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M. Mehendale
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Journal Articles

Non-destructive In-line IMC Thickness Measurement Using Acoustic Metrology for 3D Stacking

Open Access
M. Mehendale, L. Hou, R. Mair, M. Kotelyanskii, M. Liebens ...
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2019) 2019 (1): 000274–000279.
https://doi.org/10.4071/2380-4505-2019.1.000274
Published: 01 October 2019
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Journal Articles

Enhancements to Picosecond Acoustic Metrology for application in FO-WLP Process

Open Access
M. Mehendale, R. Mair, J. Chen, J. Tan, J. Dai ...
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2018) 2018 (1): 000212–000216.
https://doi.org/10.4071/2380-4505-2018.1.000212
Published: 01 October 2018
View articletitled, Enhancements to Picosecond Acoustic Metrology for application in FO-WLP Process
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