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Journal Articles

Ferrites in Transfer Molded Power SiPs – Challenges in Packaging

Tina Thomas, Marius van Dijk, Marc Dreissigacker, Stefan Hoffmann, Hans Walter ...

International Symposium on Microelectronics (2019) 2019 (1): 000019–000026.

https://doi.org/10.4071/2380-4505-2019.1.000019

Published: 01 October 2019

View articletitled, Ferrites in Transfer Molded Power SiPs – Challenges in Packaging

Journal Articles

COMBINING ADVANTAGES OF RHEOMETRY AND INLINE VISCOMETRY FOR IMPROVED VISCOSITY MODELING

Jonas Strobelt, Joerg Bauer, Marc Dreissigacker, Ole Hoelck, Tanja Braun ...

International Symposium on Microelectronics (2019) 2019 (1): 000568–000572.

https://doi.org/10.4071/2380-4505-2019.1.000568

Published: 01 October 2019

View articletitled, COMBINING ADVANTAGES OF RHEOMETRY AND INLINE VISCOMETRY FOR IMPROVED VISCOSITY MODELING

Journal Articles

A numerical study on mitigation of flying dies in compression molding of microelectronic packages

Marc Dreissigacker, Ole Hoelck, Joerg Bauer, Tanja Braun, Karl-Friedrich Becker ...

International Symposium on Microelectronics (2018) 2018 (1): 000355–000360.

https://doi.org/10.4071/2380-4505-2018.1.000355

Published: 01 October 2018

View articletitled, A numerical study on mitigation of flying dies in compression molding of microelectronic packages