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Matthias Hunstig
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Journal Articles

Cell Interconnections in Battery Packs Using Laser-assisted Ultrasonic Wire Bonding

Open Access
Andreas Unger, Matthias Hunstig, Michael Brökelmann, Dirk Siepe, Hans J. Hesse
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2021) 2020 (1): 000217–000221.
https://doi.org/10.4071/2380-4505-2020.1.000217
Published: 13 January 2021
View article titled, Cell Interconnections in Battery Packs Using Laser-assisted Ultrasonic Wire Bonding
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Journal Articles

Process advantages of thermosonic wedge-wedge bonding using dosed tool heating

Open Access
Matthias Hunstig, Andreas Unger, Michael Brökelmann, Hans J. Hesse
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2019) 2019 (1): 000519–000523.
https://doi.org/10.4071/2380-4505-2019.1.000519
Published: 01 October 2019
View article titled, Process advantages of thermosonic wedge-wedge bonding using dosed tool heating
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Journal Articles

Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bonding

Open Access
Reinhard Schemmel, Florian Eacock, Collin Dymel, Tobias Hemsel, Matthias Hunstig ...
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2019) 2019 (1): 000509–000514.
https://doi.org/10.4071/2380-4505-2019.1.000509
Published: 01 October 2019
View article titled, Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bonding
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Journal Articles

Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges

Open Access
Andreas Unger, Matthias Hunstig, Tobias Meyer, Michael Brökelmann, Walter Sextro
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2018) 2018 (1): 000572–000577.
https://doi.org/10.4071/2380-4505-2018.1.000572
Published: 01 October 2018
View article titled, Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges
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Journal Articles

Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design

Open Access
Paul Eichwald, Simon Althoff, Reinhard Schemmel, Walter Sextro, Andreas Unger ...
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2017) 2017 (1): 000438–000443.
https://doi.org/10.4071/isom-2017-WP43_071
Published: 01 October 2017
View article titled, Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design
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Journal Articles

Experimental and Numerical Simulation Study of Pre-deformed Heavy Copper Wire Wedge Bonds

Open Access
Andreas Unger, Walter Sextro, Simon Althoff, Paul Eichwald, Tobias Meyer ...
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2014) 2014 (1): 000289–000294.
https://doi.org/10.4071/isom-TP44
Published: 01 October 2014
View article titled, Experimental and Numerical Simulation Study of Pre-deformed Heavy Copper Wire Wedge Bonds
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