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Bernd Scholz
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Journal Articles

A Novel Metal Core Substrate with Simplified Manufacturing Process and High Adhesion Conformal Dielectric and Circuitry Metal for High Density Chip-Scale Packaging Applications

Open Access
Syed Sajid Ahmad, John Jacobson, Zane Johnson, Kevin Mattson, Aaron Reinholz ...
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2010) 2010 (1): 000638–000645.
https://doi.org/10.4071/isom-2010-WP3-Paper5
Published: 01 January 2010
View articletitled, A Novel Metal Core Substrate with Simplified Manufacturing Process and High Adhesion Conformal Dielectric and Circuitry Metal for High Density Chip-Scale Packaging Applications
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Journal Articles

Tape-Peel Testing as a Simple Method to Evaluate the Adhesion of Coated Layers on Metal Core PCB

Open Access
Bernd Scholz, Ismir Pekmic, Syed Sajid Ahmad, Aaron Reinholz
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2010) 2010 (1): 000127–000130.
https://doi.org/10.4071/isom-2010-TA4-Paper4
Published: 01 January 2010
View articletitled, Tape-Peel Testing as a Simple Method to Evaluate the Adhesion of Coated Layers on Metal Core PCB
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Journal Articles

Fabrication of Tall Structures for Microelectronics Application Using Selective Electrodeposition Process

Open Access
Bernd Scholz, WeiYang Lim, Ferdous Sarwar, Syed Sajid Ahmad, Aaron Reinholz
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2010) 2010 (1): 000947–000953.
https://doi.org/10.4071/isom-2010-THA5-Paper7
Published: 01 January 2010
View articletitled, Fabrication of Tall Structures for Microelectronics Application Using Selective Electrodeposition Process
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Journal Articles

High via density thin metal-core PCB using electro-coated dielectric

Open Access
Bernd Scholz, Ismir Pekmic, Syed Sajid Ahmad, Aaron Reinholz
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2010) 2010 (1): 000615–000621.
https://doi.org/10.4071/isom-2010-WP3-Paper2
Published: 01 January 2010
View articletitled, High via density thin metal-core PCB using electro-coated dielectric
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Journal Articles

Characterization of Substrate Materials For End-Use Environment Classification

Open Access
Syed Sajid Ahmad, Arun Shankaran, Fred Haring, Justin Vignes, Bernd Scholz ...
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2010) 2010 (1): 000076–000083.
https://doi.org/10.4071/isom-2010-TA3-Paper3
Published: 01 January 2010
View articletitled, Characterization of Substrate Materials For End-Use Environment Classification
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