Modified-Amine Cured Epoxy Formulation For The Encapsulation Of Electronic Circuits Open Access

The chemical modification of a polyalkylene-polyamine by reaction with phenol and formaldehyde allowed the obtainment of a series of curing agents tailored for an epoxy formulation suitable for the “conformal coating” of electronic assemblies. The mechanical, physical and above all electrical properties and durability of the coatings were measured; the presence of inorganic fillers (quartz and mica) into the formulation was also experimented with satisfactory results.