Some assembly approaches which were carried out with silicon gas sensor and silicon humidity sensor are presented and described in this paper. Some of these sensors were based on silicon 3-D structures with so called “backside contacts” which need special assembly solutions. Flip chip solder and adhesive bonding were used for silicon humidity sensor. Experimental specifications concerning applied assembly solutions and obtained results are presented and described.

backside contacts, flip chip bonding, silicon sensors, underfilling
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© 2005 International Microelectronics Assembly and Packaging Society Collection
2005