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John Persic
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Journal Articles

Thermal Aging Behavior of Fine Pitch Palladium Coated Silver (PCS) Ball Bonds on Al Metallization

Open Access
Di Erick Xu, Jimy Gomes, Michael Mayer, Rob Lyn, John Persic
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2015) 2015 (1): 000298–000304.
https://doi.org/10.4071/isom-2015-WA53
Published: 01 October 2015
View articletitled, Thermal Aging Behavior of Fine Pitch Palladium Coated Silver (PCS) Ball Bonds on Al Metallization
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Journal Articles

Wire Bonding UPH and Stitch Bond Improvement using 20 Micron Diameter Insulated Wire with Security Bump

Open Access
Chunyan Nan, Michael Mayer, Y. Norman Zhou, Jairus L. Pisigan, John Persic ...
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2010) 2010 (1): 000667–000674.
https://doi.org/10.4071/isom-2010-WP4-Paper4
Published: 01 January 2010
View articletitled, Wire Bonding UPH and Stitch Bond Improvement using 20 Micron Diameter Insulated Wire with Security Bump
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