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Feasibility Study of a 3D IC Integration System-in-Packaging (SiP) from a 300 mm Multi-Project Wafer (MPW)
J. H. Lau; C.-J. Zhan; P.-J. Tzeng; C.-K. Lee; M.-J. Dai; H.-C. Chien; Y.-L. Chao; W. Li; S.-T. Wu; J.-F. Hung; R.-M. Tain; C.-H. Lin; Y.-C. Hsin; C.-C. Chen; S.-C. Chen; C.-Y. Wu; J.-C. Chen; C.-H. Chien; C.-W. Chiang; H.-H. Chang; W.-L. Tsai; R.-S. Cheng; S.-Y. Huang; Y.-M. Lin; T.-C. Chang; C.-D. Ko; T.-H. Chen; S.-S. Sheu; S.-H. Wu; Y.-H. Chen
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Silver Sintering of Packaged GaN-Devices on Printed Circuit Board
Jonas Müller, Sebastian A. Letz, Flaviu-Bogdan Simon, Christoph F. Bayer, Andreas Schletz, Jens Görlich, Takatoshi Nishimura
Heterogeneous Integration on 2.3D Hybrid Substrate Using Solder Joint and Underfill
Ricky Tsun-Sheng Chou, John H. Lau, Gary Chang-Fu Chen, Jones Yu-Cheng Huang, Channing Cheng-Lin Yang, Hsing-Ning Liu, Tzyy-Jang Tseng
A New Approach for Assessing the Reliability of Electronic Assemblies Using Fuzzy Logic for Multi-criteria Optimization
Raed Al Athamneh, Francy Akkara, Sa'd Hamasha
A High Temperature SOI-CMOS Chipset Focusing Sensor Electronics for Operating Temperatures up to 300°C
Holger Kappert, Sebastian Braun, Norbert Kordas, Andre Kosfeld, Alexander Utz, Constanze Weber, Olaf Rämer, Malte Spanier, Martin Ihle, Steffen Ziesche, Rainer Kokozinski
Finite Element Modeling of Rigid-Flex PCBs for Dynamic Environments
John Bell, Laura Redmond, Kalind Carpenter, Jean-Pierre de la Croix