Volume 2019 Issue 1 | International Symposium on Microelectronics

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IMAPS 2019

Assembly challenges with Flip Chip multi-die and interposer-based SiP Modules

Akhilesh K Singh; Kevin M Sullivan; George R Leal; Tony Gong

View Articletitled, Assembly challenges with Flip Chip multi-die and interposer-based SiP Modules

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Prospects for automotive SiP modules applying IC assembly and packaging technology

Tomohiro Furukawa; Takahiro Kasuga; Masato Umehara; Yuka Tamadate

View Articletitled, Prospects for automotive SiP modules applying IC assembly and packaging technology

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System I/O Optimization with SoC, SiP, PCB Co-Design

Lance Wang

View Articletitled, System I/O Optimization with SoC, SiP, PCB Co-Design

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Ferrites in Transfer Molded Power SiPs – Challenges in Packaging

Tina Thomas; Marius van Dijk; Marc Dreissigacker; Stefan Hoffmann; Hans Walter; Karl-Friedrich Becker; Martin Schneider-Ramelow

View Articletitled, Ferrites in Transfer Molded Power SiPs – Challenges in Packaging

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Designing Software Configurable Chips and SIPs using Chiplets and zGlue

Jawad Nasrullah; Zhiquan Luo; Greg Taylor

View Articletitled, Designing Software Configurable Chips and SIPs using Chiplets and zGlue

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A Miniaturized Dual Band Antenna for Harmonic RFID Tag

Saikat Mondal; Saranraj Karuppuswami; Deepak Kumar; Amanpreet Kaur; Premjeet Chahal

View Articletitled, A Miniaturized Dual Band Antenna for Harmonic RFID Tag

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Low Loss Photodielectric Materials for 5G HS/HF Applications

Colin O. Hayes; Kevin Wang; Rosemary Bell; Colin Calabrese; Jeff Kong; Jennie Paik; Lingyun Wei; Kirk Thompson; Michael Gallagher; Robert K. Barr

View Articletitled, Low Loss Photodielectric Materials for 5G HS/HF Applications

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Development of Low Dk and Df polyimides for 5G application

Daisaku Matsukawa; Naoto Nagami; Kohei Mizuno; Nobuyuki Saito; Tetsuya Enomoto; Takeharu Motobe

View Articletitled, Development of Low Dk and Df polyimides for 5G application

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Optimized ECD Cu RDL Process with Via Filling Capability for Next Generation Packaging

Ralf Schmidt

View Articletitled, Optimized ECD Cu RDL Process with Via Filling Capability for Next Generation Packaging

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Low-Density Fan-Out Heterogeneous Integration of MEMS Tunable Capacitor and RF SOI Switch

Rameen Hadizadeh; Anssi Laitinen; Niko Kuusniemi; Volker Blaschke; David Molinero; Eoin O'Toole; Márcio Pinheiro

View Articletitled, Low-Density Fan-Out Heterogeneous Integration of MEMS Tunable Capacitor and RF SOI Switch

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Evaluation of Reliability of Lead-free Solders in Silver-free Hybrids

Zhenzhen Shen; Aleksey Reiderman

View Articletitled, Evaluation of Reliability of Lead-free Solders in Silver-free Hybrids

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Solder Joint Interconnections in Automotive Electronics: Design-for-Reliability and Accelerated Testing

E. Suhir; S. Yi; J. Nicolics

View Articletitled, Solder Joint Interconnections in Automotive Electronics: Design-for-Reliability and Accelerated Testing

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Hydrophobic sealing materials for harsh environmental electrical connector package applications

Hua Xia; Nelson Settles; David DeWire

View Articletitled, Hydrophobic sealing materials for harsh environmental electrical connector package applications

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A New Halogen-Free Parylene for High Performance & Reliability of Microelectronics in Harsh Environments

Rakesh Kumar; Frank Ke; Dustin England; Angie Summers; Lamar Young

View Articletitled, A New Halogen-Free Parylene for High Performance & Reliability of Microelectronics in Harsh Environments

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Package Reliability and Integrity Improvements for a Thermally Enhance Non-Conductive Die Attach Adhesive for ASIC Devices on Exposed Pad Packages

Alvin Denoyo; Darwin De Lazo; Ivan Costa; Allen Menor

View Articletitled, Package Reliability and Integrity Improvements for a Thermally Enhance Non-Conductive Die Attach Adhesive for ASIC Devices on Exposed Pad Packages

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Controlling Extrinsic Chloride Ions Effect on Copper Wirebond Reliability

Sheila F Chopin; Varughese Mathew

View Articletitled, Controlling Extrinsic Chloride Ions Effect on Copper Wirebond Reliability

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Study to Lower Cu Pillar Flip-Chip Failure Rate

Bong Rosario; Joseph Holyoak; Mohsen Haji-Rahim; Gene Lambird; Yong Wang; Kendra Lyons; Todd Johnson; Paul Makowenskyj; Brian Myers; Shannon Pan

View Articletitled, Study to Lower Cu Pillar Flip-Chip Failure Rate

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Flip Chip Joining with Quaternary Low Melting Temperature Solder Bump Fabricated with Injection Molded Solder

Takashi Hisada; Toyohiro Aoki; Eiji Nakamura; Sayuri Kohara; Hiroyuki Mori

View Articletitled, Flip Chip Joining with Quaternary Low Melting Temperature Solder Bump Fabricated with Injection Molded Solder

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Optimal Lid Design Parameters for Reducing Warpage of Flip-chip Package

Priyal Shah; Milind Bhagavat

View Articletitled, Optimal Lid Design Parameters for Reducing Warpage of Flip-chip Package

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Flip-Chip Flux Evolution

Andy Mackie; Hyoryoon Jo; Sze Pei Lim

View Articletitled, Flip-Chip Flux Evolution

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4-2-4 Laminate hotspot identification and joule heating effect assessment via thermoelectrical simulation

Zhi Yang; Kathryn C. Rivera; Janak Patel; Eric Tremble; David B. Stone; Kwang Won Choi; Edmund Blackshear

View Articletitled, 4-2-4 Laminate hotspot identification and joule heating effect assessment via thermoelectrical simulation

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FLUXES WITH DECREASED VISCOSITY AFTER REFLOW FOR FLIP-CHIP AND SIP ASSEMBLY

Runsheng Mao; Fen Chen; Ning-Cheng Lee

View Articletitled, FLUXES WITH DECREASED VISCOSITY AFTER REFLOW FOR FLIP-CHIP AND SIP ASSEMBLY

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Low thermal resistance packaging for high power electronics

Nagaraja Shashidhar; Abhijit Rao

View Articletitled, Low thermal resistance packaging for high power electronics

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Reliability of screen-printed conductors and resistors during fatigue cycling on flexible substrate

Behnam Garakani; K Udara Sandakelum Somarathna; Darshana L Weerawarne; Mark D Poliks; Azar Alizadeh

View Articletitled, Reliability of screen-printed conductors and resistors during fatigue cycling on flexible substrate

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Thin Glass Substrates with Through-Glass Vias.

Aric Shorey; Shelby Nelson; David Levy; Paul Ballentine

View Articletitled, Thin Glass Substrates with Through-Glass Vias.

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Passive Die Alignment in Glass Embedded Fan-Out Packaging

Roman Ostholt; Rafael Santos; Norbert Ambrosius; Daniel Dunker; Jean-Pol Delrue

View Articletitled, Passive Die Alignment in Glass Embedded Fan-Out Packaging

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Ultra-Thin Wafer-Level Chip Scale Packaging

Douglas Hackler; Dale Wilson; Edward Prack

View Articletitled, Ultra-Thin Wafer-Level Chip Scale Packaging

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Deformable Interconnects with Embedded Devices in Flexible Fan-Out Packages

Sk Yeahia Been Sayeed; Daniel Wilding; Jose Solis Camara; Dieff Vital; Shubhendu Bhardwaj; P. M Raj

View Articletitled, Deformable Interconnects with Embedded Devices in Flexible Fan-Out Packages

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Package Qualification Envelope for 22FDX^® Technology

Christian Klewer; Frank Kuechenmeister; Jens Paul; Dirk Breuer; Bjoern Boehme; Jae Kyu Cho; Simone Capecchi; Michael Thiele

View Articletitled, Package Qualification Envelope for 22FDX<sup>®</sup> Technology

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Cu pillar bump development for 7nm Chip package interaction (CPI) technology

Lei Fu; Milind Bhagavat; Cheryl Selvanayagam; Ken Leong; Ivor Barber

View Articletitled, Cu pillar bump development for 7nm Chip package interaction (CPI) technology

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Thermal Decoupling in Power Electronics Modules Using Thermal Pyrolytic Graphite

Riya Paul; Amol Deshpande; Fang Luo

View Articletitled, Thermal Decoupling in Power Electronics Modules Using Thermal Pyrolytic Graphite

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Mechanical Modeling and Continuous Process Improvement

Shane D. Harker; Mercedes T. Hernandez; Gene Lambird

View Articletitled, Mechanical Modeling and Continuous Process Improvement

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Development of EDA Techniques for Power Module EMI Modeling and Layout Optimization

Tristan M. Evans; Quang Le; Balaji Narayanasamy; Yarui Peng; Fang Luo; H. Alan Mantooth

View Articletitled, Development of EDA Techniques for Power Module EMI Modeling and Layout Optimization

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How Relevant is Packaging for 5G?

Ivan Ndip; Michael Töpper; Klaus-Dieter Lang

View Articletitled, How Relevant is Packaging for 5G?

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First Demonstration of Ultra-Thin Glass Panel Embedded (GPE) Package with Sheet Type Epoxy Molding Compound for 5G/mm-wave Applications

Nobuo Ogura; Siddharth Ravichandran; Tailong Shi; Atom Watanabe; Shuhei Yamada; Mohanalingam Kathaperumal; Rao Tummala

View Articletitled, First Demonstration of Ultra-Thin Glass Panel Embedded (GPE) Package with Sheet Type Epoxy Molding Compound for 5G/mm-wave Applications

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Automated Optical Inspection (AOI) for FOPLP with Simultaneous Die Placement Metrology

Burhan Ali; Mike Marshall

View Articletitled, Automated Optical Inspection (AOI) for FOPLP with Simultaneous Die Placement Metrology

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Innovative Panel Plating for Heterogeneous Integration

Richard Boulanger; Jon Hander; Robert Moon

View Articletitled, Innovative Panel Plating for Heterogeneous Integration

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Study Photo Imagable dielectric (PID) and non-PID on process, fabrication and reliability by using panel glass substrate for next generation interconnection

Chun-Hsien Chien; Chien-Chou Chen; Wen-Liang Yeh; Wei-Ti Lin; Cheng-Hui Wu; Fu-Yang Chen; Yi-Cheng Lin; Po-Chiang Wang; Jeng-Ting Li; Bo Cheng Lin; Yu-Hua Chen; Tzyy-Jang Tseng

View Articletitled, Study Photo Imagable dielectric (PID) and non-PID on process, fabrication and reliability by using panel glass substrate for next generation interconnection

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Evaluation of die to organic laminate to PCB interconnects up to 50GHz

Selaka Bulumulla; Koushik Ramachandran

View Articletitled, Evaluation of die to organic laminate to PCB interconnects up to 50GHz

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A Flexible Down-Converter for Satellite Communication in the Ka-Band

Peter Uhlig; Reinhard Kulke; Carsten Günner; Jürgen Kassner; Gregor Möllenbeck

View Articletitled, A Flexible Down-Converter for Satellite Communication in the Ka-Band

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Quasi-Half Loop Bond Wire Antennas for Emerging Wireless Communication and Radar Sensor Systems

Ivan Ndip; Thi Huyen Le; Martin Schneider-Ramelow; Klaus-Dieter Lang

View Articletitled, Quasi-Half Loop Bond Wire Antennas for Emerging Wireless Communication and Radar Sensor Systems

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LTCC slot array antenna for 5G application

Hiroyuki Takahashi; Satoshi Hirano; Daisuke Yamashita

View Articletitled, LTCC slot array antenna for 5G application

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Flip Chip Underfill RF Characterization

Robert B. Paul; A. Ege Engin; Jerry Aguirre

View Articletitled, Flip Chip Underfill RF Characterization

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A Novel Fabrication Process for High Density Silicon Capacitors by using Metal-Assisted Chemical Etching

Susumu Obata; Mitsuo Sano; Kazuo Shimokawa; Kazuhito Higuchi

View Articletitled, A Novel Fabrication Process for High Density Silicon Capacitors by using Metal-Assisted Chemical Etching

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Failure Analysis of Interconnection Fault in a PoP Module Applied for Mobile Phone

Hui Xiao; Wei Li; Gaoming Shi

View Articletitled, Failure Analysis of Interconnection Fault in a PoP Module Applied for Mobile Phone

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IMPROVE CONTROL AMIDST DIE SHRINKAGE AND 3D PACKAGE COMPLICATION

Woo Han Young; Mike Marshall

View Articletitled, IMPROVE CONTROL AMIDST DIE SHRINKAGE AND 3D PACKAGE COMPLICATION

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Development of Backside Buried Metal Layer Technology for 3D-ICs

Naoya Watanabe; Yuuki Araga; Haruo Shimamoto; Katsuya Kikuchi; Makoto Nagata

View Articletitled, Development of Backside Buried Metal Layer Technology for 3D-ICs

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Non-destructive In-line IMC Thickness Measurement Using Acoustic Metrology for 3D Stacking

M. Mehendale; L. Hou; R. Mair; M. Kotelyanskii; M. Liebens; J. Derakhshandeh; P. Mukundhan; A. Miller; E. Beyne; T. Kryman

View Articletitled, Non-destructive In-line IMC Thickness Measurement Using Acoustic Metrology for 3D Stacking

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New Thin Adhesive for High Density 2.5D Heterogeneous Device Integration with Cu-Cu Hybrid Bonding

Yasuhisa Kayaba; Yuzo Nakamura; Jun Kamada; Kazuo Kohmura

View Articletitled, New Thin Adhesive for High Density 2.5D Heterogeneous Device Integration with Cu-Cu Hybrid Bonding

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Advanced Package Design: Inter-Domain Design Methodologies

Bill Acito; IC Packaging Product Engineer

View Articletitled, Advanced Package Design: Inter-Domain Design Methodologies

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Early detection and instantaneous cause analysis of defects in interconnects by machine learning (ranking-CNN) of scattering parameter patterns

Tae Yeob Kang; Donghwan Seo; Yongchan Park; Joonki Min; Taek-Soo Kim

View Articletitled, Early detection and instantaneous cause analysis of defects in interconnects by machine learning (ranking-CNN) of scattering parameter patterns

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Control of Void Formation in Adhesively Bonded Joints

Nina S. Dytiuk; Thomas F. Marinis; Joseph W. Soucy

View Articletitled, Control of Void Formation in Adhesively Bonded Joints

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Thermal Modeling and Experimental Analysis of High Power LED using POL-kw Packaging Technology

Christopher Kapusta; Liang Yin; Kaustubh Nagarkar; Anisha Walwaikar; Krishnaswami Srihari

View Articletitled, Thermal Modeling and Experimental Analysis of High Power LED using POL-kw Packaging Technology

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Development of High Thermally Conductive Die Attach for TIM Applications

Maciej Patelka; Sho Ikeda; Koji Sasaki; Hiroki Myodo; Nortisuka Mizumura

View Articletitled, Development of High Thermally Conductive Die Attach for TIM Applications

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Contact Electroplating Technology (CET)

Igor V. Kadija

View Articletitled, Contact Electroplating Technology (CET)

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Advanced Die Saw Technology for WLCSP Reliability Enhancement

Ching Chia Chen; Yu-Po Wang; Jensen Tsai; Hsin Long Chen

View Articletitled, Advanced Die Saw Technology for WLCSP Reliability Enhancement

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Low Profile and Large Size WLCSP in IoT Applications

Tom Tang; Kuei Hsiao Kuo; Victor Lin; Kelly Chen; J.Y. Chen; B.H. Ma; Yu-Po Wang

View Articletitled, Low Profile and Large Size WLCSP in IoT Applications

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A Novel Dicing tape for WLCSP Using Stealth Dicing Through Dicing tape and Back Side Protection-Film

Kenta Furuno; Shigeyuki Yamashita; Yoji Wakayama; Naoya Saiki; Shinya Takyu

View Articletitled, A Novel Dicing tape for WLCSP Using Stealth Dicing Through Dicing tape and Back Side Protection-Film

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Cu Core Column Application for Fine Pitch 3D Mounting

Hiroki SUDO; Daisuke SOMA; Hiroshi OKADA

View Articletitled, Cu Core Column Application for Fine Pitch 3D Mounting

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Energy and Eco-Sustainability using Pressure-less Silver Sintering for RF Power Electronics

Evan A. Hueners; Richard D. Hueners; Anthony D. F. O' Sullivan; M. Redzuan Zin

View Articletitled, Energy and Eco-Sustainability using Pressure-less Silver Sintering for RF Power Electronics

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High Temperature and High Reliability Performance of Electrically Conductive Film Adhesives for RF Grounding Applications

Yuan Zhao; Doug Katze; John Wood; Bruno Tolla; Howard Yun

View Articletitled, High Temperature and High Reliability Performance of Electrically Conductive Film Adhesives for RF Grounding Applications

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Can Electrolytic Capacitors Meet the Demands of High Reliability Applications?

Greg Caswell

View Articletitled, Can Electrolytic Capacitors Meet the Demands of High Reliability Applications?

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The Case of Failure Analysis of the PCBA Wire Corrosion under High Reliability Requirements

Jie Zheng; Yabing Zou; Ying Yang; Jianghua Shen; Yingjie Zhang

View Articletitled, The Case of Failure Analysis of the PCBA Wire Corrosion under High Reliability Requirements

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Laser Etching of Gold Conductors for RF Applications

Stephanie Edwards; Ryan Persons; Steve Feltham; Jeff Howerton; Geoffrey Lott; Daniel Macko

View Articletitled, Laser Etching of Gold Conductors for RF Applications

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Analysis on Signal and Power Integrity of 2.3D Structure Organic Package

Kosuke Tsukamoto; Atsunori Kajiki; Yuji Kunimoto; Masayuki Mizuno; Manabu Nakamura; Shinji Nakazawa; Toshinori Koyama

View Articletitled, Analysis on Signal and Power Integrity of 2.3D Structure Organic Package

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A multi-pronged approach to low-pressure Cu sintering using surface-modified particles, substrate and chip metallization

Sri Krishna Bhogaraju; Omid Mokhtari; Jacopo Pascucci; Fosca Conti; Hiren R Kotadia; Gordon Elger

View Articletitled, A multi-pronged approach to low-pressure Cu sintering using surface-modified particles, substrate and chip metallization

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Characterization and Electrical Performance of Glass Diplexer Modules

Charles Woychik; John Lauffer; Scott Pollard; Raj Parmar; Michael Gaige; William Wilson; James Carey; Matthew Neely; Feng Ling; Lijun Chen

View Articletitled, Characterization and Electrical Performance of Glass Diplexer Modules

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THERMAL VALIDATIONS OF ADDITIVE MANUFACTURED NON-METALLIC HEAT SPREADING DEVICE FOR HOT SPOT MITIGATION IN POWER MODULES

Reece Whitt; David Huitink, PhD

View Articletitled, THERMAL VALIDATIONS OF ADDITIVE MANUFACTURED NON-METALLIC HEAT SPREADING DEVICE FOR HOT SPOT MITIGATION IN POWER MODULES

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Laser Sintering of Aerosol Jet Printed Interconnects on Flexible Substrate

Mohammed Alhendi; Ludovico Cestarollo; Gurvinder S. Khinda; Darshana L. Weerawarne; Mark D. Poliks

View Articletitled, Laser Sintering of Aerosol Jet Printed Interconnects on Flexible Substrate

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Semi-additive Process Based Cu Wirings with Ultra Smooth Electroless Cu Seed Layer and Important Factor for High Frequency Transmission Property

Masaya Toba; Shuji Nomoto; Nobuhito Komuro; Kazuyuki Mitsukura; Shinichiro Abe; Takashi Masuko; Kazuhiko Kurafuchi

View Articletitled, Semi-additive Process Based Cu Wirings with Ultra Smooth Electroless Cu Seed Layer and Important Factor for High Frequency Transmission Property

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Highly Miniaturized Integrated Sensor Nodes for Industry 4.0

S. Voges; K.-F. Becker; D. Schütze; B. Schröder; P. Fruehauf; M. Heimann; S. Nerreter; R. Blank; S. Gottwald; A. Hofmeister; M. Schmied; M. Kreitmair; R. Fust; W. Neifer; T. Braun; T. Thomas; M. Schneider-Ramelow; K.-D. Lang

View Articletitled, Highly Miniaturized Integrated Sensor Nodes for Industry 4.0

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Dust and Water Resistance Testing Methodology for Environmental Sensors

S. Kummerl; D. Mantle; N. Patel; R. Munje; P. Chen

View Articletitled, Dust and Water Resistance Testing Methodology for Environmental Sensors

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Understanding the Effects of Process Parameters to Compensate for Substrate Warpage in Chip on Flex (CoF) Assembly Using Conventional Reflow

Varun Soman; Vikram Venkatadri; Mark D. Poliks

View Articletitled, Understanding the Effects of Process Parameters to Compensate for Substrate Warpage in Chip on Flex (CoF) Assembly Using Conventional Reflow

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Reconfigurable mm Wave Flexible Packages with Ultra-thin Fan-Out Embedded Tunable Ceramic IPDs

Shubhendu Bhardwaj; S K Yeahia Been Sayeed; Jose Solis Camara; Dieff Vital; P. M. Raj

View Articletitled, Reconfigurable mm Wave Flexible Packages with Ultra-thin Fan-Out Embedded Tunable Ceramic IPDs

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Package Voltage Regulators: The Answer for Power Management Challenges

Joseph Meyer; Reza Moghimi; Noah Sturcken

View Articletitled, Package Voltage Regulators: The Answer for Power Management Challenges

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How to secure the fabrication of Gallium Nitride on Si wafers

D. Alliata; N. Anderson; M. Durand de Gevigney; I. Bergoend; P. Gastaldo

View Articletitled, How to secure the fabrication of Gallium Nitride on Si wafers

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Optimizing the Within Wafer Non-Uniformity at the Chemical Mechanical Planarization step in Interposers and RDL fabrication process for 3D IC stacking

Amit Kumar; Jose Chacon; Peter Gelzinis; Ankineedu Velaga

View Articletitled, Optimizing the Within Wafer Non-Uniformity at the Chemical Mechanical Planarization step in Interposers and RDL fabrication process for 3D IC stacking

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Semiconductor manufacturing strategy: Where in the world to locate a fab or cleanroom?

Stephen M. Rothrock

View Articletitled, Semiconductor manufacturing strategy: Where in the world to locate a fab or cleanroom?

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A Study of Defects in High Reliability Die Sort Applications

Sarah Parrish

View Articletitled, A Study of Defects in High Reliability Die Sort Applications

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Advanced Fiber Optic and Ultrasonic Sensor Systems for Structural Health Monitoring of Pipes in Nuclear Waste Sites

Aparna Aravelli; Michael Thompson; Dwayne McDaniel; Mathew Krutch; Mike McNeilly; Ken Imrich; Bruce Wiersma

View Articletitled, Advanced Fiber Optic and Ultrasonic Sensor Systems for Structural Health Monitoring of Pipes in Nuclear Waste Sites

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Bumping Co-planarity Collocation for Different UBM Size by Geometry Integration

Wei-Wei (Xenia) Liu; Berdy Weng; Lu-Ming Lai; Kuang-Hsiung Chen

View Articletitled, Bumping Co-planarity Collocation for Different UBM Size by Geometry Integration

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Strain Rate Sensitivity of Mixed SAC-SnBi Solder Joints

Luke A. Wentlent; James Wilcox; Xuanyi Ding

View Articletitled, Strain Rate Sensitivity of Mixed SAC-SnBi Solder Joints

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Control of Solder Bump Growing Morphology in Lead Free Plating

Berdy Weng; Wei-Wei (Xenia) Liu; Lu-Ming Lai; Kuang-Hsiung Chen

View Articletitled, Control of Solder Bump Growing Morphology in Lead Free Plating

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Nanovoid Formation at Cu/Cu/Cu Interconnections of Blind Microvias: A Field Study

T. Bernhard; L. Gregoriades; S. Branagan; L. Stamp; E. Steinhäuser; R. Schulz; F. Brüning

View Articletitled, Nanovoid Formation at Cu/Cu/Cu Interconnections of Blind Microvias: A Field Study

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A Wirebonding Instrument for Insulated and Coaxial Wires

Mitchell Meinhold; Caprice Gray; Jeffery Delisio; Ernest Kim; Christian Wells; Daniela Torres; Peter Lewis; David Hagerstrom

View Articletitled, A Wirebonding Instrument for Insulated and Coaxial Wires

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Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bonding

Reinhard Schemmel; Florian Eacock; Collin Dymel; Tobias Hemsel; Matthias Hunstig; Michael Brökelmann; Walter Sextro

View Articletitled, Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bonding

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Controlling Surface Sensitive Processes in Microelectronics Manufacturing to Improve Wire Bonded Joint Reliability

E.J. Kidd; Brooke Campbell; R. Giles Dillingham

View Articletitled, Controlling Surface Sensitive Processes in Microelectronics Manufacturing to Improve Wire Bonded Joint Reliability

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Process advantages of thermosonic wedge-wedge bonding using dosed tool heating

Matthias Hunstig; Andreas Unger; Michael Brökelmann; Hans J. Hesse

View Articletitled, Process advantages of thermosonic wedge-wedge bonding using dosed tool heating

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High bond reliability of newly developed silver alloy bonding wire

Noritoshi Araki; Motoki Eto; Takumi Ohkabe; Teruo Haibara; Takashi Yamada; Tetsuya Oyamada; Tomohiro Uno

View Articletitled, High bond reliability of newly developed silver alloy bonding wire

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On-Chip Diffusion Bonding creates Stable Interconnections Usable at Temperatures over 300°C

Jessica Richter; Anna Steenmann; Benjamin Schellscheidt; Thomas Licht

View Articletitled, On-Chip Diffusion Bonding creates Stable Interconnections Usable at Temperatures over 300°C

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“Drop-in” Conventional Reflow Oven Sinter-Able Pressure-Less Silver Paste for Die-Attach Assembly Mass Production

Sihai Chen; Evan Wernicki; Sara Wright; Christine LaBarbera; Ning-Cheng Lee

View Articletitled, “Drop-in” Conventional Reflow Oven Sinter-Able Pressure-Less Silver Paste for Die-Attach Assembly Mass Production

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Three-Dimensional Thermal Modeling and Management of System on Package with Gold and Nano Based Material

Be-nazir Khan

View Articletitled, Three-Dimensional Thermal Modeling and Management of System on Package with Gold and Nano Based Material

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Advances in Hermetic Projection Weld Sealing

Tom Salzer

View Articletitled, Advances in Hermetic Projection Weld Sealing

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A High Performance Full SiC Power Module Based On a Novel Stacked DBCs Hybrid Packaging Structure

Zhiwei Wang; Chi Zhang; Zhizhao Huang; Cai Chen; Fang Luo

View Articletitled, A High Performance Full SiC Power Module Based On a Novel Stacked DBCs Hybrid Packaging Structure

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An EMI Suppression Method in SiC Half-bridge Power Module Design

Zhiwei Wang; Chi Zhang; Yiyang Yan; Cai Chen; Yong Kang

View Articletitled, An EMI Suppression Method in SiC Half-bridge Power Module Design

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COMBINING ADVANTAGES OF RHEOMETRY AND INLINE VISCOMETRY FOR IMPROVED VISCOSITY MODELING

Jonas Strobelt; Joerg Bauer; Marc Dreissigacker; Ole Hoelck; Tanja Braun; Karl-Friedrich Becker; Martin Schneider-Ramelow; Klaus-Dieter Lang

View Articletitled, COMBINING ADVANTAGES OF RHEOMETRY AND INLINE VISCOMETRY FOR IMPROVED VISCOSITY MODELING

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Recent Advances in X-ray for Semicon Applications

Keith Bryant; Ragnar Vaga

View Articletitled, Recent Advances in X-ray for Semicon Applications

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Mechanical Insertion and Reliability Testing of Thermal Interface Materials for Semiconductor Test and Burn-in Applications

Dave Saums; Tim Jensen, Sr.; Carol Gowans; Seth Homer; Ron Hunadi

View Articletitled, Mechanical Insertion and Reliability Testing of Thermal Interface Materials for Semiconductor Test and Burn-in Applications

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A Study on Reduced/Absent Adhesion/Cap Layers for Optimized BEOL RC Performance

Dewei Xu; Zhiguo Sun; Haojun Zhang; Scott Pozder; Patrick Justison; Seung-Yeop Kook; Rod Augur; Robert Fox

View Articletitled, A Study on Reduced/Absent Adhesion/Cap Layers for Optimized BEOL RC Performance

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Design and Fabrication of 3D Printed Reconfigurable Metamaterial-inspired Structures

Saranraj Karuppuswami; Avi Rajendra-Nicolucci; Saikat Mondal; Mohd Ifwat Mohd Ghazali; Premjeet Chahal

View Articletitled, Design and Fabrication of 3D Printed Reconfigurable Metamaterial-inspired Structures

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Thin-film based passive RFID sensor tag for detection of packaged food volatiles

Saranraj Karuppuswami; Saikat Mondal; Deepak Kumar; Amanpreet Kaur; Premjeet Chahal

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Reliability analysis of bonding wire based on stacked substrate packaging structure

Chi Zhang; Yifan Tan; Zhizhao Huang; Cai Chen; Yong Kang

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Reliability of printed wire bonds

C. Marsan-Loyer; C. Sansregret

View Articletitled, Reliability of printed wire bonds

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