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Muthappan Asokan
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Journal Articles

Explore High Bonding Reliability of Cu Wire Bonded Devices under Extreme Halide Contaminated Environments

Open Access
Muthappan Asokan, Joshua Caperton, Ashish Salunke, Oliver Chyan, Fei Xu
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2018) 2018 (1): 000655–000659.
https://doi.org/10.4071/2380-4505-2018.1.000655
Published: 01 October 2018
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Journal Articles

Aluminum bond pad corrosion of wirebond packages

Open Access
Varughese Mathew, Sheila Chopin, Oliver Chyan, Nick Ross, Alex Lambert ...
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2016) 2016 (1): 000227–000233.
https://doi.org/10.4071/isom-2016-WA53
Published: 01 October 2016
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