1-2 of 2
Weidong Xie
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Impact of isothermal aging on fine pitch BGA packages with Sn-Ag-Cu solder interconnects

Open Access
Tae-Kyu Lee, Weidong Xie, Thomas R. Bieler, Kuo-Chuan Liu, Jie Xue
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2010) 2010 (1): 000298–000305.
https://doi.org/10.4071/isom-2010-TP4-Paper3
Published: 01 January 2010
View articletitled, Impact of isothermal aging on fine pitch BGA packages with Sn-Ag-Cu solder interconnects
Open the PDF for Impact of isothermal aging on fine pitch BGA packages with Sn-Ag-Cu solder interconnects in another window
Journal Articles

Investigation on the failure criterion of reliability testing for Pb-free BGA packages

Open Access
Weidong Xie, Tae-Kyu Lee, Kuo-Chuan Liu, Jie Xue
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2010) 2010 (1): 000105–000109.
https://doi.org/10.4071/isom-2010-TA4-Paper1
Published: 01 January 2010
View articletitled, Investigation on the failure criterion of reliability testing for Pb-free BGA packages
Open the PDF for Investigation on the failure criterion of reliability testing for Pb-free BGA packages in another window