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Journal of Microelectronics and Electronic Packaging
International Symposium on Microelectronics
Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT)
Advancing Microelectronics
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Journal of Microelectronics and Electronic Packaging
International Symposium on Microelectronics
Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT)
Advancing Microelectronics
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New Trim Configurations for Laser Trimmed Thick-Film Resistors – Experimental Verification
Journal of Microelectronics and Electronic Packaging
(2005) 2 (1): 19–24.
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