This is a study of the low cycle fatigue of chip carrier/ printed wiring board joints tested at -55° C (-67° F) and 125° C (257° F). It is contrasted to a previous study where the joints were tested at 35° C (95° F). The behavior at 35° C and 125° C was the same. Differences were noted, however, at -55° C. The hysteresis loops were distorted. The slopes of the displacement vs. fatigue life curves were slightly lower and the fatigue lives were longer. These differences were especially significant when the change in joint resistance was used to define failure.

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