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Silver Sintering of Packaged GaN-Devices on Printed Circuit Board
Jonas Müller<span class='al-author-delim'>, </span>Sebastian A. Letz<span class='al-author-delim'>, </span>Flaviu-Bogdan Simon<span class='al-author-delim'>, </span>Christoph F. Bayer<span class='al-author-delim'>, </span>Andreas Schletz<span class='al-author-delim'>, </span>Jens Görlich<span class='al-author-delim'>, </span>Takatoshi Nishimura
Heterogeneous Integration on 2.3D Hybrid Substrate Using Solder Joint and Underfill
Ricky Tsun-Sheng Chou<span class='al-author-delim'>, </span>John H. Lau<span class='al-author-delim'>, </span>Gary Chang-Fu Chen<span class='al-author-delim'>, </span>Jones Yu-Cheng Huang<span class='al-author-delim'>, </span>Channing Cheng-Lin Yang<span class='al-author-delim'>, </span>Hsing-Ning Liu<span class='al-author-delim'>, </span>Tzyy-Jang Tseng
A New Approach for Assessing the Reliability of Electronic Assemblies Using Fuzzy Logic for Multi-criteria Optimization
Raed Al Athamneh<span class='al-author-delim'>, </span>Francy Akkara<span class='al-author-delim'>, </span>Sa'd Hamasha
A High Temperature SOI-CMOS Chipset Focusing Sensor Electronics for Operating Temperatures up to 300°C
Holger Kappert<span class='al-author-delim'>, </span>Sebastian Braun<span class='al-author-delim'>, </span>Norbert Kordas<span class='al-author-delim'>, </span>Andre Kosfeld<span class='al-author-delim'>, </span>Alexander Utz<span class='al-author-delim'>, </span>Constanze Weber<span class='al-author-delim'>, </span>Olaf Rämer<span class='al-author-delim'>, </span>Malte Spanier<span class='al-author-delim'>, </span>Martin Ihle<span class='al-author-delim'>, </span>Steffen Ziesche<span class='al-author-delim'>, </span>Rainer Kokozinski
Finite Element Modeling of Rigid-Flex PCBs for Dynamic Environments
John Bell<span class='al-author-delim'>, </span>Laura Redmond<span class='al-author-delim'>, </span>Kalind Carpenter<span class='al-author-delim'>, </span>Jean-Pierre de la Croix
