Skip to Main Content

header search

search input Search input auto suggest

Search

Menu

Home
About
Issues
Membership Information
Events Calendar
Contact IMAPS
Advertising
Help

Skip Nav Destination

Issues

Select Year

Select Issue

Volume 2019, Issue S2

October 2019

ISSN 1085-8024

eISSN 2380-4505

INVITED SPEAKERS 2019

“Manufacturing Technology Solution of Fan-out Packaging for Heterogeneous Integration”

Yasuhiro Morikawa

View Articletitled, “Manufacturing Technology Solution of Fan-out Packaging for Heterogeneous Integration”

Open the PDF for in another window

Recent Advances in Underfill Materials

OSAMU SUZUKI

View Articletitled, Recent Advances in Underfill Materials

Open the PDF for in another window

Driving Force and Enabling Technology for Systems of the Future

William Chen

View Articletitled, Driving Force and Enabling Technology for Systems of the Future

Open the PDF for in another window

SiP and Module

Rolf Aschenbrenner; Klaus Pressel; Andreas Grassmann

View Articletitled, SiP and Module

Open the PDF for in another window

Mobile TWG

View Articletitled, Mobile TWG

Open the PDF for in another window

Heterogeneous Integration for HPC and Data Centers

Kanad Ghose, Ph.D.; Dale Becker, Ph.D.

View Articletitled, Heterogeneous Integration for HPC and Data Centers

Open the PDF for in another window

WLP TWG

Rozalia Beica; John Hunt

View Articletitled, WLP TWG

Open the PDF for in another window

Latest
Most Read
Most Cited

Verification of Compartmental Electromagnetic Interference Shielding Effect with imprint-Through Mold Via (i-TMV) for RF modules

Motohiro Negishi, Tomoaki Shibata, Xinrong Li, Naoya Suzuki

Emergence of Glass Solutions for 5G and Heterogeneous Integration

Aric B. Shorey, Shelby F. Nelson, David Levy, Paul Ballentine

Fine-pitch Copper Pillar Flip Chips in High Reliability Applications

Catherine Farnum, Kaysar Rahim, Ph.D.

Highly accelerated lifetime testing in power electronics

Bernhard Czerny, Golta Khatibi

Implementation of Trusted Manufacturing & AI-based process optimization into microelectronic manufacturing research environments

K.-F. Becker, S. Voges, P. Fruehauf, M. Heimann, S. Nerreter, R. Blank, M. Erdmann, S. Gottwald, A. Hofmeister, M. Hesse, M. Thies, S. Mehrafsun, R. Fust, E. Beck, J. Pawlikowski, B. Schröder, C. Voight, T. Braun, M. Schneider-Ramelow

IMAPS.org
Events Calendar
Contact
Advertising

eISSN 2380-4505
ISSN 1085-8024

Privacy Policy
Get Adobe Acrobat Reader
Support

This Feature Is Available To Subscribers Only

Sign In or Create an Account

This site uses cookies. By continuing to use our website, you are agreeing to our privacy policy.

Accept