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Rao Tummala
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Journal Articles

First Demonstration of Ultra-Thin Glass Panel Embedded (GPE) Package with Sheet Type Epoxy Molding Compound for 5G/mm-wave Applications

Open Access
Nobuo Ogura, Siddharth Ravichandran, Tailong Shi, Atom Watanabe, Shuhei Yamada ...
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2019) 2019 (1): 000202.
https://doi.org/10.4071/2380-4505-2019.1.000202
Published: 01 October 2019
View articletitled, First Demonstration of Ultra-Thin Glass Panel Embedded (GPE) Package with Sheet Type Epoxy Molding Compound for 5G/mm-wave Applications
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Journal Articles

Design and demonstration of Glass Panel Embedding for 3D System Packages for heterogeneous integration applications

Open Access
Siddharth Ravichandran, Shuhei Yamada, Tomonori Ogawa, Tailong Shi, Fuhan Liu ...
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2018) 2018 (1): 000331–000336.
https://doi.org/10.4071/2380-4505-2018.1.000331
Published: 01 October 2018
View articletitled, Design and demonstration of Glass Panel Embedding for 3D System Packages for heterogeneous integration applications
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Journal Articles

Demonstration of Embedded Cu Trench RDL using Panel Scale Lithography and Photosensitive Dry Film Polymer Dielectrics

Open Access
Venky Sundaram, Fuhan Liu, Chandra Nair, Rao Tummala, Atsushi Kubo ...
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2017) 2017 (1): 000689–000693.
https://doi.org/10.4071/isom-2017-THP13_159
Published: 01 October 2017
View articletitled, Demonstration of Embedded Cu Trench RDL using Panel Scale Lithography and Photosensitive Dry Film Polymer Dielectrics
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Journal Articles

Electrodeposited copper-graphite composites for low-CTE integrated thermal structures

Open Access
Shreya Dwarakanath, P. Markondeya Raj, Kaya Demir, Vanessa Smet, Venky Sundaram ...
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2016) 2016 (1): 000088–000093.
https://doi.org/10.4071/isom-2016-TP45
Published: 01 October 2016
View articletitled, Electrodeposited copper-graphite composites for low-CTE integrated thermal structures
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Journal Articles

Co-Design and Demonstration of a Fully Integrated Optical Transceiver Package Featuring Optical, Electrical, and Thermal Interconnects in Glass Substrate

Open Access
Bruce Chou, Brett Sawyer, William Vis, Ryuta Furuya, Fuhan Liu ...
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2016) 2016 (1): 000007–000012.
https://doi.org/10.4071/isom-2016-TP12
Published: 01 October 2016
View articletitled, Co-Design and Demonstration of a Fully Integrated Optical Transceiver Package Featuring Optical, Electrical, and Thermal Interconnects in Glass Substrate
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Journal Articles

Design and Demonstration of 40 micron Bump Pitch Multi-layer RDL on Panel-based Glass Interposers

Open Access
Brett Sawyer, Yuya Suzuki, Zihan Wu, Hao Lu, Venky Sundaram ...
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2015) 2015 (1): 000379–000385.
https://doi.org/10.4071/isom-2015-WP24
Published: 01 October 2015
View articletitled, Design and Demonstration of 40 micron Bump Pitch Multi-layer RDL on Panel-based Glass Interposers
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Journal Articles

High Reliability and High Performance 30μm Through-Package-Vias in Ultra-Thin Bare Glass Interposer

Open Access
Venky Sundaram, Jialing Tong, Kaya Demir, Timothy Huang, Aric Shorey ...
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2014) 2014 (1): 000402–000408.
https://doi.org/10.4071/isom-WA16
Published: 01 October 2014
View articletitled, High Reliability and High Performance 30μm Through-Package-Vias in Ultra-Thin Bare Glass Interposer
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Journal Articles

RF Device Integration on Glass Interposer toward 3D-IPAC Packages

Open Access
Yoichiro Sato, Bruce Chou, Vijay Sukumaran, Junki Min, Motoshi Ono ...
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2013) 2013 (1): 000825–000830.
https://doi.org/10.4071/isom-2013-THP22
Published: 01 January 2013
View articletitled, RF Device Integration on Glass Interposer toward 3D-IPAC Packages
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Journal Articles

Reliability Studies in Advanced Halogen-free Organic Laminates for Ultra-fine Pitch 3D Packaging

Open Access
Koushik Ramachandran, Fuhan Liu, Nitesh Kumbhat, Baik-Woo Lee, Venky Sundaram ...
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2010) 2010 (1): 000829–000835.
https://doi.org/10.4071/isom-2010-THA3-Paper1
Published: 01 January 2010
View articletitled, Reliability Studies in Advanced Halogen-free Organic Laminates for Ultra-fine Pitch 3D Packaging
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Journal Articles

Next Generation High Dk, Low Df Organic Laminate for RF Modules and High Frequency Applications

Open Access
Fuhan Liu, Vivek Sridharan, Tapobrata Bandyopadhyay, Venky Sundaram, Rao Tummala ...
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2010) 2010 (1): 000836–000841.
https://doi.org/10.4071/isom-2010-THA3-Paper2
Published: 01 January 2010
View articletitled, Next Generation High Dk, Low Df Organic Laminate for RF Modules and High Frequency Applications
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Journal Articles

Chip-last Embedded Actives and Passives in Ultra-Miniaturized Organic Packages with Chip-First Benefits

Open Access
Nitesh Kumbhat, Fuhan Liu, Venky Sundaram, Vivek Sridharan, Abhishek Choudhury ...
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2010) 2010 (1): 000537–000542.
https://doi.org/10.4071/isom-2010-WP1-Paper1
Published: 01 January 2010
View articletitled, Chip-last Embedded Actives and Passives in Ultra-Miniaturized Organic Packages with Chip-First Benefits
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