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Journal Articles

A Novel Design of High-Temperature Lead-Free Solders for Die-Attachment in Power Discrete Applications

Hongwen Zhang, Samuel Lytwynec, Huaguang Wang, Jie Geng, Francis Mutuku ...
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2022) 2021 (1): 000356–000361.
https://doi.org/10.4071/1085-8024-2021.1.000356
Published: 16 February 2022
View article titled, A Novel Design of High-Temperature Lead-Free Solders for Die-Attachment in Power Discrete Applications
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Journal Articles

Novel Solder Alloy with Wide Service Temperature Capability for Automotive Applications

Jie Geng, Hongwen Zhang, Francis Mutuku, Ning-Cheng Lee
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2018) 2018 (1): 000075–000083.
https://doi.org/10.4071/2380-4505-2018.1.000075
Published: 01 October 2018
View article titled, Novel Solder Alloy with Wide Service Temperature Capability for Automotive Applications
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Journal Articles

Perspectives of High-Temperature Pb-Free Bonding Materials

Hongwen Zhang, Ph.D., Ning-Cheng Lee, Ph.D.
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2018) 2018 (1): 000088–000098.
https://doi.org/10.4071/2380-4505-2018.1.000088
Published: 01 October 2018
View article titled, Perspectives of High-Temperature Pb-Free Bonding Materials
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Journal Articles

Sn3.2Ag0.7Cu5.5Sb Solder Alloy with High Reliability Performance up to 175C

Jie Geng, Hongwen Zhang, Francis Mutuku, Ning-Cheng Lee
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2018) 2018 (1): 000198–000206.
https://doi.org/10.4071/2380-4505-2018.1.000198
Published: 01 October 2018
View article titled, Sn3.2Ag0.7Cu5.5Sb Solder Alloy with High Reliability Performance up to 175C
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Journal Articles

HIGH RELIABILITY HIGH MELTING LEAD-FREE MIXED BIAGX SOLDER PASTE SYSTEM

HongWen Zhang, Ning-Cheng Lee
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2012) 2012 (1): 000119–000126.
https://doi.org/10.4071/isom-2012-TA43
Published: 01 January 2012
View article titled, HIGH RELIABILITY HIGH MELTING LEAD-FREE MIXED BIAGX SOLDER PASTE SYSTEM
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