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Brian J. Lewis
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Journal Articles

Wafer Level Assembly Technique Development for Fine Pitch Flip Chip 3D Die-to-Wafer Integration

Open Access
Zhaozhi Li, Brian J. Lewis, Paul N. Houston, Daniel F. Baldwin, Eugene A. Stout ...
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2010) 2010 (1): 000548–000553.
https://doi.org/10.4071/isom-2010-WP1-Paper3
Published: 01 January 2010
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