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Journal Articles

Wire Bonding Advances for Multi-Chip and System in Package Devices

Open Access
Hui Xu, Aashish Shah, Basil Milton, Ivy Qin
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2018) 2018 (1): 000583–000588.
https://doi.org/10.4071/2380-4505-2018.1.000583
Published: 01 October 2018
View articletitled, Wire Bonding Advances for Multi-Chip and System in Package Devices
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Journal Articles

Wire Bonding Looping Solutions for High Density System-in-Package (SiP)

Open Access
Basil Milton, Odal Kwon, Cuong Huynh, Ivy Qin, Bob Chylak
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2017) 2017 (1): 000426–000431.
https://doi.org/10.4071/isom-2017-WP41_151
Published: 01 October 2017
View articletitled, Wire Bonding Looping Solutions for High Density System-in-Package (SiP)
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Journal Articles

Advances in Wire Bonding Technology for Overhang Applications

Open Access
Aashish Shah, Gary Schulze, Nestor Mendoza, J.H. Yang, Rob Ellenberg ...
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2016) 2016 (1): 000456–000462.
https://doi.org/10.4071/isom-2016-THA36
Published: 01 October 2016
View articletitled, Advances in Wire Bonding Technology for Overhang Applications
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Journal Articles

Advances in Wire Bonding Technology for Different Bonding Wire Material

Open Access
Ivy Qin, Aashish Shah, Hui Xu, Bob Chylak, Nelson Wong
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2015) 2015 (1): 000406–000412.
https://doi.org/10.4071/isom-2015-WP33
Published: 01 October 2015
View articletitled, Advances in Wire Bonding Technology for Different Bonding Wire Material
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Journal Articles

Fine Pitch Cu Wire Bonding Capability – Process Optimization and Reliability Study

Open Access
Ivy Qin, Hui Xu, Cuong Huynh, Bob Chylak, Hidenori Abe ...
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2014) 2014 (1): 000283–000288.
https://doi.org/10.4071/isom-TP43
Published: 01 October 2014
View articletitled, Fine Pitch Cu Wire Bonding Capability – Process Optimization and Reliability Study
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Journal Articles

Copper Wire Bonding: R&D to High Volume Manufacturing

Open Access
Bob Chylak, Horst Clauberg, John Foley, Ivy Qin
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2012) 2012 (1): 000638–000649.
https://doi.org/10.4071/isom-2012-WA41
Published: 01 January 2012
View articletitled, Copper Wire Bonding: R&D to High Volume Manufacturing
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Journal Articles

Pd-coated Cu Wire Bonding Reliability Requirement for Device Design, Process Optimization and Testing

Open Access
Inderjit Singh, Shin Low, Syu Fu Song, Chen Shih Jung, Lin Ming San ...
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2012) 2012 (1): 000396–000404.
https://doi.org/10.4071/isom-2012-TP42
Published: 01 January 2012
View articletitled, Pd-coated Cu Wire Bonding Reliability Requirement for Device Design, Process Optimization and Testing
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