This study presents a physics-of-failure-based virtual remaining life assessment method for assessing the remaining life of an electronic circuit card. The approach is then demonstrated through a case study of a circuit card assembly in the Space Shuttle solid rocket booster. Using thermal and mechanical stress damage models, the accumulated damage in the circuit card due to the life cycle environment loads on the card was calculated. Based on the amount of damage accumulated, the remaining life of the circuit card was estimated.

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