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Journal Articles

Practical Application and Analysis of Lead-Free Solder on Chip-On-Flip-Chip SiP for Hearing Aids

Open Access
Youngtak Lee, Doug Link
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2017) 2017 (1): 000201–000207.
https://doi.org/10.4071/isom-2017-WA24_104
Published: 01 October 2017
View articletitled, Practical Application and Analysis of Lead-Free Solder on Chip-On-Flip-Chip SiP for Hearing Aids
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Journal Articles

Comparative Modeling and Analysis of Lead-Free Solder Extrusion for the Design of Reliability

Open Access
Youngtak Lee, Doug Link
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2016) 2016 (1): 000111–000116.
https://doi.org/10.4071/isom-2016-TP53
Published: 01 October 2016
View articletitled, Comparative Modeling and Analysis of Lead-Free Solder Extrusion for the Design of Reliability
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Journal Articles

SIP with TSV for Class 1 Medical Devices

Open Access
Doug Link
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2014) 2014 (1): 000313–000318.
https://doi.org/10.4071/isom-TP51
Published: 01 October 2014
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Journal Articles

Improved Design of a High Density 3D Multichip Module for Class I Medical Devices

Open Access
Doug Link, Michael Kollar
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2010) 2010 (1): 000119–000126.
https://doi.org/10.4071/isom-2010-TA4-Paper3
Published: 01 January 2010
View articletitled, Improved Design of a High Density 3D Multichip Module for Class I Medical Devices
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