Laser trimming is the most effective and popular trimming method of thick-film and LTCC resistors at present. It is also still a subject of continuing theoretical and experimental analysis and optimization. Very recently a new approach to this process was suggested. It consists in replacing two-contact bar resistors by three-contact distributed structures trimmed by narrow cuts just around additional contact of different shape [1,2]. This paper presents experimental verification of such an approach. The relative trim characteristic and sensitivity are analyzed as a function of additional contact shape and cut length. Next long-term stability, pulse durability and low frequency noise are compared for two- and three-contact resistors versus trim pathway length. These investigations are completed by simulation of electrical potential distribution in two- and three-contact resistors with various length of trimming kerf.
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Research Article|
January 01 2005
New Trim Configurations for Laser Trimmed Thick-Film Resistors – Experimental Verification
Slawomir Kaminski;
Slawomir Kaminski
*
Faculty of Microsystem Electronics and Photonics, Wroclaw University of Technology, Wybrzeze Wyspianskiego 27, 50-370 Wroclaw, Poland, +48-71-355 48 22,Andrzej.Dziedzic@pwr.wroc.pl,slawomirkaminski@tlen.pl
Wroclaw University of Technology, Faculty of Microsystem Electronics and Photonics, Wybrzeze Wyspianskiego 27, 50-370 Wroclaw, Poland, (emails:slawomirkaminski@tlen.pl,edward.mis@pwr.wroc.pl,maciej_sz@poczta.fm,andrzej.dziedzic@pwr.wroc.pl)
*-Corresponding author
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Edward Mis;
Edward Mis
Faculty of Microsystem Electronics and Photonics, Wroclaw University of Technology, Wybrzeze Wyspianskiego 27, 50-370 Wroclaw, Poland, +48-71-355 48 22,Andrzej.Dziedzic@pwr.wroc.pl,slawomirkaminski@tlen.pl
Wroclaw University of Technology, Faculty of Microsystem Electronics and Photonics, Wybrzeze Wyspianskiego 27, 50-370 Wroclaw, Poland, (emails:slawomirkaminski@tlen.pl,edward.mis@pwr.wroc.pl,maciej_sz@poczta.fm,andrzej.dziedzic@pwr.wroc.pl)
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Maciej Szymendera;
Maciej Szymendera
Faculty of Microsystem Electronics and Photonics, Wroclaw University of Technology, Wybrzeze Wyspianskiego 27, 50-370 Wroclaw, Poland, +48-71-355 48 22,Andrzej.Dziedzic@pwr.wroc.pl,slawomirkaminski@tlen.pl
Wroclaw University of Technology, Faculty of Microsystem Electronics and Photonics, Wybrzeze Wyspianskiego 27, 50-370 Wroclaw, Poland, (emails:slawomirkaminski@tlen.pl,edward.mis@pwr.wroc.pl,maciej_sz@poczta.fm,andrzej.dziedzic@pwr.wroc.pl)
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Andrzej Dziedzic
Andrzej Dziedzic
Faculty of Microsystem Electronics and Photonics, Wroclaw University of Technology, Wybrzeze Wyspianskiego 27, 50-370 Wroclaw, Poland, +48-71-355 48 22,Andrzej.Dziedzic@pwr.wroc.pl,slawomirkaminski@tlen.pl
Wroclaw University of Technology, Faculty of Microsystem Electronics and Photonics, Wybrzeze Wyspianskiego 27, 50-370 Wroclaw, Poland, (emails:slawomirkaminski@tlen.pl,edward.mis@pwr.wroc.pl,maciej_sz@poczta.fm,andrzej.dziedzic@pwr.wroc.pl)
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Journal of Microelectronics and Electronic Packaging (2005) 2 (1): 19–24.
Citation
Slawomir Kaminski, Edward Mis, Maciej Szymendera, Andrzej Dziedzic; New Trim Configurations for Laser Trimmed Thick-Film Resistors – Experimental Verification. Journal of Microelectronics and Electronic Packaging 1 January 2005; 2 (1): 19–24. doi: https://doi.org/10.4071/1551-4897-2.1.19
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