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Journal Articles

Silver oxalate: towards a new solder material for highly dissipative electronic assemblies

Open Access
K. Kiryukhina, H. Le Trong, P. Tailhades, J. Lacaze, M. Gougeon ...
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2013) 2013 (1): 000836–000841.
https://doi.org/10.4071/isom-2013-THP31
Published: 01 January 2013
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Journal Articles

Use of 3D Packaging Technology for Satellite Active Antennas Front-ends

Open Access
B. Bonnet, R. Chiniard, H. Legay, D. Nevo, P. Monfraix ...
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2012) 2012 (1): 000554–000560.
https://doi.org/10.4071/isom-2012-WA14
Published: 01 January 2012
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Journal Articles

New GaN Power-Electronics Packaging Solutions: A Thermal Analysis using Raman Thermography

Open Access
M. Faqir, A. Manoi, T. Mrotzek, S. Knippscheer, M. Massiot ...
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2010) 2010 (1): 000446–000449.
https://doi.org/10.4071/isom-2010-WA3-Paper3
Published: 01 January 2010
View article titled, New GaN Power-Electronics Packaging Solutions: A Thermal Analysis using Raman Thermography
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