A critical literature review on the determination of thermal resistance in a package is presented. Finite element simulation of three types of packages, namely, Leadless Chip Carrier (LCC), Bump Chip Carrier (BCC) and Plastic Ball Grid Array (PBGA) as representative of the packages used in the electronic industry, is carried out both at package level and board level separately. Based on the results obtained from 204 simulations, a new methodology of determining the junction temperature even in cases where the specification of the board is not known a priori is developed. The prediction of the junction temperature from the new methodology agrees well with the results of the package and the board simulated simultaneously. The junction temperature obtained by simulation agrees well with experimental data or literature value. A methodology is presented to transform the results for a JEDEC standard board to a non-JEDEC standard board. The coefficient of performance of a non-JEDEC standard board has been introduced and evaluated. The effect of junction temperature in a given package on the reliability has been investigated. Some cases where components failed due to temperature effect are presented.
Author notes
King-Long Teoh received his degree in Material Engineering in 1996 and Master degree in Mechanical Engineering (thermal management) in 2002 from University Science of Malaysia (USM). He started his carrer in 1996 with Hewlett-Packard Malaysia as Failure Analysis (FA) engineer working on wide range of LEDs products. He is currently working as a FA specialist engineer in Agilent Technologies Malaysia focusing primary on various types packaging and ICs related failure analysis for RF and microwave Monolithic Microwave Integrated Circuit (MMIC) devices and power modules. His research interests include interconnect and packaging technologies of microwave devices and advanced failure analysis techniques development. King Long has authored and co-authored several published papers on thermomechanical analysis of electronic packages and failure analysis techniques in conference proceedings.
Prof K.N Seetharamu graduated from Mysore University in Mechanical Engineering in the year 1960. He obtained his Masters Degree in Power Engineering in the year 1962 from Indian Institute of Science, Bangalore, India. He obtained his doctoral degree in 1973 in the field of heat transfer from Indian Institute of Technology, Madras, India.
He joined Indian Institute of Technology, Madras in the year 1968 as a lecturer and rose to the level of Professor in the year 1980. He worked as Professor of Mechanical Engineering at IIT, Madras for almost three decades before joining USM, Malaysia on invitation. He has supervised 25 students for Ph.D Degree and 31 students for Masters Degree by research. Currently he is supervising about 20 students in the area of Electronic Packaging.
He has published more than 300 papers in International Journals and conferences. He has authored and co-authored two books on FEM and one book on Engineering Fluid Mechanics. He has also contributed a chapter on thermal management in the book “Fundamentals of Microsystems Packaging” edited by Rao Tummala and published by McGraw-Hill in 2001. He has carried out many national and international collaborative projects. He has established IMAPS Malaysia Chapter in the year 1998 and IEEE-CPMT Malaysia Chapter in the year 2000 and continues to be active in this area. He is also active in offering continuing education programs to multi-national companies like Agilent, Intel, AMD etc. on the applications of Finite Element Method to electronic packaging as well as Thermal Management in Electronic Systems. Marquis book “Who is who in the world” makes a reference to Professor K. N. Seetharamu.
A. Y. Hassan, is a Professor in the School of Mechanical Engineering and Chief Information Officer in University of Science (USM), Malaysia. Formerly he was Dean of the School of Mechanical Engineering and Director of the USM Engineering Campus. He received his Bachelor's degree in 1980 and a Ph. D. degree in 1990 from Liverpool University, U.K. He is currently engaged in the Thermo-mechanical analysis of electronic packages, product development, CNC machines in addition to CAD/CAM activities. He also started work in the field of Biomechanics. He has published many papers in the above areas. He is the president of IMAPS-Malaysia chapter and also a member of IEEE, CPMT Malaysia chapter.
