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The International Symposium on Microelectronics is organized by IMAPS on an annual basis (every Fall) and it is the signature event of the Society. Recent symposia feature more than 25-30 sessions with 175 technical speakers publishing peer-reviewed proceedings papers. The meeting began in 1967 under the organization of ISHM, which merged with IEPS in 1996 to form IMAPS. The Technical Committee of the Society recruits original papers that present progress on technologies throughout the entire microelectronics/packaging supply chain. The Symposium features 5-6 technical tracks that span three days of sessions on a wide-range of cutting-edge technology, including: INTERNET OF THINGS/Future or Emerging Packaging; INTERPOSERS & 2.5/3D PACKAGING; ADVANCED PACKAGING AND ENABLING TECHNOLOGIES; ADVANCED MATERIALS & PROCESSES; MODELING, DESIGN, TEST; and RELIABILITY. The symposium also features an exhibition, Interactive Poster Session, Global Business Council Marketing Forum, numerous Keynote Speakers, Panels, and more.

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