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Journal Articles

High Temperature Storage Reliability of Bond Resistance of Palladium-Coated Copper Ball Bonds

Michael David Hook, Michael Mayer, Stevan Hunter

International Symposium on Microelectronics (2017) 2017 (1): 000432–000437.

https://doi.org/10.4071/isom-2017-WP42_135

Published: 01 October 2017

View articletitled, High Temperature Storage Reliability of Bond Resistance of Palladium-Coated Copper Ball Bonds

Journal Articles

Thermal Aging Behavior of Fine Pitch Palladium Coated Silver (PCS) Ball Bonds on Al Metallization

Di Erick Xu, Jimy Gomes, Michael Mayer, Rob Lyn, John Persic

International Symposium on Microelectronics (2015) 2015 (1): 000298–000304.

https://doi.org/10.4071/isom-2015-WA53

Published: 01 October 2015

View articletitled, Thermal Aging Behavior of Fine Pitch Palladium Coated Silver (PCS) Ball Bonds on Al Metallization

Journal Articles

Wire Bonding UPH and Stitch Bond Improvement using 20 Micron Diameter Insulated Wire with Security Bump

Chunyan Nan, Michael Mayer, Y. Norman Zhou, Jairus L. Pisigan, John Persic ...

International Symposium on Microelectronics (2010) 2010 (1): 000667–000674.

https://doi.org/10.4071/isom-2010-WP4-Paper4

Published: 01 January 2010

View articletitled, Wire Bonding UPH and Stitch Bond Improvement using 20 Micron Diameter Insulated Wire with Security Bump