Fan-Out Packaging (WLFO)

Daniel Nawrocki; Andrew Cooper; Takanori Koizumi; Shinya Inagaki; Naoki Kawamoto; Nao Honda; Kristina Markt; Milton Bernal

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A study of Sub-micron Fan-out Wafer Level Packaging solutions: Canon

Yoshio GOTO; Kosuke URUSHIHARA; Bunsuke TAKESHITA; Ken-Ichiro MORI

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Implementation of a Temperature Ramp Rate Requirement and Impact on the Packaging Processes

Randy Hamm; Daren Whitlock; Ryan Eatinger; Jeremy Stearns; Samuel Ringwood

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Novel Low Temperature Curable Photosensitive Negative-tone Polyimide with Higher Resolution and Reliability

Daisaku Matsukawa; Hiroko Yotsuyanagi; Shiori Sakakibara; Noriyuki Yamazaki; Tetsuya Enomoto; Takeharu Motobe

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When Failure is not an Option – Packaging Materials and Technologies for the Reliable Protection of Medical Electronics

Th. Zetterer; J. Herzberg; J. Baehr; K. Waxman

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Flexible PET Substrate for High Definition Printing of Polymer Thick Film Conductive Pastes

Art Dobie

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Fine Pitch Paste for System-in-Package Applications

Zhang Ruifen; Sarangapani Murali; Vinobaji Sureshkumar; Teo Lingling; Loke Chee Keong; Chan Li-San

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Elevated Stand-Off Heights in Solder Joint Interconnections of Surface Mounted IC Packages Result in Appreciable Stress and Warpage Relief

Ephraim Suhir; Sung Yi; Jennie S. Hwang; R. Ghaffarian

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Fatigue Cycling of Electrical Interconnects Dispensed on Flexible Substrate

Mohammed Alhendi; Jack P. Lombardi, III; Guvinder S. Khinda; Maan Z. Kokash; Darshana L. Weerawarne; Peter Borgesen; Mark D. Poliks; Nancy C. Stoffel; Joe Iannotti

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Analysis of Ultrasonic Welding of Mechanically Coupled Small Area Contacts for a Silicon Carbide Power Module

Kuldeep Saxena; Aryn Hays; Ivan Kao; Zach Cole

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Characterization of Fine-Pitch Interconnections (≤ 10 μm) on Silicon Interconnect Fabric for Heterogeneous Integration

SivaChandra Jangam; Adeel Bajwa; Kannan K. Thankappan; Subramanian S. Iyer

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Ultra-Fine Pitch Wedge bonding for Device Reliability Characterization

Lacey L. Badger; Nikholas G. Toledo; Derek W. Slottke; John Thomas; Miguel Alamillo; Elliott Gunnarsson; Mark L. Le Rutt; Ilan Tsameret

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Process Development of Al-alloy Wire Bonding for High-Temperature Power Electronics

Xuan Che; Tao Xu; Jason Fu; Omid Niayesh

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Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges

Andreas Unger; Matthias Hunstig; Tobias Meyer; Michael Brökelmann; Walter Sextro

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Growth of Intermetallics at Coated Silver Wire Bond Interfaces

Sarangapani Murali; Wong Chin Yeung Jason

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Wire Bonding Advances for Multi-Chip and System in Package Devices

Hui Xu; Aashish Shah; Basil Milton; Ivy Qin

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A New Method for Non-Destructive Characterization of Through Holes in Printed Circuit Boards

Sarah Czaplewski; Joe Doman; Joe Kuczynski

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Comparisons of Soldering Alloys in Large Ceramic Substrate to Metal Heatsink Attachment Application

Frank Fan Wang; William McKeague; Christina Polwarth

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Microstructure and Mechanical Properties of Pressureless Sintered Silver Die-attach Materials

Tomofumi Watanabe; Keisuke Tanaka; Masafumi Takesue

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Investigation towards the optimum of power capability, ageing stability and costs effectiveness on thick film resistor pastes for AlN ceramics

Richard Schmidt; Manja Marcinkowski; Claudia Feller; Uwe Partsch

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Mechanical Insertion and Reliability Testing of Thermal Interface Materials for Semiconductor Test and Burn-in Applications

Dave Saums; Tim Jensen; Carol Gowans; Seth Homer; Ron Hunadi

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High Performance Etchable RoHS Compliant Thick Film Gold Conductor

Samson Shahbazi; Gregg Berube; Stephanie Edwards; Ryan Persons; Caitlin Shahbazi

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Novel formaldehyde-free electroless copper for plating on next-generation substrates

Christian Wendeln; Edith Steinhäuser; Lutz Stamp; Bexy Dosse-Gomez; Elisa Langhammer; Sebastian Reiber; Sebastian Dünnebeil; Sandra Röseler

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Investigation of a proactive glass filler removal in IC substrate build up films and its effect on topography and copper adhesion reliability

Stefan Kempa; Wolfgang Friz; Florian Gaul; Ellen Habig; Laurence J. Gregoriades

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Optimization of Cupric Chloride Subtractive Etching for Cu High Density Interconnects

Alexander Lambert; Goutham Issac; Ashish Salunke; Luwen Lu; Oliver Chyan

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Development of High Temperature Tantalum Polymer Capacitors

Antony P. Chacko; James Chen; Chris Stolarski; Cristina MotaCaetano; Philip Lessner

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Development of skills and tools for micro opto-electrical integration on wafer level

Saskia Schröder; Vanessa Stenchly; Hans-Joachim Quenzer; Wolfgang Reinert

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Explore High Bonding Reliability of Cu Wire Bonded Devices under Extreme Halide Contaminated Environments

Muthappan Asokan; Joshua Caperton; Ashish Salunke; Oliver Chyan; Fei Xu

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Smart and Connected Bioelectronics for Seamless Health Monitoring and Persistent Human-Machine Interfaces

Yun-Soung Kim; Woon-Hong Yeo

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Screen Printing Fine Pitch Stretchable Silver Inks onto a Flexible Substrate for Wearable Applications

Jianbiao Pan; Malcolm Keif; Joshua Ledgerwood; Xiaoying Rong; Xuan Wang

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Scalable hybrid microelectronic-microfluidic integration of highly sensitive biosensors

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Glass Packaging for RF MEMS

Rajiv Parmar; Jay Zhang; Chris Keimel

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Electrochemical capacitance based method applied to epoxy molded devices

Paolo Rolandi; Luca Magagnin; Carlo Valzasina; Daniele De Pascalis; Alessandro Tocchio; Audrey Betty Marie Garnier; Giuseppe Filoni; Francesco Pecchia

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Assessment of Wave-Guided Ultrasonic Transducer System for Erosion-Corrosion Detection in Nuclear Applications

Aparna Aravelli; Dwayne McDaniel; Clarice Davila

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THE IMPACT OF GLASS STYLE AND ORIENTATION ON THE RELIABILITY OF SMT COMPONENTS

Maxim Serebrini; Greg Caswell

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Laser Power Supply Thermo-Structural Analysis for the Mars 2020 Rover

Juan Cepeda-Rizo; David Tuman

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RF Test Article Experiment on the Impact of Non-Hexavalent Chromium-Based Conversion Coatings on Electrical Assemblies

Joshua S. Petko; Philip A. Lovell; Jeremy D. Clifton; Alexander J. Bersani; Karl F. Schoch, Jr.

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MOCVD Copper Metallization for High Aspect Ratios TSV 3D Integration.

Sabrina Fadloun; Dean Stephens; Patrice Gergaud; Elisabeth Blanquet; Thierry Mourier; Chris Jones; Steve Burgess; Amit Rastogi

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Electrical Characterization of Low Temperature PECVD Oxides for TSV Applications

Piotr Mackowiak; Rachid Abdallah; Martin Wilke; Jash Patel; Huma Ashraf; Keith Buchanan; Klaus-Dieter Lang; Martin Schneider-Ramelow; Ha-Duong Ngo

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High Performance EMI Shielding Materials and Spraying Process Parameters for High Frequency FCBGA Application

Kisu Joo; Kyu Jae Lee; Jung Woo Hwang; Jin-Ho Yoon; Yoon-Hyun Kim; Se Young Jeong

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Applicability of Selective Laser Reflow for Thin Die Stacking

Luke A. Wentlent; James Wilcox; Mohammed Genanu

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Productivity Comparison of Wafer Transport Architectures in PVD Tools Used for Fan-Out Packaging RDL Barrier/Seed Formation

Terry Bluck; Chris Smith; Paul Werbaneth

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Ultra-Wideband High Gain Vivaldi Antennas Using Additive Manufacturing

Mohd Ifwat Mohd Ghazali; Premjeet Chahal

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Additive Manufacturing for Multi-chip Modules

Zhenzhen Shen; Aleksey Reiderman

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Aqueous Washable Thermal Resistant Coatings and Adhesives

John Moore

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