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Journal Articles

High Yield, Near Void-Free Assembly Process of a Flip Chip in Package Using No-Flow Underfill

Open Access
Sangil Lee, Ph.D., Daniel F. Baldwin, Ph.D.
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2010) 2010 (1): 000798–000805.
https://doi.org/10.4071/isom-2010-THA2-Paper3
Published: 01 January 2010
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