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Six-Side Molded Panel-Level Chip-Scale Package with Multiple Diced Wafers
John H. Lau, Cheng-Ta Ko, Tzvy-Jang Tseng, Chia-Yu Peng, Kai-Ming Yang, Tim Xia, Puru Bruce Lin, Eagle Lin, Leo Chang, Hsing Ning Liu, Curry Lin, David Cheng, Winnie Lu
Optimization of PCB SI Coupon Design That Minimizes Discontinuity Through via-in-Pad Plated over (VIPPO) Technique
Juhee Lee, Kyeongsoo Kim, Simon Kim, Kiseop Kim, Kyungsoo Lee
High-Temperature Double-Layer Ceramic Packaging Substrates
Ardalan Nasiri, Simon S. Ang
Chip-Last (RDL-First) Fan-Out Panel-Level Packaging (FOPLP) for Heterogeneous Integration
John H. Lau, Cheng-Ta Ko, Chia-Yu Peng, Kai-Ming Yang, Tim Xia, Puru Bruce Lin, Jean-Jou Chen, Po-Chun Huang, Tzvy-Jang Tseng, Eagle Lin, Leo Chang, Curry Lin, Winnie Lu
