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Ricky Lee
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Journal Articles
International Symposium on Microelectronics (2018) 2018 (1): 000224–000232.
Published: 01 October 2018
Journal Articles
Design, Materials, Process, and Fabrication of Fan-Out Panel-Level Heterogeneous Integration
Open Access
International Symposium on Microelectronics (2018) 2018 (1): 000057–000063.
Published: 01 October 2018
Journal Articles
Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution-Layers (RDLs)
Open Access
International Symposium on Microelectronics (2017) 2017 (1): 000576–000583.
Published: 01 October 2017
Journal Articles
International Symposium on Microelectronics (2012) 2012 (1): 000548–000553.
Published: 01 January 2012
Journal Articles
Nanoindentation Characterization of Lead-free Solders and Intermetallic Compounds under Thermal Aging
Open Access
International Symposium on Microelectronics (2010) 2010 (1): 000314–000318.
Published: 01 January 2010