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Current Issue
Volume 17,
Issue 2
1 April 2020

Editor

Jianbiao John Pan, Ph.D., CQE, CRE

ISSN: 1551-4897

About this Journal

The Journal of Microelectronics and Electronic Packaging is published quarterly by the International Microelectronics And Packaging Society (IMAPS). The technical content of the articles is the sole responsibility of the authors and the articles do not necessarily reflect the views of the editors or the publisher....Read More About the Journal

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