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Journal Articles

Improvement of ELK Reliability in Flip Chip Packages using Bond-on-Lead (BOL) Interconnect Structure

Eric Ouyang, MyoungSu Chae, Seng Guan Chow, Roger Emigh, Mukul Joshi ...
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2010) 2010 (1): 000197–000203.
https://doi.org/10.4071/isom-2010-TP2-Paper1
Published: 01 January 2010
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