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Editor
Jianbiao John Pan, Ph.D., CQE, CRE
ISSN: 1551-4897
About this Journal
The Journal of Microelectronics and Electronic Packaging is published quarterly by the International Microelectronics And Packaging Society (IMAPS). The technical content of the articles is the sole responsibility of the authors and the articles do not necessarily reflect the views of the editors or the publisher....Read More About the Journal
Silver Sintering of Packaged GaN-Devices on Printed Circuit Board
Jonas Müller, Sebastian A. Letz, Flaviu-Bogdan Simon, Christoph F. Bayer, Andreas Schletz, Jens Görlich, Takatoshi Nishimura
Heterogeneous Integration on 2.3D Hybrid Substrate Using Solder Joint and Underfill
Ricky Tsun-Sheng Chou, John H. Lau, Gary Chang-Fu Chen, Jones Yu-Cheng Huang, Channing Cheng-Lin Yang, Hsing-Ning Liu, Tzyy-Jang Tseng
A New Approach for Assessing the Reliability of Electronic Assemblies Using Fuzzy Logic for Multi-criteria Optimization
Raed Al Athamneh, Francy Akkara, Sa'd Hamasha
A High Temperature SOI-CMOS Chipset Focusing Sensor Electronics for Operating Temperatures up to 300°C
Holger Kappert, Sebastian Braun, Norbert Kordas, Andre Kosfeld, Alexander Utz, Constanze Weber, Olaf Rämer, Malte Spanier, Martin Ihle, Steffen Ziesche, Rainer Kokozinski
Finite Element Modeling of Rigid-Flex PCBs for Dynamic Environments
John Bell, Laura Redmond, Kalind Carpenter, Jean-Pierre de la Croix
Open Access Articles