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Journal Articles

Evaluation of Reliability of Lead-free Solders in Silver-free Hybrids

Open Access
Zhenzhen Shen, Aleksey Reiderman
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2019) 2019 (1): 000056–000062.
https://doi.org/10.4071/2380-4505-2019.1.000056
Published: 01 October 2019
View article titled, Evaluation of Reliability of Lead-free Solders in Silver-free Hybrids
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Journal Articles

Additive Manufacturing for Multi-chip Modules

Open Access
Zhenzhen Shen, Aleksey Reiderman
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2018) 2018 (1): 000760–000766.
https://doi.org/10.4071/2380-4505-2018.1.000760
Published: 01 October 2018
View article titled, Additive Manufacturing for Multi-chip Modules
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Journal Articles

High-Temperature Reliability of Wire Bonds on Thick Film

Open Access
Zhenzhen Shen, Aleksey Reiderman
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2017) 2017 (1): 000531–000535.
https://doi.org/10.4071/isom-2017-THA23_086
Published: 01 October 2017
View article titled, High-Temperature Reliability of Wire Bonds on Thick Film
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Journal Articles

Modeling Vibration Induced Fatigue Failure of Free Standing Wire Bonds

Open Access
Zhenzhen Shen, James Storey, Otto Fanini, Michael Osterman
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2017) 2017 (1): 000635–000640.
https://doi.org/10.4071/isom-2017-THA55_087
Published: 01 October 2017
View article titled, Modeling Vibration Induced Fatigue Failure of Free Standing Wire Bonds
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Journal Articles

Effect of Vapor-Deposited Parylene Coating on Reliability of Sintered Silver Joints for Extreme Temperature Applications

Open Access
Zhenzhen Shen, Aleksey Reiderman
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2016) 2016 (1): 000338–000344.
https://doi.org/10.4071/isom-2016-WP44
Published: 01 October 2016
View article titled, Effect of Vapor-Deposited Parylene Coating on Reliability of Sintered Silver Joints for Extreme Temperature Applications
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Journal Articles

Pressure-less AgNP Sintering for High-power MCM Assembly for Extreme Environment Applications

Open Access
Zhenzhen Shen, Aleksey Reiderman, Casey Anude
Journal: International Symposium on Microelectronics
International Symposium on Microelectronics (2015) 2015 (1): 000342–000348.
https://doi.org/10.4071/isom-2015-WP14
Published: 01 October 2015
View article titled, Pressure-less AgNP Sintering for High-power MCM Assembly for Extreme Environment Applications
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