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Horst Clauberg
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Journal Articles

Assembly Equipment Requirements for Next Generation Advanced Packaging

Bob Chylak, Horst Clauberg, Tom Strothmann
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2016) 2016 (1): 000321–000325.
https://doi.org/10.4071/isom-2016-WP35
Published: 01 October 2016
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Journal Articles

High Productivity Thermo-Compression Flip Chip Bonding

Tom Colosimo, Horst Clauberg, Evan Galipeau, Matthew B. Wasserman, Michael Schmidt-Lange ...
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2014) 2014 (1): 000100–000106.
https://doi.org/10.4071/isom-TA41
Published: 01 October 2014
View article titled, High Productivity Thermo-Compression Flip Chip Bonding
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Journal Articles

Copper Wire Bonding: R&D to High Volume Manufacturing

Bob Chylak, Horst Clauberg, John Foley, Ivy Qin
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2012) 2012 (1): 000638–000649.
https://doi.org/10.4071/isom-2012-WA41
Published: 01 January 2012
View article titled, Copper Wire Bonding: R&D to High Volume Manufacturing
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Journal Articles

Pd-coated Cu Wire Bonding Reliability Requirement for Device Design, Process Optimization and Testing

Inderjit Singh, Shin Low, Syu Fu Song, Chen Shih Jung, Lin Ming San ...
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2012) 2012 (1): 000396–000404.
https://doi.org/10.4071/isom-2012-TP42
Published: 01 January 2012
View article titled, Pd-coated Cu Wire Bonding Reliability Requirement for Device Design, Process Optimization and Testing
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Journal Articles

Ageing characteristics of Cu Wire Bonds on Palladium Surface Finishes

Mustafa Oezkoek, Horst Clauberg, Hugh Roberts
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2011) 2011 (1): 000566–000570.
https://doi.org/10.4071/isom-2011-WA4-Paper1
Published: 01 January 2011
View article titled, Ageing characteristics of Cu Wire Bonds on Palladium Surface Finishes
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Journal Articles

A Method to Quickly Measure the Thickness of Aluminum Bond Pad on Silicon Substrate

Son Nguyen, Z. Joan Delalic, Horst Clauberg
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2010) 2010 (1): 000682–000686.
https://doi.org/10.4071/isom-2010-WP4-Paper6
Published: 01 January 2010
View article titled, A Method to Quickly Measure the Thickness of Aluminum Bond Pad on Silicon Substrate
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