Quilt packaging (QP) is a novel high-speed super-connect (i.e., direct interchip interconnect), developed to improve electrical performance—signal delay, power loss, and so on. Ultrahigh bandwidth has already been demonstrated for QP, but its unique structure requires thermal reliability issues to be studied. To this end, simulation models were developed to study the robustness of QP. QP structures were fabricated, and thermal cycling tests were performed focusing on the reliability for various shapes of nodules, the basic physical interconnect unit of QP. Simulations were performed to determine stress over a range of temperatures and estimate low cycle fatigue lifetimes. Simulations considered two types of solder and several adhesives. Thermal cycling experiments indicate that QP provides a robust structure, in agreement with the simulation results.

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Author notes

1Department of Electrical Engineering, University of Notre Dame, Notre Dame, Indiana 46556

2Indiana Integrated Circuits, LLC, South Bend, Indiana 46617