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Journal Articles

Filling and Planarizing Deep Trenches with Polymeric Material for Through-Silicon Via Technology

Open Access
R.K. Trichur, M. Fowler, J.W. McCutcheon, M. Daily
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2010) 2010 (1): 000192–000196.
https://doi.org/10.4071/isom-2010-TP1-Paper6
Published: 01 January 2010
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