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Journal Articles

Lithographic evaluation of thin photoimageable dielectric dry film for advanced panel level packaging applications

Open Access
Keith Best, Ognian Dimov, Sudmun Habib, Sanjay Malik
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2018) 2018 (1): 000361–000364.
https://doi.org/10.4071/2380-4505-2018.1.000361
Published: 01 October 2018
View articletitled, Lithographic evaluation of thin photoimageable dielectric dry film for advanced panel level packaging applications
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Journal Articles

Photoresist Residue Detection in Advanced Packaging

Open Access
Jonathan Cohen, Woo Young Han, Gurvinder Singh, Keith Best, Amy Shay ...
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2017) 2017 (1): 000584–000589.
https://doi.org/10.4071/isom-2017-THA36_058
Published: 01 October 2017
View articletitled, Photoresist Residue Detection in Advanced Packaging
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Journal Articles

Demonstration of Embedded Cu Trench RDL using Panel Scale Lithography and Photosensitive Dry Film Polymer Dielectrics

Open Access
Venky Sundaram, Fuhan Liu, Chandra Nair, Rao Tummala, Atsushi Kubo ...
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2017) 2017 (1): 000689–000693.
https://doi.org/10.4071/isom-2017-THP13_159
Published: 01 October 2017
View articletitled, Demonstration of Embedded Cu Trench RDL using Panel Scale Lithography and Photosensitive Dry Film Polymer Dielectrics
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Journal Articles

PHOTOLITHOGRAPHY ALIGNMENT MARK TRANSFER SYSTEM FOR LOW COST ADVANCED PACKAGING AND BONDED WAFER APPLICATIONS

Open Access
Keith Best, Steve Gardner, Casey Donaher
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2016) 2016 (1): 000315–000320.
https://doi.org/10.4071/isom-2016-WP34
Published: 01 October 2016
View articletitled, PHOTOLITHOGRAPHY ALIGNMENT MARK TRANSFER SYSTEM FOR LOW COST ADVANCED PACKAGING AND BONDED WAFER APPLICATIONS
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Journal Articles

Advanced lithography and electroplating approach to form high-aspect ratio copper pillars

Open Access
Keith Best, Roger McCleary, Richard Hollman, Phillip Holmes
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2015) 2015 (1): 000793–000798.
https://doi.org/10.4071/isom-2015-THP23
Published: 01 October 2015
View articletitled, Advanced lithography and electroplating approach to form high-aspect ratio copper pillars
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