Hot-plate LTCC gas sensors combine advantages of silicon structures (low power consumption) and typical ceramics gas sensors (stability and reliability). Such elements can be integrated in MEMS packages as well as in ceramic sensor arrays. Moreover, they can be produced in small series with relatively low cost. One important key in hot-plate design are properly formed beams. This paper presents possibilities and problems related to laser forming of LTCC ceramics for hot-plate gas sensors. Influence of beam width on power consumption and temperature distribution is discussed. Possibilities to achieve beam width as narrow as possible are practically tested by laser cutting. Obtained results are very promising for future work and for possible application of LTCC ceramics in such type of gas sensors.
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January 01 2005
Laser forming of LTCC Ceramics for Hot-Plate Gas Sensors Open Access
Jaroslaw Kita;
Jaroslaw Kita
*
1University of Bayreuth, Chair of Functional Materials, Universitätsstr. 30, D-95440 Bayreuth, Germany, Phone +49 921 7401, Fax +49 921 7405, email:[email protected]
*-Corresponding author
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Frank Rettig;
Frank Rettig
1University of Bayreuth, Chair of Functional Materials, Universitätsstr. 30, D-95440 Bayreuth, Germany, Phone +49 921 7401, Fax +49 921 7405, email:[email protected]
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Ralf Moos;
Ralf Moos
1University of Bayreuth, Chair of Functional Materials, Universitätsstr. 30, D-95440 Bayreuth, Germany, Phone +49 921 7401, Fax +49 921 7405, email:[email protected]
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Karl-Heinz Drüe;
Karl-Heinz Drüe
2 Technical University of Ilmenau, Microperipheric Group, Max-Planck-Ring 14, D-98693 Ilmenau, Germany, Phone: +49 3677 69 26 04, Fax +49 69 12 04
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Heiko Thust
Heiko Thust
2 Technical University of Ilmenau, Microperipheric Group, Max-Planck-Ring 14, D-98693 Ilmenau, Germany, Phone: +49 3677 69 26 04, Fax +49 69 12 04
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Journal of Microelectronics and Electronic Packaging (2005) 2 (1): 14–18.
Citation
Jaroslaw Kita, Frank Rettig, Ralf Moos, Karl-Heinz Drüe, Heiko Thust; Laser forming of LTCC Ceramics for Hot-Plate Gas Sensors. Journal of Microelectronics and Electronic Packaging 1 January 2005; 2 (1): 14–18. doi: https://doi.org/10.4071/1551-4897-2.1.14
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