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    Journal Articles

    Chip Package Interaction: Understanding of Contributing Factors in Back End of Line (BEoL) Silicon, Cu Pillar Design and Applied Process Improvements

    Frank Kuechenmeister, Dirk Breuer, Holm Geisler, Bjoern Boehme, Kashi Vishwanath Machani ...
    Journal: International Symposium on Microelectronics
    International Symposium on Microelectronics (2018) 2018 (1): 000173–000179.
    https://doi.org/10.4071/2380-4505-2018.1.000173
    Published: 01 October 2018
    Abstract
    View articletitled, Chip Package Interaction: Understanding of Contributing Factors in Back End of Line (BEoL) Silicon, Cu Pillar Design and Applied Process Improvements
    Open the PDF for Chip Package Interaction: Understanding of Contributing Factors in Back End of Line (BEoL) Silicon, Cu Pillar Design and Applied Process Improvements in another window

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    • eISSN 2380-4505
    • ISSN 1085-8024
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