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1-5 of 5
Hongwen Zhang
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Journal Articles
A Novel Design of High-Temperature Lead-Free Solders for Die-Attachment in Power Discrete Applications
Open Access
International Symposium on Microelectronics (2022) 2021 (1): 000356–000361.
Published: 16 February 2022
Journal Articles
International Symposium on Microelectronics (2018) 2018 (1): 000075–000083.
Published: 01 October 2018
Journal Articles
International Symposium on Microelectronics (2018) 2018 (1): 000088–000098.
Published: 01 October 2018
Journal Articles
International Symposium on Microelectronics (2018) 2018 (1): 000198–000206.
Published: 01 October 2018
Journal Articles
International Symposium on Microelectronics (2012) 2012 (1): 000119–000126.
Published: 01 January 2012