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1-9 of 9
Kunmo Chu
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Journal Articles
International Symposium on Microelectronics (2018) 2018 (1): 000293–000297.
Published: 01 October 2018
Journal Articles
Investigation of the Defect Size and Density in Thin SiON Filmfor Organic Device Encapsulation
Open Access
International Symposium on Microelectronics (2016) 2016 (1): 000272–000276.
Published: 01 October 2016
Journal Articles
Correlation between Thermo-mechanical Reliability and Superhydrophobic Nature of CNT Composite Coatings
Open Access
International Symposium on Microelectronics (2014) 2014 (1): 000086–000091.
Published: 01 October 2014
Journal Articles
The Characteristics of Cu/Sn/Cu and Ni/Sn/Ni Sandwich Solder Systems for Gold-free Wafer Bonding Technology
Open Access
International Symposium on Microelectronics (2014) 2014 (1): 000593–000597.
Published: 01 October 2014
Journal Articles
Low temperature Si-Si, SiO 2 -SiO 2 covalent bonding structures with thin siloxane layer
Open Access
International Symposium on Microelectronics (2013) 2013 (1): 000424–000428.
Published: 01 January 2013
Journal Articles
International Symposium on Microelectronics (2012) 2012 (1): 000084–000088.
Published: 01 January 2012
Journal Articles
Highly Conducting Carbon Nanotube Composite for Light-Weight Electric Heating Unit Applications
Open Access
International Symposium on Microelectronics (2012) 2012 (1): 000366–000370.
Published: 01 January 2012
Journal Articles
International Symposium on Microelectronics (2012) 2012 (1): 000371–000375.
Published: 01 January 2012
Journal Articles
International Symposium on Microelectronics (2011) 2011 (1): 000857–000860.
Published: 01 January 2011