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Jerry Aguirre
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Journal Articles

Flip Chip Underfill RF Characterization

Open Access
Robert B. Paul, A. Ege Engin, Jerry Aguirre
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2019) 2019 (1): 000243–000247.
https://doi.org/10.4071/2380-4505-2019.1.000243
Published: 01 October 2019
View articletitled, Flip Chip Underfill RF Characterization
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Journal Articles

Mixed-Port Hybrid Parameters for High-Speed Differential Lines

Open Access
A. Ege Engin, Ivan Ndip, Klaus-Dieter Lang, Jerry Aguirre
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2018) 2018 (1): 000380–000383.
https://doi.org/10.4071/2380-4505-2018.1.000380
Published: 01 October 2018
View articletitled, Mixed-Port Hybrid Parameters for High-Speed Differential Lines
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Journal Articles

Electrical Characterization of Low-Profile Copper Foil for Reduced Surface Roughness Loss

Open Access
Qianfei Su, A. Ege Engin, Jerry Aguirre
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2016) 2016 (1): 000358–000363.
https://doi.org/10.4071/isom-2016-WP52
Published: 01 October 2016
View articletitled, Electrical Characterization of Low-Profile Copper Foil for Reduced Surface Roughness Loss
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Journal Articles

Ceramic Process Variation Impact on Electrical Design Of High Frequency Components

Open Access
Jerry Aguirre, Heather Tallo, Hide Shigenobu, Joe Uyesugi
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2014) 2014 (1): 000205–000212.
https://doi.org/10.4071/isom-TP21
Published: 01 October 2014
View articletitled, Ceramic Process Variation Impact on Electrical Design Of High Frequency Components
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Journal Articles

Radiation Mechanisms and Electromagnetic Interference in Ceramic Electronic Packages

Open Access
Jerry Aguirre, Marcos Vargas, Paul Garland
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2012) 2012 (1): 000628–000637.
https://doi.org/10.4071/isom-2012-WA36
Published: 01 January 2012
View articletitled, Radiation Mechanisms and Electromagnetic Interference in Ceramic Electronic Packages
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Journal Articles

Comparison Between Multilayer Ceramic and Organic Package Substrates Based Upon Signal and Power Integrity

Open Access
Jerry Aguirre, Paul Garland, Marcos Vargas, Heather Tallo, Joseph Tallo
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2011) 2011 (1): 000905–000913.
https://doi.org/10.4071/isom-2011-THA1-Paper6
Published: 01 January 2011
View articletitled, Comparison Between Multilayer Ceramic and Organic Package Substrates Based Upon Signal and Power Integrity
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