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Silver Sintering of Packaged GaN-Devices on Printed Circuit Board
Jonas Müller, Sebastian A. Letz, Flaviu-Bogdan Simon, Christoph F. Bayer, Andreas Schletz, Jens Görlich, Takatoshi Nishimura
Heterogeneous Integration on 2.3D Hybrid Substrate Using Solder Joint and Underfill
Ricky Tsun-Sheng Chou, John H. Lau, Gary Chang-Fu Chen, Jones Yu-Cheng Huang, Channing Cheng-Lin Yang, Hsing-Ning Liu, Tzyy-Jang Tseng
A New Approach for Assessing the Reliability of Electronic Assemblies Using Fuzzy Logic for Multi-criteria Optimization
Raed Al Athamneh, Francy Akkara, Sa'd Hamasha
A High Temperature SOI-CMOS Chipset Focusing Sensor Electronics for Operating Temperatures up to 300°C
Holger Kappert, Sebastian Braun, Norbert Kordas, Andre Kosfeld, Alexander Utz, Constanze Weber, Olaf Rämer, Malte Spanier, Martin Ihle, Steffen Ziesche, Rainer Kokozinski
Finite Element Modeling of Rigid-Flex PCBs for Dynamic Environments
John Bell, Laura Redmond, Kalind Carpenter, Jean-Pierre de la Croix