1-7 of 7
Katsuaki Suganuma
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Power cycle tests of high temperature Ag sinter die-attach on metalized ceramic substrate by using micro-heater SiC chip

Open Access
Dongjin Kim, Shijo Nagao, Naoki Wakasugi, Yasuyuki Yamamoto, Aiji Suetake ...
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2018) 2018 (1): 000084–000087.
https://doi.org/10.4071/2380-4505-2018.1.000084
Published: 01 October 2018
View articletitled, Power cycle tests of high temperature Ag sinter die-attach on metalized ceramic substrate by using micro-heater SiC chip
Open the PDF for Power cycle tests of high temperature Ag sinter die-attach on metalized ceramic substrate by using micro-heater SiC chip in another window
Journal Articles

Power cycle reliability of SiC devices with metal-sinter die-attach and thermostable molding

Open Access
Shijo Nagao, Hirofumi Fujita, Akio Shimoyama, Shinya Seki, Hao Zhang ...
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2017) 2017 (1): 000008–000012.
https://doi.org/10.4071/isom-2017-TP12_024
Published: 01 October 2017
View articletitled, Power cycle reliability of SiC devices with metal-sinter die-attach and thermostable molding
Open the PDF for Power cycle reliability of SiC devices with metal-sinter die-attach and thermostable molding in another window
Journal Articles

Printed Wiring for High-Power Electric Devices by Using Ag-sinter paste

Open Access
Seungjun Noh, Chanyang Choe, Chuantong Chen, Shijo Nagao, Katsuaki Suganuma
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2017) 2017 (1): 000093–000096.
https://doi.org/10.4071/isom-2017-TP36_052
Published: 01 October 2017
View articletitled, Printed Wiring for High-Power Electric Devices by Using Ag-sinter paste
Open the PDF for Printed Wiring for High-Power Electric Devices by Using Ag-sinter paste in another window
Journal Articles

Thermally Stable Ag-Ag Joints Bonded by Ultrasound-assisted Stress Migration Bonding

Open Access
Hao Zhang, Norio Asatani, Yukiharu Kimoto, Aiji Suetake, Shijo Nagao ...
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2017) 2017 (1): 000242–000246.
https://doi.org/10.4071/isom-2017-WA34_020
Published: 01 October 2017
View articletitled, Thermally Stable Ag-Ag Joints Bonded by Ultrasound-assisted Stress Migration Bonding
Open the PDF for Thermally Stable Ag-Ag Joints Bonded by Ultrasound-assisted Stress Migration Bonding in another window
Journal Articles

Solder electromigration behavior in Cu/electroless Ni–P plating/Sn–Cu based joint system at low current densities

Open Access
Takuya Kadoguchi, Kimihiro Yamanaka, Shijo Nagao, Katsuaki Suganuma
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2015) 2015 (1): 000141–000146.
https://doi.org/10.4071/isom-2015-TP53
Published: 01 October 2015
View articletitled, Solder electromigration behavior in Cu/electroless Ni–P plating/Sn–Cu based joint system at low current densities
Open the PDF for Solder electromigration behavior in Cu/electroless Ni–P plating/Sn–Cu based joint system at low current densities in another window
Journal Articles

High Thermal Stability of SiC Packaging with Sintered Ag Paste Die-attach combined with Imide-based Molding

Open Access
Shijo Nagao, Takuo Sugioka, Satoshi Ogawa, Teruhisa Fujibayashi, Zhang Hao ...
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2015) 2015 (1): 000349–000352.
https://doi.org/10.4071/isom-2015-WP15
Published: 01 October 2015
View articletitled, High Thermal Stability of SiC Packaging with Sintered Ag Paste Die-attach combined with Imide-based Molding
Open the PDF for High Thermal Stability of SiC Packaging with Sintered Ag Paste Die-attach combined with Imide-based Molding in another window
Journal Articles

Effects of crystallographic orientation of Sn on electromigration behavior

Open Access
Kiju Lee, Keun-Soo Kim, Kimihiro Yamanaka, Yutaka Tsukada, Soichi Kuritani ...
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2010) 2010 (1): 000792–000797.
https://doi.org/10.4071/isom-2010-THA2-Paper2
Published: 01 January 2010
View articletitled, Effects of crystallographic orientation of Sn on electromigration behavior
Open the PDF for Effects of crystallographic orientation of Sn on electromigration behavior in another window