This paper presents a practical approach for assessing electronic circuit cards for mechanical shock loading. The approach is comprised of three areas: determining board response, assessing damage to the printed wiring boards, and assessing damage to the components. Determining the board response to the shock loading provides the basis for the damage assessments. To determine board response, the approach recommends specific structures to model and finite element analysis (FEA) methods to use. Failure models for circuit board and component failures are provided in terms of failure risk. To demonstrate this practical assessment approach, an example of a US Army circuit card from a computer assembly mounted on a tracked vehicle is provided. This practical assessment approach will allow electronic circuit card designers to quickly evaluate circuit cards with minimal testing and FEA. It also provides information necessary for circuit card redesign to improve failure risk for shock loading.

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